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Yongin-Semiconductor-cluster-expansion

February 25, 2026
SK hynix has announced an additional investment of KRW 21.6 trillion (USD 15 billion) to expand facilities for its first semiconductor fab and construct five cleanrooms for Phases 2 to 6 of the Yongin Semiconductor Cluster.

February 25, 2026
The world’s largest semiconductor foundry, TSMC, has approved a capital injection of USD 44.96 billion to expand production capacity. The decision was made during a board meeting on 10 February 2026 in Hsinchu, Taiwan.

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building

February 16, 2026
Tower Semiconductor has disclosed that Intel does not intend to proceed with a previously signed agreement to manufacture 300mm wafers for Tower’s customers at Intel’s facility in New Mexico.

Vantaa-expansion-2026

February 11, 2026
Okmetic has entered volume production at its expanded Vantaa facility in Finland, targeting 150–200 mm silicon and bonded silicon-on-insulator (SOI) wafers.

established-advanced-semiconductor-testing-and-packaging-plant

February 11, 2026
FPT plans to establish an advanced semiconductor testing and packaging facility in Vietnam, aiming to expand domestic back-end manufacturing capacity and strengthen the country’s position in the global semiconductor supply chain.

Vietnam-Semiconductor-Chip-Fabrication-Plant

February 10, 2026
Viettel Group has broken ground on the construction of what has been dubbed Vietnam’s first semiconductor chip fabrication plant, marking the country’s entry into domestic chip manufacturing.

NanoIC-opening

February 09, 2026
The European Union has inaugurated NanoIC, its largest pilot line under the Chips Act, at IMEC Leuven in Belgium. The facility represents a total investment of EUR 2.5 billion, of which EUR 700 million coming from EU funding, EUR 700 million from national and regional governments, and the remainder from industry partners, including ASML.

Carsem-building

February 05, 2026
German semiconductor manufacturer Infineon Technologies has completed the sale of its backend manufacturing site in Bangkok/Nonthaburi, Thailand, to the company's supplier, Malaysian Pacific Industries Berhad (MPI)

dresden-render

January 28, 2026
European Semiconductor Manufacturing Company (ESMC) has celebrated the topping-out of its new office buildings at its Dresden semiconductor fab, the company said in a LinkedIn update. The ceremony marked the placement of the final structural beam in the central building.

Groundbreaking-singapore-expansion-2026

January 27, 2026
Micron Technology has broken ground on a new advanced wafer fabrication facility in Singapore, marking a planned investment of approximately USD 24 billion over the next ten years.

January 22, 2026
German semiconductor company Elmos Semiconductor has opened a new research and development site in Brno, Czech Republic.

January 20, 2026
Micron Technology’s planned acquisition of Powerchip Semiconductor Manufacturing Corp.’s (PSMC) Tongluo fab in Taiwan could help strengthen global DRAM supply from 2027, according to market analyst TrendForce.

January 19, 2026
The acquisition includes an existing 300mm fab cleanroom of 300,000 square feet and will further position Micron to address growing global demand for memory solutions.

300mm-sherman-fab-inaguration

December 18, 2025
Texas Instruments has officially started production at its newest 300mm semiconductor manufacturing facility in Sherman, Texas.

semiconductor-equipment-market-by-segment

December 17, 2025
Global sales of total semiconductor manufacturing equipment by original equipment manufacturers (OEMs) are forecast to reach a record high of USD 133 billion in 2025, growing 13.7% year-on-year, reports SEMI.

Erfurt-Germany-facility

December 16, 2025
The European Commission has approved EUR 623 million in German State aid to support the construction of two semiconductor manufacturing facilities in Dresden and Erfurt,

Intel_MOU

December 09, 2025
As part of the MoU, Intel and India’s Tata Group intend to explore manufacturing and packaging of Intel products for local markets at Tata Electronics’ upcoming Fab and OSAT facilities, as well as a collaboration for advanced packaging in India.

PCB-India_1

December 08, 2025
This modernization initiative supports the Government of India’s objectives under the India Semiconductor Mission (ISM), which aims to expand domestic semiconductor capability, reduce reliance on imports, and create accessible fabrication capacity for startups, academia and strategic sectors.

Aachen-site

December 02, 2025
Black Semiconductor GmbH has selected Critical Manufacturing to provide the Manufacturing Execution System (MES) and automation infrastructure for its new 300mm wafer facility, FabONE, in Aachen.

Dayton_research

November 21, 2025
To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university’s campus.

Fraunhofer-cooperation

November 19, 2025
X-Fab and the Fraunhofer Institute for Electronic Nano Systems (ENAS) have launched a strategic collaboration aimed at accelerating the transition of microtechnology innovations from research to industrial production. The partnership uses a so-called “Lab-in-Fab” model that integrates research, development, and manufacturing processes under one framework.

Cyient_chip

November 19, 2025
Developed collaboratively by Azimuth AI and Cyient Semiconductors, ARKA GKT-1 integrates multi core custom computing, advanced analog sensing, memory and intelligent power management into a single, highly energy-efficient SoC.

DRAM-NAND-flash-Capex

November 13, 2025
TrendForce’s latest investigations reveal that despite higher ASPs boosting profitability across the memory industry, capital spending on DRAM and NAND Flash is only anticipated to increase modestly in 2026.

Sarawak_Admin-Building

November 04, 2025
Semiconductor foundry X-Fab has announced that Rudi De Winter, Chief Executive Officer, will step down from his role on February 6, 2026.

PCB-India_2

November 03, 2025
Chennai-based SicSem is partnering with British firm Clas-SiC Wafer Fab Ltd to set up the silicon carbide (SiC) facility in Odisha. The plant is expected to create 5,000 direct and indirect jobs in the region.

buildings-flag

October 31, 2025
Nvidia plans to build a new AI factory with Samsung Electronics. The AI factory will combine Samsung’s semiconductor technologies with Nvidia platforms to establish the foundation of next-gen, AI-driven production.

Madras_Applied_Materials

October 24, 2025
As part of this collaboration, IIT Madras will deploy the foundational software framework of Applied Materials’ AppliedTwin platform — a sophisticated digital twin solution designed to model and optimise semiconductor manufacturing equipment and processes.

FAB300-Novara-Italy

October 16, 2025
Taiwanese semiconductor company, GlobalWafers, has officially inaugurated FAB300, a new 300mm semiconductor wafer manufacturing facility at MEMC Electronic Materials in Novara, Italy. The company describes the site as one of Europe’s most advanced and fully integrated silicon wafer fabs.

Simon-Stacey

October 14, 2025
Fabless semiconductor company Cambridge GaN Devices (CGD) has partnered with GlobalFoundries to manufacture its single-chip ICeGaN power devices. The agreement supports CGD’s fabless strategy and expands the company’s supply chain to meet increasing demand for energy-efficient GaN-based components.

Materials-to-Fab-Center

October 13, 2025
Applied Materials and Arizona State University have officially opened the Materials-to-Fab Center, a USD 270 million research and prototyping facility aimed at accelerating innovation in semiconductor manufacturing.

300mm-fac-eq-spending

October 09, 2025
Global spending on 300mm semiconductor fabrication equipment is projected to reach USD 374 billion from 2026 and 2028, driven by rising demand for AI chips and efforts to strengthen regional semiconductor self-sufficiency, according to SEMI’s latest 300mm Fab Outlook.

topping-off-ceremony

October 08, 2025
VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

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