Wolfspeed tops out world’s largest SiC facility
March 27, 2024
Wolfspeed has celebrated the topping out of construction at the USD 5 billion John Palmour Manufacturing Center for Silicon Carbide.
ASU and Deca team up to open research center
March 20, 2024
Arizona State University (ASU) and Deca Technologies (Deca), a provider of advanced wafer- and panel-level packaging technology, are teaming up to create North America’s first fan-out wafer-level packaging (FOWLP) research and development center.
Everspin Technologies applies for CHIPS Act funding
March 12, 2024
Everspin Technologies, a US volume producer of MRAM, has submitted an Application for US CHIPS and Science Act funding. The submitted application is for additional 200mm MRAM capacity and for the increase of long-term R&D IP capability.
Vishay acquires Nexperia’s Newport Wafer Fab for $177m
March 06, 2024
Vishay Intertechnology has completed the acquisition of Nexperia’s wafer fabrication facility and operations located in Newport, South Wales, UK for approximately USD 177 million.
UK government approves Vishay's Newport Wafer Fab purchase
March 04, 2024
Vishay Intertechnology's acquisition of Newport Wafer Fab has been cleared by the UK government, ending years of uncertainty over the UK's largest fab.
SCREEN opens new semiconductor equipment facility
February 05, 2024
Japan's SCREEN Semiconductor Solutions has completed construction of its S3-5 (S-Cube 5) factory, which is based at its existing Hikone site.
Applied Materials up fund MIT's nanoscale lab enhancements
February 02, 2024
MIT, Applied Materials and the Northeast Microelectronics Coalition (NEMC) Hub have committed more than USD 40 million to add advanced nano-fabrication equipment and capabilities to the MIT.nano lab.
Wolfspeed expands SiC wafer supply deal with global semiconductor company
January 31, 2024
Wolfspeed has expanded an existing long-term silicon carbide wafer supply agreement with an unnamed global semiconductor company. The expanded supply agreement is now worth approximately USD 275 million.
Poro and PSMC form strategic partnership on MicroLEDs
January 25, 2024
UK-based Poro Technologies and Taiwan’s Powerchip Semiconductor Manufacturing Corp will team up to mass produce the MicroLEDs on 200mm GaN-on-silicon for display applications.
Infineon and Wolfspeed extend 150mm SiC wafer supply deal
January 24, 2024
Infineon has agreed a multi-year agreement with Wolfspeed to help it meet growing demand for SiC products from automotive, solar and EV customers.
A*STAR and centrotherm team up on 200mm SiC technology
December 18, 2023
Two Singaporean forms are to develop thermal processes for SIC device fabrication. The partnership combines A*STAR’s 200mm SiC pilot line with centrotherm’s diffusion and annealing tools.
Applied Materials and CEA-Leti unveil joint lab
December 07, 2023
Applied Materials and CEA-Leti have expanded their longstanding collaboration to focus on developing differentiated materials engineering solutions for several speciality semiconductor applications.
China is beefing up its wafer capacity
November 16, 2023
TrendForce has taken a deep dive into mainland China’s semiconductor manufacturing capacity, investigating the country's existing and future fab capacity.
Vishay to acquire Nexperia’s Newport Wafer Fab
November 08, 2023
There have been many twists and turns in the story of the Newport Wafer Fab, and as we move into the next year another major development for the fab will take place. Vishay Intertechnology has entered into an agreement to acquire the fab from Nexperia.
Axcelis ships system to SiC power device Chipmaker in Japan
October 19, 2023
Axcelis Technologies says it has shipped a Purion EXE SiC Power Series 200mm high energy implanter to an unnamed SiC power device chipmaker located in Japan.
GF to speed up production of next-Gen GaN chips
October 19, 2023
In partnership with the US Government, GlobalFoundries' semiconductor manufacturing facility in Vermont moves closer to large-scale production of next-gen gallium nitride (GaN) chips.
X-FAB set to receive funding for European push
October 18, 2023
X-FAB is set to receive subsidies as part of the new Important Project of Common European Interest in Microelectronics and Communication Technologies (IPCEI ME/CT). The funding will span across three of X-FAB's sites.
IQE and VisIC to develop next-gen D-Mode GaN power devices
September 21, 2023
IQE has announced a strategic collaboration with VisIC Technologies to develop "the highest reliability" gallium nitride D-Mode power products for use in electric vehicles inverters.
12 new 200mm volume fabs to be built by 2026
September 21, 2023
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month (wpm), SEMI reports
U.S. 300mm chip manufacturer places repeat order with Shellback
September 19, 2023
Shellback Semiconductor Technology, a provider of semiconductor capital equipment and services, has received a follow-on EAGLEi 300 FOUP Inspection System order from an unnamed global 300mm chip manufacturer.
U.S. 300mm chip manufacturer Selects Shellback system
August 18, 2023
Shellback Semiconductor Technology says it has sold an EAGLEi 300 FOUP Inspection System to an unnamed 300mm chip manufacturer in the US.
Wolfspeed adds additional SiC manufacturing capabilities
August 14, 2023
Axcelis has shipped a Purion H200 SiC ion implant system to SiC specialist Wolfspeed. The evaluation system will be used to support the production of power devices for EV applications.
Renesas and Wolfspeed ink 10 year SiC wafer supply deal
July 05, 2023
Japanese Renesas Electronics has signed a 10-year supply agreement with Wolfspeed. A USD 2 billion deposit by Renesas will secure a supply of silicon carbide bare and epitaxial wafers from Wolfspeed.
Elmos to sell its Dortmund wafer fab to Littelfuse
June 28, 2023
Elmos Semiconductor and Littelfuse have entered into a definitive agreement on the sale of the Elmos wafer fab at the Dortmund site to Littelfuse.
ClassOne Equipment delivers 300mm Takano particle detection system to EUV Tech
June 12, 2023
ClassOne Equipment says it has delivered its advanced new Takano WM-10 particle measurement system to EUV Tech, a producer of metrology equipment for cutting-edge EUV chip manufacturing.
ST team up with Sanan to advance SiC ecosystem in China
June 08, 2023
STMicroelectronics and Sanan Optoelectronics have signed an agreement to create a new 200mm silicon carbide device manufacturing JV in Chongqing, China.
Noel Technologies ramps capacity at Silicon Valley fab
May 10, 2023
Noel Technologies, a Pure Wafer company, has launched a major expansion at its Campbell, California wafer fab, investing in both tooling and cleanroom space.
Nexperia engages ATREG regarding its 200mm fab in Newport
April 21, 2023
ATREG, a company specialising in helping advanced technology companies divest and acquire infrastructure-rich manufacturing assets, says that its been contacted by Nexperia regarding its Newport wafer fab in Wales, UK.
Wolfspeed and NC A&T to set up joint R&D facility
March 31, 2023
Wolfspeed and North Carolina Agricultural and Technical State University have announced their intent to apply for CHIPS and Science Act funding to build a new research and development facility on the North Carolina A&T campus.
SGL Carbon to supply graphite components to Wolfspeed
March 29, 2023
SGL Carbon says it will expand its capacities to support Wolfspeed’s growth in Silicon Carbide high-performance applications – supplying key graphite components for the US company's SiC production facilities.
Wolfspeed to build the world's largest 200mm SiC fab in Germany
February 01, 2023
US SiC specialist Wolfspeed says it will build the world’s largest 200mm Silicon Carbide device fab in Ensdorf, Germany, together with automotive supplier ZF.
Amtech Systems acquires Entrepix
January 19, 2023
Amtech Systems has acquired Entrepix, Inc., a specialist in chemical mechanical polishing (CMP) and wafer cleaning.
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