ESMC holds topping-out ceremony at Dresden fab site January 28, 2026 European Semiconductor Manufacturing Company (ESMC) has celebrated the topping-out of its new office buildings at its Dresden semiconductor fab, the company said in a LinkedIn update. The ceremony marked the placement of the final structural beam in the central building.
Micron breaks ground on $24B wafer fab expansion in Singapore January 27, 2026 Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned investment of approximately USD 24 billion over the next ten years.
Elmos opens new R&D site in the Czech Republic January 22, 2026 German semiconductor company Elmos Semiconductor has opened a new research and development site in Brno, Czech Republic.
Micron’s PSMC acquisition could support DRAM supply from 2027 January 20, 2026 Micron Technology’s planned acquisition of Powerchip Semiconductor Manufacturing Corp.’s (PSMC) Tongluo fab in Taiwan could help strengthen global DRAM supply from 2027, according to market analyst TrendForce.
Micron to buy PSMC’s chip fabrication site for $1.8 billion January 19, 2026 The acquisition includes an existing 300mm fab cleanroom of 300,000 square feet and will further position Micron to address growing global demand for memory solutions.
TI starts production at new 300mm semiconductor fab in Texas December 18, 2025 Texas Instruments has officially started production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas.
Semiconductor equipment sales to reach a $156 billion in 2027 December 17, 2025 Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of USD 133 billion in 2025, growing 13.7% year-on-year, reports SEMI.
EU approves €623 million German aid for two chip fabs December 16, 2025 The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,
Tata partners with Intel to advance silicon, compute ecosystem December 09, 2025 As part of the MoU, Intel and India’s Tata Group intend to explore manufacturing and packaging of Intel products for local markets at Tata Electronics’ upcoming Fab and OSAT facilities, as well as a collaboration for advanced packaging in India.
Cyient qualifies for key bid in $500M India chip lab revamp December 08, 2025 This modernization initiative supports the Government of India’s objectives under the India Semiconductor Mission (ISM), which aims to expand domestic semiconductor capability, reduce reliance on imports, and create accessible fabrication capacity for startups, academia and strategic sectors.
Black Semiconductor chooses Critical Manufacturing for 300mm Fab December 02, 2025 Black Semiconductor GmbH has selected Critical Manufacturing to provide the Manufacturing Execution System (MES) and automation infrastructure for its new 300mm wafer facility, FabONE, in Aachen.
IBM, University of Dayton to jointly research next-gen chip tech November 21, 2025 To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university’s campus.
X-Fab and Fraunhofer ENAS join forces to speed microtechnology to market November 19, 2025 X-Fab and the Fraunhofer Institute for Electronic Nano Systems (ENAS) have launched a strategic collaboration aimed at accelerating the transition of microtechnology innovations from research to industrial production. The partnership uses a so-called “Lab-in-Fab” model that integrates research, development, and manufacturing processes under one framework.
Azimuth AI, Cyient launch ‘India’s first-gen IP powered silicon chip’ November 19, 2025 Developed collaboratively by Azimuth AI and Cyient Semiconductors, ARKA GKT-1 integrates multi core custom computing, advanced analog sensing, memory and intelligent power management into a single, highly energy-efficient SoC.
Memory industry to maintain cautious capex in 2026 November 13, 2025 TrendForce’s latest investigations reveal that despite higher ASPs boosting profitability across the memory industry, capital spending on DRAM and NAND Flash is only anticipated to increase modestly in 2026.
Rudi De Winter steps down as CEO of X-Fab November 04, 2025 Semiconductor foundry X-Fab has announced that Rudi De Winter, Chief Executive Officer, will step down from his role on February 6, 2026.
SiCSem starts work on $220M chip production plant in India November 03, 2025 Chennai-based SicSem is partnering with British firm Clas-SiC Wafer Fab Ltd to set up the silicon carbide (SiC) facility in Odisha. The plant is expected to create 5,000 direct and indirect jobs in the region.
Nvidia and Samsung to build AI factory October 31, 2025 Nvidia plans to build a new AI factory with Samsung Electronics. The AI factory will combine Samsung’s semiconductor technologies with Nvidia platforms to establish the foundation of next-gen, AI-driven production.
IIT Madras, Applied Materials accelerate chip innovation in India October 24, 2025 As part of this collaboration, IIT Madras will deploy the foundational software framework of Applied Materials’ AppliedTwin platform — a sophisticated digital twin solution designed to model and optimise semiconductor manufacturing equipment and processes.
GlobalWafers opens new 300mm wafer plant in Italy October 16, 2025 Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.
Cambridge GaN Devices partners with GlobalFoundries October 14, 2025 Fabless semiconductor company Cambridge GaN Devices (CGD) has partnered with GlobalFoundries to manufacture its single-chip ICeGaN power devices. The agreement supports CGD’s fabless strategy and expands the company’s supply chain to meet increasing demand for energy-efficient GaN-based components.
Applied Materials and ASU open $270M semiconductor research centre in Arizona October 13, 2025 Applied Materials and Arizona State University have officially opened the Materials-to-Fab Center, a USD 270 million research and prototyping facility aimed at accelerating innovation in semiconductor manufacturing.
Global 300mm fab equipment spending to reach $374B by 2028 October 09, 2025 Global spending on 300mm semiconductor fabrication equipment is projected to reach USD 374 billion from 2026 and 2028, driven by rising demand for AI chips and efforts to strengthen regional semiconductor self-sufficiency, according to SEMI’s latest 300mm Fab Outlook.
VSMC marks construction milestone at new wafer fab site in Singapore October 08, 2025 VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.
Kioxia and Sandisk start operations at new Kitakami fab October 02, 2025 Kioxia and Sandisk have started operations at a new semiconductor fabrication facility in Kitakami, Japan, aimed at producing advanced flash memory for applications including artificial intelligence.
LA Semiconductor puts Idaho wafer fab up for sale September 18, 2025 US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.
X-FAB opens new cleanroom at its Malaysian site September 12, 2025 X-FAB has officially opened a new manufacturing line at its Sarawak facility. This expansion – representing a USD 600 million investment – has added 6,000 square meters of cleanroom space and was completed in just two years, from groundbreaking to the first production lots.
Tata Electronics partners with Merck to boost India’s chip capabilities September 08, 2025 Merck will offer its full suite of products and services, including high-purity electronic materials, advanced gas and chemical delivery systems, turnkey fab infrastructure services, and its Material Intelligence solutions powered by AI, for Tata Electronics’ fab in Gujarat.
IQM raises €275 million in round led by Ten Eleven Ventures September 04, 2025 The additional capital enables the Finnish quantum computing company to enhance its presence in the US market and further access key global markets to serve the growing demand in IQM’s products.
India approves 4 projects in $530 million boost to chip making August 20, 2025 The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.
Ecolab to acquire Ovivo’s electronics business for $1.8 billion August 15, 2025 The acquisition will strengthen Ecolab’s high-tech growth engine by bringing together Ovivo’s ultra-pure water technologies with Ecolab’s leading water solutions, digital technologies and global service capabilities.
Magnachip CEO steps down as company weighs potential sale August 14, 2025 Magnachip Semiconductor's CEO YJ Kim will step down from his role and the company's board of directors, effective immediately, as the board considers “all strategic alternatives,” including a potential sale. Board Chairman Camillo Martino has been appointed interim CEO.