Evertiq - First In Electronics News & Expo

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EPIC-centre-2026

October 13, 2026
Applied Materials has unveiled its EPIC Center in Sunnyvale, California, where chipmakers, equipment suppliers and universities will develop new semiconductor processes alongside the company’s own engineers. TSMC, Intel, Samsung, SK hynix and Micron are among the founding partners.

Dresden-2026

October 12, 2026
GlobalFoundries has reached a construction milestone in its EUR 1.1 billion expansion in Dresden. The company also plans to develop and manufacture its next generation of FD-SOI technology at the site.

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PCB-India_2

October 08, 2026
Gradiant named Hari Prasad as Managing Director, India, to lead its growth across semiconductors, data centers, and energy. The new contracts span chips, electronics, and clean energy, and include a repeat award from a global chipmaker expanding its fab.

October 06, 2026
Micron's revenue reached USD 54.2 billion in the fourth quarter of its 2026 fiscal year, almost five times the level of the same quarter last year. Rising memory prices pushed the gross margin to 87%, and the company expects supply to become even tighter in 2027 and 2028.

breaks-ground-new-cleanroom-Erfurt-2026

October 06, 2026
X-FAB has started construction of a new cleanroom at its site in Erfurt, Germany, to expand production of microsystems and photonics. The Fab4Micro project receives EUR 127.4 million in funding from the German federal government and the state of Thuringia under the EU Chips Act.

PCB-India_3

October 01, 2026
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

Electronics_Kelington

September 25, 2026
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.

Claus-Aasholm

September 24, 2026
The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.

campus-veldhoven

September 24, 2026
While High NA EUV will be adopted for production using the current 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.

Nexperia-deal

September 23, 2026
Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.

Electronics_Sumitomo_Chemical

September 23, 2026
Under the MoU, both companies have agreed to explore a collaboration whereby Sumitomo will supply semiconductor materials, including photoresists, functional chemicals, and high-purity chemicals to Tata Electronics’ upcoming Fab in Dholera, Gujarat.

PCB-India_2

September 21, 2026
The two Indian companies will jointly explore chip fabrication and packaging opportunities for L&T Semiconductor’s current and future products across Tata Electronics’ range of fab process technologies and packaging solutions.

tool

September 17, 2026
Rather than serving a single point in the water cycle, Gradiant will deliver its full semiconductor portfolio across these sites — from ultrapure water production to high-recovery wastewater treatment, scrubber reclaim, treatment of complex streams and zero liquid discharge.

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

Copenhagen-Quantum-fab

September 08, 2026
Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.

headquarters

September 07, 2026
Manz Asia contributes inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem. German manufacturer SUSS brings semiconductor process expertise and global customer reach.

Photonics-production

September 03, 2026
Swedish company Sivers Semiconductors is investing USD 30 million to expand its indium phosphide manufacturing facility in Glasgow, Scotland.

Indiana_groundbreaking

August 28, 2026
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

Oberkochen-building

August 26, 2026
Zeiss Semiconductor Manufacturing Technology has reached a milestone in its Oberkochen site expansion with the move-in to a new office building in July 2026, roughly four years after the groundbreaking ceremony in May 2022. In total, the expansion adds approximately 25,000 square metres of space for production and production-related areas at the site.

total-capex-forecast-csp-2027

August 26, 2026
DRAM and NAND Flash combined will account for 47% of major cloud service providers' total capital expenditure in 2026, rising to 68% in 2027, according to TrendForce. The shift reflects both soaring memory contract prices and surging procurement demand for AI infrastructure.

GeneSiC

August 24, 2026
Under the terms of the agreement, Magnachip will license Navitas’ GeneSiC Trench-Assisted PlanarTM (TAP) technology to enter the HV and UHV SiC markets. The license covers 1200 V, 2300 V, 3300 V and higher voltage GeneSiC technologies.

hynix_Cheongju_fab

August 17, 2026
SK hynix’s board has approved about 54.3 trillion won ($38 billion) of investments through 2031, including 35.2 trillion won for the second phase of construction of its chip fabrication plant in Yongin and 19.1 trillion won for its M17 chip plant in Cheongju.

Kyushu

August 13, 2026
Tokyo Electron (TEL) is collaborating with Nvidia, utilizing Nvidia Agent Toolkit including Nvidia NeMo, Nvidia NIM, Nvidia NemoClaw blueprints and the open robot development platform Nvidia Isaac within TEL’s “Epsira” concept for digital transformation (DX) solutions.

fab-P12

July 30, 2026
Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.

Semiconductor_building

July 20, 2026
Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.

team

July 13, 2026
Founded in 2022 as a spin-out of the Technical University of Munich, QuantumDiamonds (QD) will use the funding to deliver lab systems to leading chipmakers and advance wafer-level capabilities for high-throughput fab inspection.

Nikolaos-Florou-presentation-Berlin

July 09, 2026
Two months ago, at Evertiq Expo Zürich, Nikolaos Florous left little room for optimism. Tight memory market conditions would persist, he said — and things would likely get worse before they got better.

production-2026

July 07, 2026
Swedish MEMS foundry Silex Microsystems has entered into a binding agreement to acquire a 200mm semiconductor fab in Mountain Top, Pennsylvania, in the United States, from Onsemi. The purchase price is USD 40 million.

July 07, 2026
Micron is increasing output of key automotive memory solutions with capacity expansions designed to support long product lifecycles and ensure sustained supply for critical production programs.

Liquide

July 03, 2026
Air Liquide will deliver large volumes of nitrogen, oxygen, argon, hydrogen and other industrial gases to SK hynix’s new cutting-edge advanced chips packaging facility.

groundbreaking-sherman-texas-2026

July 03, 2026
Coherent has signed a letter of intent to receive up to USD 50 million under the US CHIPS and Science Act to expand its indium phosphide semiconductor manufacturing facility in Sherman, Texas. The expansion will double manufacturing space and quadruple wafer production capacity, and is expected to create more than 1,000 jobs.

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