ACDi takes delivery of the 23,000th Koh Young machine
March 29, 2024
Back in 2018 ACDi (American Computer Development, Inc.) upgraded from 2D AOI (Automatic Optical Inspection) to 3D AOI and 3D SPI (Solder Paste Inspection). Today, almost five years later, the company remain at the forefront of manufacturing technology and recently ordered the 23,000th inspection machine manufactured by Koh Young.
Coherent expands capacity in US and Europe
March 27, 2024
Compound semiconductor specialist Coherent Corp. has established the world’s first capability for 6-inch indium phosphide (InP) wafer fabrication, at the company’s Sherman, Texas, and Järfälla, Sweden, wafer fabs.
MediaTek partners with Ranovus to enter the CPO market
March 25, 2024
Taiwanese chip firm MediaTek is making a move into the field of Heterogeneous Integration Co-Packaged Optics (CPO) via a partnership with optical communications firm Ranovus.
Mycronic expands with German acquisition
March 25, 2024
Mycronic’s Global Technologies division has signed an agreement to acquire Germany's Vanguard Automation, a developer of technology and automated equipment for 3D microfabrication of optical interconnects.
Quintessent raises $11.5m to develop silicon photonics tech
March 15, 2024
Santa Barbara-based Quintessent has completed a new funding round, which will help the firm accelerate the development of more scalable and reliable optical interconnects.
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PCB – what is the key component in electronics manufacturing?
Today, printed circuits are with us at every turn. They are present in smart phones, computers, household appliances, as well as medical devices and aircraft. In an era of miniaturisation of electronics and increasing complexity of board designs both, PCB suppliers and PCB assembly factories, are meeting customer needs with innovative technical solutions and materials. What is the process of ordering a PCB and assembling the PCBA components? What are the challenges involved? The answers to these questions are provided by the work of Comarch IoT Plant, a state-of-the-art manufacturing facility offering services in the field of rapid prototyping and assembly of electronic devices (EMS).
New Hi-tech equipment boosts Escatec's MOEMS production
February 28, 2024
EMS provider Escatec has significantly expanded the micro-opto-electro-mechanical-systems (MOEMS) capability at its Swiss facility with the recent commissioning of a Delvotec M17S automated wire bonder.
Sennheiser invests in Norwegian MEMS microphone
February 22, 2024
Norwegian deep-tech company sensiBel has just completed a EUR 7 million funding round with Sennheiser and existing shareholders. The funds will be used to expand production and invest in scalability.
Point2 raises $22.6m to fund ultra-low-power SoC solutions
February 19, 2024
Bosch Ventures leads a fresh Series B round to help the US startup capitalise on the surge in the data centre switch market.
Triad Semiconductor launches dedicated defence division
February 09, 2024
US-based Triad Semiconductor has launched Triad Micro Devices (TMD), a new unit dedicated to developing analog and mixed-signal integrated circuits for the aerospace and defence industries.
Japan earmarks $307m for optical chip R&D centre
February 02, 2024
The Japanese government is making available USD 307 million in subsidies for a new unit to research optical technology semiconductors. The project is backed by NTT, Intel, and SK Hynix.
TSMC to invest $5m in Arizona apprenticeship programme
January 29, 2024
Taiwan Semiconductor Manufacturing will spend USD 5 million to train 80 facility technicians to work in its Arizona facilities.
Enablence and Polar Semiconductor form strategic partnership
January 22, 2024
The two North American companies will come together to develop optical semiconductors for transceiver customers all over the world.
Nokia to invest €360M in German hardware and chip design
January 17, 2024
Finnish telecom company Nokia says it plans to invest EUR 360 million in software, hardware and chip design at its Ulm and Nuremberg sites in Germany.
Jenoptik invest in high-tech equipment for Dresden fab
January 11, 2024
Jenoptik says that it is investing a low double-digit million-euro amount in a new electron-beam lithography system for the high-tech fab currently under construction in Dresden.
Yamaha Robotics names Ai Nagakubo Branch Manager
January 10, 2024
Yamaha Robotics has appointed Ms Ai Nagakubo as Branch Manager at the company’s European headquarters in Neuss, near Duesseldorf, Germany from 1st January 2024.
