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Products_headquarters

May 01, 2026
Under the agreement, the US company will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon and hydrogen for Samsung’s new semiconductor fab.

server-hall

April 15, 2026
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.

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EUV-system

April 09, 2026
Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.

fab-equipment-spending-2026

April 07, 2026
Worldwide 300mm fab equipment spending is expected to increase 18% to USD 133 billion in 2026 and 14% to USD 151 billion in 2027, SEMI reports.

April 07, 2026
SUMCO Corporation has received approval from Japan’s Ministry of Economy, Trade and Industry (METI) for an amended version of its “Plan for Ensuring Stable Supply” under the Economic Security Promotion Act, the company announced on March 27, 2026.

April 02, 2026
US semiconductor manufacturer Intel has reached a definitive agreement with Apollo Global Management to repurchase the 49% equity interest it does not own in the joint venture tied to its Fab 34 semiconductor facility in Ireland. The transaction is valued at USD 14.2 billion.

sign

April 01, 2026
TSMC is planning to begin equipment installation and launch mass production of advanced 3-nanometre chips at its second fabrication plant in Japan in 2028, according to a Taiwanese government filing.

building

March 26, 2026
Israeli foundry Tower Semiconductor and Nuvoton Technology Corporation Japan will enter into mutual long-term supply agreements, ensuring continued support for existing customers of both companies.

STM32_microcontroller

March 25, 2026
Through a collaboration with domestic ⁠producer Huahong, STMicroelectronics has a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China.

groundbreaking-Dresden-expansion-2026

March 18, 2026
GlobalFoundries has started construction of its planned semiconductor fab expansion in Dresden, Germany, marking the next phase of its EUR 1.1 billion investment under Project SPRINT, according to a company update on LinkedIn.

office

March 12, 2026
Strong demand tied to AI infrastructure and new smartphone launches helped push revenue for the world’s ten largest semiconductor foundries up in the fourth quarter of 2025, according to new research from TrendForce.

inkjet-systems

March 12, 2026
Semiconductor advanced packaging equipment manufacturer Manz Asia has entered into a strategic partnership with Seiko Epson Corporation (Epson) to accelerate the adoption of advanced inkjet technology in semiconductor manufacturing.

EPIC-Semiconductor-Centre

March 10, 2026
Applied Materials and Micron Technology are teaming up to develop next-generation memory technologies for AI systems. The work will take place at Applied Materials’ EPIC Center in Silicon Valley and Micron’s research facility in Boise, Idaho.

Yongin-Semiconductor-cluster-expansion

February 25, 2026
SK hynix has announced an additional investment of KRW 21.6 trillion (USD 15 billion) to expand facilities for its first semiconductor fab and construct five cleanrooms for Phases 2 to 6 of the Yongin Semiconductor Cluster.

February 25, 2026
The world’s largest semiconductor foundry, TSMC, has approved a capital injection of USD 44.96 billion to expand production capacity. The decision was made during a board meeting on 10 February 2026 in Hsinchu, Taiwan.

building

February 16, 2026
Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.

Vantaa-expansion-2026

February 11, 2026
Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.

established-advanced-semiconductor-testing-and-packaging-plant

February 11, 2026
FPT plans to establish an advanced semiconductor testing and packaging facility in Vietnam, aiming to expand domestic back-end manufacturing capacity and strengthen the country’s position in the global semiconductor supply chain.

Vietnam-Semiconductor-Chip-Fabrication-Plant

February 10, 2026
Viettel Group has broken ground on the construction of what has been dubbed Vietnam’s first semiconductor chip fabrication plant, marking the country’s entry into domestic chip manufacturing.

NanoIC-opening

February 09, 2026
The European Union has inaugurated NanoIC, its largest pilot line under the Chips Act, at IMEC Leuven in Belgium. The facility represents a total investment of EUR 2.5 billion, of which EUR 700 million coming from EU funding, EUR 700 million from national and regional governments, and the remainder from industry partners, including ASML.

Carsem-building

February 05, 2026
German semiconductor manufacturer Infineon Technologies has completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to the company's supplier, Malaysian Pacific Industries Berhad (MPI)

dresden-render

January 28, 2026
European Semiconductor Manufacturing Company (ESMC) has celebrated the topping-out of its new office buildings at its Dresden semiconductor fab, the company said in a LinkedIn update. The ceremony marked the placement of the final structural beam in the central building.

Groundbreaking-singapore-expansion-2026

January 27, 2026
Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned investment of approximately USD 24 billion over the next ten years.

January 22, 2026
German semiconductor company Elmos Semiconductor has opened a new research and development site in Brno, Czech Republic.

January 20, 2026
Micron Technology’s planned acquisition of Powerchip Semiconductor Manufacturing Corp.’s (PSMC) Tongluo fab in Taiwan could help strengthen global DRAM supply from 2027, according to market analyst TrendForce.

January 19, 2026
The acquisition includes an existing 300mm fab cleanroom of 300,000 square feet and will further position Micron to address growing global demand for memory solutions.

300mm-sherman-fab-inaguration

December 18, 2025
Texas Instruments has officially started production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas.

semiconductor-equipment-market-by-segment

December 17, 2025
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of USD 133 billion in 2025, growing 13.7% year-on-year, reports SEMI.

Erfurt-Germany-facility

December 16, 2025
The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,

Intel_MOU

December 09, 2025
As part of the MoU, Intel and India’s Tata Group intend to explore manufacturing and packaging of Intel products for local markets at Tata Electronics’ upcoming Fab and OSAT facilities, as well as a collaboration for advanced packaging in India.

PCB-India_1

December 08, 2025
This modernization initiative supports the Government of India’s objectives under the India Semiconductor Mission (ISM), which aims to expand domestic semiconductor capability, reduce reliance on imports, and create accessible fabrication capacity for startups, academia and strategic sectors.

Aachen-site

December 02, 2025
Black Semiconductor GmbH has selected Critical Manufacturing to provide the Manufacturing Execution System (MES) and automation infrastructure for its new 300mm wafer facility, FabONE, in Aachen.

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