Evertiq - First In Electronics News & Expo

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Indiana_groundbreaking

August 28, 2026
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

total-capex-forecast-csp-2027

August 26, 2026
DRAM and NAND Flash combined will account for 47% of major cloud service providers' total capital expenditure in 2026, rising to 68% in 2027, according to TrendForce. The shift reflects both soaring memory contract prices and surging procurement demand for AI infrastructure.

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August 24, 2026
Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.

August 21, 2026
Micron Research Labs will center on a flagship Boise campus designed to support advanced research across critical technology domains. Key research areas include critical memory technologies, advanced memory and compute architectures, packaging and future semiconductor manufacturing.

August 20, 2026
Marvell Technology has entered into an expanded commercial agreement with Google to develop custom semiconductor products across a range of programmes attached to Google's TPU ecosystem.

Singapore-NAND-facility-2025

August 18, 2026
Combined revenue for the top five publicly listed NAND Flash brands rose 77% QoQ in Q2 2026 to USD 68.87 billion, driven by sustained AI server demand for enterprise SSDs and significant contract price increases. Micron posted the strongest growth of the group and moved up to third place, according to TrendForce.

chip

August 14, 2026
The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.

Program-Evertiq-Expo-1

August 11, 2026
Earlier this year, several discussions at Evertiq Expo pointed to the same conclusion: while the semiconductor industry continues to grow, that growth is far from evenly distributed. AI, memory and data centres have driven record revenues, while other parts of the electronics industry continue to face a very different reality.

axonite_chip

August 10, 2026
Through its investment, Ardian Semiconductor will support VSORA in accelerating its go‑to‑market strategy to strengthen the company’s recognition across the value chain and reinforce VSORA’s access to senior semiconductor industry expertise.

terafab

August 07, 2026
Terafab, a vertically integrated semiconductor fabrication plant in Grimes County, Texas, with over 100 million square feet of manufacturing space, will employ at least 3,000 people.

August 07, 2026
Taalas’ technology optimizes inference dataflows, reducing compute and memory bottlenecks associated with general-purpose architectures and enabling highly optimized AI inference capabilities.

Infineon-1

August 06, 2026
MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.

August 06, 2026
Under the agreements, Samsung will receive access to US firm Netlist’s complete patent portfolio, including its server DIMM and High Bandwidth Memory technologies. Samsung will supply Netlist DRAM and NAND products, and the parties agree to settle and mutually release all pending legal actions.

Liquide_gas_plant

August 06, 2026
Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.

geralt_AI

August 05, 2026
TrendForce estimates that the combined 2026 CapEx of Google, Amazon, Meta, Microsoft, Oracle, ByteDance, Tencent, Alibaba, and Baidu will exceed USD 886.7 billion, with the five North American hyperscalers accounting for nearly 90%.

Gen3_MRDIMM

August 05, 2026
Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.

sign

August 03, 2026
The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

PCB-world_1

July 30, 2026
SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.

Systems_Openchip_partnership

July 30, 2026
Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.

Didrik-PCB

July 28, 2026
In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Best-Supply-Jacek-Malecki-Krakow-2026

July 20, 2026
Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.

SLC_NAND

July 16, 2026
Meanwhile, demand for SLC NAND continues to grow in AI edge computing, data centers, and automotive electronics, causing the supply-demand gap to widen quickly, TrendForce notes.

PM1763_SSD

July 14, 2026
Featuring high-speed data transfer and an optimized controller architecture, PM1763, the company’s PCIe 6.0-based enterprise SSD, is expected to serve as a key storage solution for high-performance AI platforms.

Nikolaos-Florou-presentation-Berlin

July 09, 2026
Two months ago, at Evertiq Expo Zürich, Nikolaos Florous left little room for optimism. Tight memory market conditions would persist, he said — and things would likely get worse before they got better.

expo-Berlin-2026-020

July 08, 2026
New data from in4ma and EMSNOW puts the global EMS and ODM industry at USD 820 billion for 2025 – and Europe's share of that figure is shrinking in relative terms even as the continent's largest players post revenue growth.

Hiroshima-building

July 07, 2026
Micron Technology has broken ground on a new cleanroom at its manufacturing facility in Higashi-Hiroshima, Japan. The first phase covers approximately 300,000 square feet and is intended to strengthen Micron's advanced memory manufacturing capacity to meet growing AI demand. Equipment move-in is scheduled for the second half of 2028.

July 07, 2026
Micron is increasing output of key automotive memory solutions with capacity expansions designed to support long product lifecycles and ensure sustained supply for critical production programs.

manassas-virginia

July 03, 2026
Micron Technology and General Motors have signed a Strategic Customer Agreement to secure a long-term, reliable supply of memory and storage products for GM's vehicle production. The agreement covers LPDRAM, NOR and UFS NAND products, according to a press release from Micron.

Liquide

July 03, 2026
Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.

groundbreaking-sherman-texas-2026

July 03, 2026
Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.

Duo-column

June 29, 2026
Dennis Dahlgren and Ewelina Bednarz reflect on the spring Expo season and look ahead to their first trip to the International in4ma EMS & PCB Forum in Würzburg.

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