ShunSin confirms plans for $20m Vietnam facility
December 21, 2023
ShunSin Technology, the system-in-package (SiP) subsidiary of Hon Hai Technology Group (Foxconn), is set to open its third plant in Vietnam.
Saudi Arabia launches incubator for semiconductor startups
December 15, 2023
The Saudi Arabian government has unveiled 'Ignition' – a Riyadh-based centre designed to foster local and international companies in the semiconductor space.
All Flex Solutions installs new inner layer factory
December 14, 2023
All Flex Solutions has purchased and installed a new inner layer factory in its Rigid Flex Center of Excellence located in Minneapolis, USA.
Applied Materials and CEA-Leti unveil joint lab
December 07, 2023
Applied Materials and CEA-Leti have expanded their longstanding collaboration to focus on developing differentiated materials engineering solutions for several speciality semiconductor applications.
Kontron signs a contract worth over €30 million
December 06, 2023
Kontron has signed a contract exceeding EUR 30 million for fiber optic solutions. While the new client remains unnamed it is described as a "significant player in the telecommunications sector in Germany."
Sponsored content by Comarch S.A.
Prototyping of electronic devices using SMT assembly in the Comarch IoT Plant
Prototype building is an important yet problematic business area for electronics manufacturers. Fierce competition and increasing customer demands are forcing us to act faster and work even more efficiently. The time available for the design phase is shrinking significantly, and the preparation of a prototype in short-run production requires a reorganisation of processes not only in the factory but also throughout the company. This is why more and more companies are looking to collaborate in this area. This kind of support is offered by Comarch IoT Plant, providing rapid prototyping and electronic device assembly services (EMS, Electronic Manufacturing Services).
Lumotive expands global partner network for lidar tech
December 01, 2023
Optical semiconductor specialist Lumotive has added new distribution partners across China, South Korea, and Europe. It says the expansion will meet demand for its next-gen 3D sensing solutions.
Ciena invests in US manufacturing with Flex
November 30, 2023
Ciena, a US-based networking systems, services and software company, is adding domestic manufacturing with the help of EMS provider Flex.
Conductive Containers acquires Crestline Plastics
November 29, 2023
Conductive Containers, a provider of static control packaging for electronics, components and optics, has announced its acquisition of Crestline Plastics, an optics packaging company.
Major Electronics b.v. invests in new Viscom system
November 28, 2023
Dutch EMS provider Major Electronics b.v. invests in quality assurance, adding a new 3D Automatic Optical Inspection machine from Viscom to its machine park.
Delvitech wants to revolutionise the optical inspection industry
November 27, 2023
During Evertiq Expo Warsaw 2023, Evertiq editor Ewelina Bednarz had the opportunity to talk to Wei-Lung Chen, vice president for global sales at Delvitech SA, about the company's investment in India and its European plans for 2024.
Sponsored content by Comarch S.A.
Electronics quality control using X-ray in Comarch IoT Plant
Quality control is a key aspect of electronics manufacturing. However, due to the increasing complexity combined with miniaturization of electronic components, the challenge is to detect defects that can affect the performance of products. This forces the development of more and more accurate inspection methods and accompanying technologies to support the analysis of results. Non-destructive testing (NDT) is helpful, which allows you to conduct an inspection using X-ray radiation (X-ray) and computed tomography (CT) in a precise way. Both methods are successfully used in Comarch IoT Plant.
Silicon Austria Labs installs new EVG systems
November 14, 2023
Austrian research centre Silicon Austria Labs (SAL) has received and installed multiple EV Group (EVG) lithography and resist processing systems at its MicroFab R&D cleanroom facility in Villach, Austria.
Sponsored content by Seica
Visit us at Productronica
Accelerating innovation has always been a touchstone of Seica’s approach to providing solutions to the electronics industry, so visitors to Seica’s booth at Productronica 2023 will see full alignment with this year’s theme in the latest, leading-edge, completely automated test solutions on display in Booth A1-445 as well as the fully automated selective soldering and optical inspection solutions on show at the Seica Automation Booth A3-335.
Jabil takes over production and sale of Intel's silicon photonics components
October 31, 2023
EMS provider Jabil will take over the manufacture and sale of Intel’s current Silicon Photonics-based pluggable optical transceiver (module) product lines
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