Evertiq - First In Electronics News & Expo

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Robotics

June 12, 2026
German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.

motherboard-Germany

June 12, 2026
From AI-driven production planning and advanced PCB manufacturing to supply chain resilience and Europe's industrial competitiveness, Evertiq Expo Berlin 2026 will bring together experts from across the electronics industry to discuss some of the sector's most pressing challenges. Ahead of the event on 18 June, we take a closer look at this year's conference programme.

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Singapore_facility

June 12, 2026
The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.

Malaysia_facility

June 12, 2026
The Penang facility spans 60,000 square feet and houses 12 production lines, providing a monthly production capacity of upto 300,000 units. It operates as an OEM manufacturing base for industrial electronics, environmental control and electronics power modules.

robotics

June 11, 2026
The collaboration will bring together Nvidia’s full-stack accelerated computing platforms with Doosan Group’s capabilities in industrial automation, power generation and advanced electronics materials to support next-generation AI infrastructure.

New-Mechanics-Building-Zandt-2026

June 10, 2026
German EMS provider Zollner Elektronik AG has commissioned a new mechanics building at its main site in Zandt, Germany, expanding production capacity and adding capabilities in defence and high-precision manufacturing.

Mira-Grunhaupt

June 10, 2026
Despite increasing production complexity, many electronics manufacturers still rely on spreadsheets and manual coordination to plan their operations. Speaking to Evertiq ahead of her presentation at Evertiq Expo Berlin 2026, Mira Grünhaupt, Head of Solution Advisory at PAILOT GmbH, explains why advanced scheduling remains a challenge — and how AI-driven planning is helping factories become more flexible, responsive and competitive.

Freudenstadt

June 10, 2026
German electronics equipment manufacturer SCHMID Group has signed a letter of intent with local authorities in Zhongshan, Guangdong Province, to establish a new manufacturing campus in the Banfu Industrial Zone. The total investment is expected to be approximately EUR 11 million.

DGQA_MOU

June 10, 2026
The proposed agreement aims at the timely supply of electronic fuzes as per stipulated specifications and quality standards to undertake proof firing and evaluation or trials of weapons and ammunition being procured by the Indian Army.

PCB-USA_1

June 09, 2026
San Francisco-based deep tech startup Itera’s patented technology uses a novel architecture of glass and liquid metal, allowing circuit rewiring in less than a minute.

LG_AI_factory

June 09, 2026
The collaboration brings together Nvidia’s full-stack, end-to-end AI factory platform with LG Group’s global expertise in consumer electronics, robotics, mobility components, smart spaces and data center technologies.

Samsung_chip_design

June 09, 2026
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

Samueli_semiconductor_hub

June 08, 2026
The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.

3dIC

June 05, 2026
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.

Kaston-investment

June 04, 2026
Less than eight months after acquiring Kasdon Group, NOTE has completed an investment programme at the Wolverhampton facility. The production area has been extended by 650 square metres, and the site now operates under the name NOTE Wolverhampton.

buildings-flag

June 04, 2026
Samsung Electronics is relocating its US headquarters from Englewood, New Jersey, to its existing campus in Plano, Texas, the company confirmed on Tuesday, NBC DFW reports. The transition is expected to be completed by the end of the year.

AutoComp_Jahwa_Electronics

June 04, 2026
The partnership brings together Jahwa Electronics’ Korean engineering expertise and Tata AutoComp’s manufacturing ecosystem in India. The companies will manufacture low and high voltage PTC heaters critical for thermal management in electric and hybrid vehicles.

pcb

June 03, 2026
The war in the Middle East has disrupted supplies of raw materials used in PCBs and pushed prices sharply higher, compounding cost pressures that were already building across the electronics industry, according to industry sources and executives cited by Reuters.

Moritz-Floder

June 03, 2026
Electronics manufacturers have more access to production data than ever before. Yet despite growing investments in digitalisation, many companies still struggle to achieve complete visibility across their production environments.

Houston-production

June 03, 2026
Total North American EMS shipments in April 2026 were up 3.1% compared to the same month last year, reports the Global Electronics Association.

Liftlogic-new-smt-line

June 02, 2026
Swedish electronics manufacturer Liftlogic has, via Danish equipment supplier CORE-emt, invested in a new Yamaha YCP10 solder printer and Yamaha YSi-V AOI solution, extending an existing Yamaha platform and strengthening quality and flexibility in its SMT production.

NEXTY

June 01, 2026
NEXTY has been a pivotal partner for Eatron since its early Japan market entry, providing the strategic insight and technical support needed to navigate the automotive and industrial sectors.

PCB-India_2

June 01, 2026
The facility in the Indian state of Odisha will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies, with Intel supporting technology know-how and process expertise.

in4ma-interview-zurich

June 01, 2026
Following his keynote at Evertiq Expo Zürich, in4ma founder and analyst Dieter Weiss had an interview with Evertiq to discuss the numbers behind global EMS growth in 2025 – and what they reveal about where the European industry stands.

HBM4E

June 01, 2026
Samsung’s HBM4E delivers a stable pin speed of 14 gigabits-per-second (Gbps), with performance scalable up to 16Gbps to support increasingly intensive data processing requirements. This represents more than a 20% increase over its HBM4.

Riku-Hynninen

May 29, 2026
EMS companies have been recently publishing mainly positive headlines related to growth and improving profitability. Even the most struggling companies, Lacroix and TT Electronics, are indicating a comeback after serious restructuring in the Americas region. This is very welcome news for the industry after all the recent crises impacting demand and supply chain.

Domar-2026

May 28, 2026
Czechoslovak Group (CSG) has signed a preliminary agreement to acquire DOMAR MS, a Warsaw-based manufacturer of cable harnesses, cabling, electrical boxes and specialised connectors for the defence sector. The transaction is CSG's first acquisition in Poland.

Bloomington-Minnesota-manufacturing-facility

May 28, 2026
Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.

Zirconn-2026

May 28, 2026
Zirconn is expanding its manufacturing capabilities in China. The company has launched a new SMT assembly division aimed at increasing its capacity to deliver advanced electronic projects for customers in Europe and international markets.

Torsby-Inaguration-Johannes-Lind-Widestam-Karin-Nichols

May 27, 2026
Swedish EMS provider NOTE has inaugurated a new production facility in Torsby, Värmland. The factory doubles the company's production floor space at the site and is built for advanced electronics manufacturing serving customers in defence, medical technology and other demanding segments.

May 27, 2026
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

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