Sponsored content by Shanghai Yongming Electronic Co.,Ltd All-Weather Endurance: YMIN SLR Hybrid Supercapacitors for -40°C Energy Storage YMIN's SLR hybrid supercapacitors enable reliable energy storage at -40°C, with stable capacitance, low ESR, and long service life. Ideal for IoT, smart meters, and outdoor use in extreme climates.
BEL partners with BMIT to boost Indian defence tech April 24, 2026 This strategic partnership aims to strengthen efforts towards fostering indigenous design and production capabilities in advanced technology domains critical to national defence.
Only one European company in global EMS Top 30 April 23, 2026 The global EMS/ODM industry continues to expand, but scale and growth remain unevenly distributed, with Asian players flexing their dominance while Europe lags behind, according to new research from in4ma and EMSNOW.
LTSCT signs agreement with Newen on SiC-based power modules April 23, 2026 The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.
Evertiq Expo to launch in Vienna in 2027 April 22, 2026 Evertiq will expand its Evertiq Expo format with a first-ever event in Vienna, Austria, scheduled to take place on February 4th, 2027.
Unisystem and SoMLabs expand cooperation in embedded and display technologies April 22, 2026 As global supply chains remain under pressure and geopolitical uncertainty continues to reshape sourcing strategies, partnerships built on local capabilities are gaining importance. In this context, two Polish companies — Unisystem and SoMLabs — have announced a closer collaboration aimed at jointly delivering technology projects based on complementary products and expertise.
Why EMC cannot be the “final step”. Design risks in defence electronics April 21, 2026 In many projects, electromagnetic compatibility (EMC) is still treated as a final-stage verification step. In practice, this approach increasingly leads to delays, costly redesigns and errors that are difficult to eliminate — particularly in complex defence systems. As Dominik Kowalczyk, an explosion protection specialist at Dacpol, told Evertiq, EMC analysis should cover the entire lifecycle of a project — from concept to deployment. He also pointed out where signal integrity is most often lost and why the traditional approach to EMC is no longer keeping pace with growing system complexity.
Arrow, Infineon introduce 240W USB-C PD 3.2 reference design April 21, 2026 REF_ARIF240GaN is specifically designed to support the launch of EZ-PD PMG1-B2, Infineon’s newest USB PD 3.2 controller, featuring up to 240W USB sink capability and integrated buck-boost functionality in a compact single package.
3DGS breaks ground on chip packaging unit in India April 20, 2026 The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.
Vero completes acquisition of TEC, expanding fiber platform in US April 20, 2026 Through this acquisition, Vero will extend its footprint from the Western United States into the Southeast via TEC’s 4,500-mile fiber network. The combined company will reach approximately 444,000 households.
Air Liquide invests €200M in Japan to support chip manufacturer April 20, 2026 Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.
Renesas expands auto MCU portfolio with 28nm RH850/U2C April 20, 2026 The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.
EU outlines plan to speed up defence innovation April 16, 2026 The European Commission has unveiled a new EUR 115 million funding instrument aimed at accelerating the development and deployment of disruptive defence technologies, with a strong focus on SMEs, start-ups and scale-ups across the EU.
From selective soldering to inspection: how THT processes are evolving April 16, 2026 Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.
Meiko Electronics to set up PCB plant in Vietnam April 16, 2026 Japanese PCB manufacturer Meiko Electronics has decided to establish a new wholly owned subsidiary in Vietnam, aimed at expanding its PCB manufacturing capacity in the ASEAN region.
Eurofins to divest electronics testing unit for €575 million April 16, 2026 Eurofins Scientific SE has signed an agreement to sell its Electrical & Electronic Testing business, MET Labs, to UL Solutions Inc. for an enterprise value of EUR 575 million on a cash- and debt-free basis.
Extended lead times for key components weigh on server growth April 15, 2026 Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.
First Evertiq Expo Zurich just around the corner – industry experts to take the stage April 15, 2026 On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.
Hanwha partners with Indra to boost defence cooperation April 15, 2026 The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.
From rigidity to agility: modular robotics gains ground in EMS manufacturing April 14, 2026 Electronics manufacturers operating in high-mix, low-volume (HMLV) environments need more flexible automation to remain competitive, according to Piotr Owczarek of Fideltronik, Fitech and AIRob. Speaking at the Evertiq Expo Tampere 2026, he outlined how modular robotics and AI-driven systems can address the limitations of traditional automation.
Electronics under pressure: how real-world conflict is reshaping design assumptions April 14, 2026 For years, defence electronics followed a relatively stable logic. Systems were designed against defined threat models, tested in controlled environments, certified, and then deployed with the expectation that they would remain valid over time.
Agile closes acquisition of thyssenkrupp Automation Engineering April 13, 2026 thyssenkrupp Automation Engineering will continue as Krause Automation as part of Agile Robots. The acquisition combines Agile’s AI-powered automation solutions with the engineering and implementation expertise of Krause Automation.
Samsung weighs semiconductor packaging investment in Vietnam April 10, 2026 Samsung Electronics is considering an investment in chip testing and packaging operations in Vietnam, Reuters reports, citing a source familiar with the matter.
Modular robotics – key to flexibility in high-mix manufacturing April 09, 2026 During Evertiq Expo Tampere 2026, modular robotics and pragmatic automation took centre stage as Piotr Owczarek, Executive Leader in Industrial Operations & AI Innovation at Fitech and AIRob, outlined how manufacturers can better navigate the complexities of high-mix, low-volume (HMLV) production.
Nano Dimension sells AME and Fabrica product lines to Inspira April 08, 2026 Nano Dimension Ltd. has agreed to sell its additively manufactured electronics (AME) product line and its previously discontinued Fabrica product line to Inspira Technologies as part of an ongoing strategic review.
ZEISS opens quality excellence centre in North Carolina April 08, 2026 ZEISS has opened a new Quality Excellence Center in Huntersville, North Carolina, expanding its metrology and quality assurance footprint in the US.
OKI launches EMS offering for AI server equipment April 08, 2026 OKI has introduced a new electronics manufacturing services (EMS) offering targeting AI server equipment.
Murata completes new MLCC production building in Japan April 07, 2026 Japanese component manufacturer Murata has completed a new production building at its subsidiary Izumo Murata Manufacturing Co., Ltd. in Izumo, strengthening its capacity for multilayer ceramic capacitors (MLCCs).
Memory market rebounds, but AI demand reshapes recovery April 02, 2026 The semiconductor market has been sending mixed signals for some time now. Headline numbers suggest a return to growth, and in some segments even a strong rebound. At the same time, when looking more closely at how this growth is distributed, it becomes increasingly difficult to describe it as broad-based or evenly shared across the industry.
Visual highlights from Evertiq Expo Tampere 2026 April 01, 2026 Evertiq Expo Tampere 2026 returned to Tampere Hall on 26 March, where this year’s edition set a new visitor record. Over the course of the day, 297 visitors joined 79 exhibiting companies for a day of networking, insights, and innovation.
When light replaces needles: Evertiq Scholarship winners 2026 April 01, 2026 At Evertiq Expo Tampere on March 26, the moment was brief but meaningful. A check was handed over, applause followed, and two students – Razib Hasan and Jingjing Yang – stood on stage, representing something much bigger than a thesis project.
India approves electronic manufacturing projects worth $750M April 01, 2026 India’s electronics manufacturing sector produced goods worth USD 125 billion in the year to March 2025. The government hopes to increase this to USD 500 billion by fiscal 2031.