Air Liquide invests €200M in Korea to back SK hynix’s AI chip project June 16, 2026 In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
Quobly secures €115M to advance silicon-based quantum computers June 15, 2026 The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.
Forge Nano secures wafer fab equipment order from photonics firm June 12, 2026 Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.
Nvidia, TSMC use AI to advance chip design and manufacturing June 03, 2026 Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.
Micron starts 1α DRAM production at Virginia fab in $2 billion expansion May 26, 2026 US memory manufacturer Micron has begun 1-alpha DRAM manufacturing at its Manassas, Virginia facility — the most advanced memory technology ever produced in the United States, according to the company. The more than USD 2 billion investment will quadruple Micron's DDR4 wafer supply at the site.
The next two years won't offer shortcuts – A memory market reality check May 25, 2026 Following his presentation at Evertiq Expo Zürich, Memphis Electronics' Nikolaos Florous had a conversation with Evertiq to go deeper on the market outlook. The short version: conditions will stay difficult, and procurement teams that haven't adapted yet are running out of time.
Tata Electronics, ASML sign MoU to boost India’s chip ecosystem May 18, 2026 The collaboration between the two companies will focus on deploying ASML’s holistic suite of advanced lithography tools and solutions for Tata Electronics’ upcoming 300 mm (12 inch) semiconductor fab in Dholera, Gujarat.
Sony, TSMC sign MOU to develop and manufacture image sensors May 15, 2026 Through the JV, both companies expect to leverage Sony's expertise in sensor design alongside TSMC’s strengths in process technology and manufacturing excellence as part of a broader collaboration aimed at enhancing image sensor performance.
Forge Nano delivers wafer fab equipment to leading firm May 15, 2026 Forge Nano’s TEPHRA platform will support development and manufacturing activities related to next-generation optical and photonics technologies used in high-speed communications and data infrastructure applications.
Global semiconductor materials market reached a record $73.2B in 2025 May 13, 2026 Global semiconductor materials market revenue increased 6.8% year-over-year to USD 73.2 billion in 2025, SEMI reports
Memory is no longer a commodity – The industry hasn't fully caught up May 08, 2026 Nikolaos Florous of Memphis Electronic delivered a data-heavy, at times bluntly honest overview of the global memory market at Evertiq Expo Zürich – and his central message was uncomfortable: the rules have changed, and most of the industry is still playing by the old ones.
Inside Fab 21: TSMC reveals Arizona chip production site May 08, 2026 TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.
Air Products to supply industrial gas for Samsung’s Korea fab May 01, 2026 Under the agreement, the US company will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon and hydrogen for Samsung’s new semiconductor fab.
Extended lead times for key components weigh on server growth April 15, 2026 Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.
Semiconductor equipment billings reached $135B in 2025 April 09, 2026 Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.
Double-digit growth in global 300mm fab equipment spending for 2026 and 2027 April 07, 2026 Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.
SUMCO shifts strategy from new fab to equipment upgrades April 07, 2026 SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.
Intel to repurchase Fab 34 JV stake for $14.2 billion April 02, 2026 US semiconductor manufacturer Intel has reached a definitive agreement with Apollo Global Management to repurchase the 49% equity interest it does not own in the joint venture tied to its Fab 34 semiconductor facility in Ireland. The transaction is valued at USD 14.2 billion.
TSMC targets 3nm production at second Japan fab by 2028 April 01, 2026 TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.
Tower announces plans to expand 300mm capacity in Japan March 26, 2026 Israeli foundry Tower Semiconductor and Nuvoton Technology Corporation Japan will enter into mutual long-term supply agreements, ensuring continued support for existing customers of both companies.
STMicro starts STM32 MCUs deliveries in China March 25, 2026 Through a collaboration with domestic producer Huahong, STMicroelectronics has a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China.
GlobalFoundries breaks ground on €1.1bn Dresden expansion March 18, 2026 GlobalFoundries has started construction of its planned semiconductor fab expansion in Dresden, Germany, marking the next phase of its EUR 1.1 billion investment under Project SPRINT, according to a company update on LinkedIn.
AI demand lifts top foundries' Q4 revenue, Samsung gains share March 12, 2026 Strong demand tied to AI infrastructure and new smartphone launches helped push revenue for the world’s ten largest semiconductor foundries up in the fourth quarter of 2025, according to new research from TrendForce.
Manz Asia and Epson partner to advance inkjet technology for chip manufacturing March 12, 2026 Semiconductor advanced packaging equipment manufacturer Manz Asia has entered into a strategic partnership with Seiko Epson Corporation (Epson) to accelerate the adoption of advanced inkjet technology in semiconductor manufacturing.
Applied Materials and Micron to advance AI memory development March 10, 2026 Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.
SK hynix to Invest $15 billion in Yongin Semiconductor Cluster February 25, 2026 SK hynix has announced an additional investment of KRW 21.6 trillion (USD 15 billion) to expand facilities for its first semiconductor fab and construct five cleanrooms for Phases 2 to 6 of the Yongin Semiconductor Cluster.
TSMC board approves $45 billion for capacity expansion February 25, 2026 The world’s largest semiconductor foundry, TSMC, has approved a capital injection of USD 44.96 billion to expand production capacity. The decision was made during a board meeting on 10 February 2026 in Hsinchu, Taiwan.
Intel backs away from manufacturing deal with Tower Semiconductor February 16, 2026 Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.
Okmetic Vantaa fab expansion enters volume production February 11, 2026 Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.
FPT launches advanced semiconductor testing and packaging plant in Vietnam February 11, 2026 FPT plans to establish an advanced semiconductor testing and packaging facility in Vietnam, aiming to expand domestic back-end manufacturing capacity and strengthen the country’s position in the global semiconductor supply chain.
Viettel breaks ground on Vietnam’s first semiconductor fab February 10, 2026 Viettel Group has broken ground on the construction of what has been dubbed Vietnam’s first semiconductor chip fabrication plant, marking the country’s entry into domestic chip manufacturing.
EU launches NanoIC, Europe’s largest Chips Act pilot line February 09, 2026 The European Union has inaugurated NanoIC, its largest pilot line under the Chips Act, at IMEC Leuven in Belgium. The facility represents a total investment of EUR 2.5 billion, of which EUR 700 million coming from EU funding, EUR 700 million from national and regional governments, and the remainder from industry partners, including ASML.