Progress in importation of US equipment dispels doubts on SMIC’s capacity expansion
March 08, 2021The major suppliers of WFE (wafer fab equipment) in the US are progressing smoothly in the application for license from the US government for the exportation of equipment systems, equipment parts, and customer services for 14nm and above processes to Chinese foundry SMIC, says TrendForce.
China’s semiconductor progress to take a hit as the US blacklists SMIC
December 08, 2020On December 3, the U.S. Department of Defense announced its latest sanctions against four Chinese companies, including SMIC, which is the leading foundry in China, according to TrendForce.
China's semiconductor industry to brace for impact as SMIC assesses export restrictions
October 05, 2020On October 4, 2020, SMIC made formal announcements assessing the Commerce Department’s notification to SMIC's suppliers that they will be restricted from shipping certain U.S.-originated equipment, components, and raw materials to the Chinese foundry, according to TrendForce's latest investigations.
U.S. may further crimp Huawei's global chip supply
March 26, 2020Senior Trump administration officials have reportedly agreed on new restrictions to curb the global supply of chips to China’s Huawei Technologies, sources are saying.
Micralyne increases capability with new equipment from SPTS
August 19, 2019MEMS fabricator Micralyne Inc., announces that the company has purchased a Versalis fxP Cluster System from SPTS Technologies, a KLA company.
KLA opens new R&D facility in Ann Arbor
June 13, 2019California-based global electronics company KLA opened a temporary research and development office Tuesday in Ann Arbor, with intentions of later establishing its second headquarters just outside the city.
Orbotech’s Sharon Cohen: ‘2019 is going to be great’
March 06, 20192018 proved to be great for equipment manufacturer Orbotech. In fact, it was a record year for Orbotech West (covering the Americas and Europe).
KLA completes acquisition of Orbotech
February 21, 2019KLA-Tencor Corporation says that the company has completed its acquisition of Orbotech Ltd.
Michigan on the move – new investments from Ford, Aptiv and Samsung
November 29, 2018The Michigan Strategic Fund (MSF) has recently approved several projects which are expected to generate more than 3’400 new direct jobs in the region.
KLA-Tencor to establish R&D facility in Michigan
October 29, 2018KLA-Tencor Corporation says that it plans to establish a R&D centre in Ann Arbor, Michigan. The plan includes an investment of more than USD 70 million and is set to create up to 500 new high-tech jobs in the region over the next five years.
KLA-Tencor to acquire Orbotech in a $3.4 billion deal
March 19, 2018Semiconductor equipment maker, KLA-Tencor Corp, has entered into a definitive agreement with Orbotech under which KLA will acquire the Israeli company in a deal valued at USD 3.4 billion.
List: Global Semi Wafer-Level manufacturing equipment revenue to grow
April 25, 2017Worldwide semiconductor wafer-level manufacturing equipment (WFE) revenue totaled USD 37.4 billion in 2016, an 11.3 percent increase from 2015. The top 10 vendors accounted for 79 percent of the market, up 2 percent from 2015.
Chinese AOI market: A review
February 08, 2016As electronic products develop towards miniaturization and low-energy consumption, their product components tend to be miniaturized.
Lam Research to acquire KLA-Tencor in a $10.6 billion deal
October 22, 2015Lam Research Corporation and KLA-Tencor Corporation have entered into a definitive agreement, for Lam Research to acquire all outstanding KLA-Tencor shares in a cash and stock transaction.
A*STAR and industry form R&D joint lab
July 28, 2014Four joint laboratories, representing a commitment of S$200m between private and public sectors, were launched between A*STAR’s Institute of Microelectronics (IME), and its 10 industry partners.
Gerald Li new president of ESI China
May 29, 2014Electro Scientific Industries, supplier of laser-based manufacturing solutions for the microtechnology industry, has hired Gerald Li as President of ESI’s China Operation.
Applied Materials names Gary Dickerson CEO
August 16, 2013Applied Materials announces that the Board has appointed Gary Dickerson as president and chief executive officer (CEO) and Mike Splinter as executive chairman of the Board, effective September 1, 2013.
Camtek appoints new executive positionsLoad more news
September 24, 2012Camtek has appointed Moshe Baruch as VP Technologies and Dr. Boaz Nitzan as VP of the DMD (Digital Material Deposition) product line.