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Singapore

October 28, 2026
GlobalFoundries has opened an Advanced Facilities Control Centre (AFCC) at its site in Singapore, developed together with Siemens. In the first phase, the control centres for five fabs on the Singapore campus will be merged into a single, AI-supported command centre.

Chip-fab-new-Villach-inside-01

October 27, 2026
Infineon will invest around EUR 1.1 billion by 2034 to set up high-volume production of gallium nitride (GaN) power semiconductors on 300mm wafers at its site in Villach, Austria. According to the company, it will be the first high-volume GaN fab of its kind in the world, with production scheduled to start by the end of 2027.

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iphone18

October 21, 2026
Qnity Electronics will produce films for the variable aperture camera in the iPhone 18 Pro in the US. The deal is part of an expansion of Apple’s American Manufacturing Program, under which nearly 100 components in Apple’s newest iPhones now come from American companies.

October 21, 2026
Micron is investing in an expansion of Indium Corporation’s refining and manufacturing operations in Rome, New York, which will restart US processing of critical minerals used in semiconductor manufacturing. In return, Micron gets a long-term supply agreement for the high-purity materials.

foundry-building-render

October 21, 2026
Dutch photonic chip foundry New Origin has cleared what it describes as the biggest obstacles for its planned fab at Kennispark in Enschede. Feasible solutions are now in place for both power and water supply, although the agreements still need to be worked out and finalised.

October 19, 2026
TSMC plans to build a new 3nm fab in Tainan, with production slated to start in the first half of 2028. The company is also moving some 5nm capacity over to 3nm as demand for its leading-edge processes continues to grow.

Joonas-Mikkila-top

October 19, 2026
Technology Industries of Finland publishes its recommendations on the Chips Act 2.0. The Commission has built the right framework. Whether it works depends on where the money goes and who decides.

Kulim

October 15, 2026
Infineon has signed a multi-year agreement with Wolfspeed for the supply of 200mm silicon carbide (SiC) wafers. The deal moves the companies’ existing supply relationship from 150mm to 200mm substrates.

fab-equipment-spending-2026-update

October 15, 2026
Global spending on 300mm front-end fab equipment is projected to rise 31% to USD 149 billion in 2026, according to SEMI. Equipment investment in the Americas is expected to more than double over the same forecast period.

new-york-fabs-2026

October 14, 2026
GlobalFoundries has been selected to operate two new fabs at its site in Malta, New York, financed by Japan through up to USD 21 billion under the US-Japan trade agreement. In a separate agreement, the US government will also take an equity stake of around 4% in the company.

former-SK-hynix-fab-Eugene-OR

October 14, 2026
A former 200mm memory fab in Eugene, Oregon, originally built by SK hynix, has been put up for sale. The site has about 170,000 square feet (15,800 square metres) of potential cleanroom production space, and much of the infrastructure is still in place.

EPIC-centre-2026

October 13, 2026
Applied Materials has unveiled its EPIC Center in Sunnyvale, California, where chipmakers, equipment suppliers and universities will develop new semiconductor processes alongside the company’s own engineers. TSMC, Intel, Samsung, SK hynix and Micron are among the founding partners.

Dresden-2026

October 12, 2026
GlobalFoundries has reached a construction milestone in its EUR 1.1 billion expansion in Dresden. The company also plans to develop and manufacture its next generation of FD-SOI technology at the site.

PCB-India_2

October 08, 2026
Gradiant named Hari Prasad as Managing Director, India, to lead its growth across semiconductors, data centers, and energy. The new contracts span chips, electronics, and clean energy, and include a repeat award from a global chipmaker expanding its fab.

October 06, 2026
Micron's revenue reached USD 54.2 billion in the fourth quarter of its 2026 fiscal year, almost five times the level of the same quarter last year. Rising memory prices pushed the gross margin to 87%, and the company expects supply to become even tighter in 2027 and 2028.

breaks-ground-new-cleanroom-Erfurt-2026

October 06, 2026
X-FAB has started construction of a new cleanroom at its site in Erfurt, Germany, to expand production of microsystems and photonics. The Fab4Micro project receives EUR 127.4 million in funding from the German federal government and the state of Thuringia under the EU Chips Act.

PCB-India_3

October 01, 2026
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

Electronics_Kelington

September 25, 2026
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.

Claus-Aasholm

September 24, 2026
The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.

campus-veldhoven

September 24, 2026
While High NA EUV will be adopted for production using the current 6-inch masks, the transition to larger, 12-inch masks is expected to further increase fab productivity, lower chipmaking costs and remove stitching constraints, benefiting the entire semiconductor industry.

Nexperia-deal

September 23, 2026
Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.

Electronics_Sumitomo_Chemical

September 23, 2026
Under the MoU, both companies have agreed to explore a collaboration whereby Sumitomo will supply semiconductor materials, including photoresists, functional chemicals, and high-purity chemicals to Tata Electronics’ upcoming Fab in Dholera, Gujarat.

PCB-India_2

September 21, 2026
The two Indian companies will jointly explore chip fabrication and packaging opportunities for L&T Semiconductor’s current and future products across Tata Electronics’ range of fab process technologies and packaging solutions.

tool

September 17, 2026
Rather than serving a single point in the water cycle, Gradiant will deliver its full semiconductor portfolio across these sites — from ultrapure water production to high-recovery wastewater treatment, scrubber reclaim, treatment of complex streams and zero liquid discharge.

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

Copenhagen-Quantum-fab

September 08, 2026
Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.

headquarters

September 07, 2026
Manz Asia contributes inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem. German manufacturer SUSS brings semiconductor process expertise and global customer reach.

Photonics-production

September 03, 2026
Swedish company Sivers Semiconductors is investing USD 30 million to expand its indium phosphide manufacturing facility in Glasgow, Scotland.

Indiana_groundbreaking

August 28, 2026
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

Oberkochen-building

August 26, 2026
Zeiss Semiconductor Manufacturing Technology has reached a milestone in its Oberkochen site expansion with the move-in to a new office building in July 2026, roughly four years after the groundbreaking ceremony in May 2022. In total, the expansion adds approximately 25,000 square metres of space for production and production-related areas at the site.

total-capex-forecast-csp-2027

August 26, 2026
DRAM and NAND Flash combined will account for 47% of major cloud service providers' total capital expenditure in 2026, rising to 68% in 2027, according to TrendForce. The shift reflects both soaring memory contract prices and surging procurement demand for AI infrastructure.

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