Soitec to expand its manufacturing footprint in France
Soitec is looking to expand its manufacturing footprint in Bernin, France to be ready to produce high volume SiC semiconductor wafers for electric vehicles and industrial markets and increase its SOI capabilities.
The designer and producer of semiconductor materials says that it is planning a new fabrication facility at its headquarters in Bernin, France – which will primarily be used to manufacture new SiC wafers as the company aims to respond to key challenges of the electric vehicle and industrial markets. The extension will also support Soitec’s 300-mm Silicon-on-Insulator (SOI) activities, a press release reads.
The company says that the factory will produce SmartSiC engineered wafers developed by Soitec at the Substrate Innovation Center located at CEA-Leti in Grenoble, using Soitec’s proprietary SmartCut technology. Chips built on this type of wafers are aid to offer performance and energy efficiency gains to power supply systems.
With its SmartSiC products, Soitec says that it is engaged with major silicon carbide device makers – without specifying who –and targets to generate first revenues in the second half of calendar year 2023.
”We expect that by 2030, around 40% of all new cars will be electric. Our unique, highly performant, sustainable and cost competitive SmartSiC solution addresses the industrial challenges, helps to optimize energy efficiency, and will accelerate the adoption of electric vehicles,” says Paul Boudre, Soitec CEO, in the press release. ”This investment is a major milestone for us as SmartSiC is set to be another growth engine for Soitec, and a driver of the transformation of the automotive and industrial markets.”
