NEXT partners with BAE to develop next-gen space-qualified chips
May 05, 2025
NEXT’s latest APU, the NX450, is the world’s first 200 GS/s antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively.
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indie partners with GF to boost automotive radar tech
March 07, 2025
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.
ESMC officially breaks ground on Dresden fab
August 20, 2024
Ground has been broken and the land preparation for ESMC's first semiconductor fab in Dresden, Germany has officially started.
EU approves €5 billion subsidy to support TSMC's German fab
August 20, 2024
The European Commission has approved, under EU State aid rules, a EUR 5 billion German measure to support European Semiconductor Manufacturing Company (ESMC) in the construction and operation of a microchip manufacturing plant in Dresden.
Construction at TSMC's Dresden plant could be weeks away
July 30, 2024
Work at TSMC's German facility has been delayed many times, but new reports suggest it is almost ready to break ground.
TSMC to start construction of European plant this year
May 22, 2024
TSMC is reportedly planning to start construction of its first European manufacturing facility during the fourth quarter of 2024.
Silicon Creations hits milestone of 10 million wafers in production with TSMC
April 23, 2024
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
TSMC increases its investment in US production to $65bn
April 08, 2024
Taiwan's contract chipmaker TSMC will build a new fab in Arizona in what is claimed to be the largest direct project investment by a foreign company ever.
Samsung to deliver Arm's next generation Cortex-X CPUs
February 26, 2024
Samsung Electronics has confirmed a partnership with Arm that will see the Korean chip maker optimise Arm's Cortex-X CPUs for its new Gate-All-Around (GAA) process technology.
Intel teases 1.4nm advanced manufacturing node
February 23, 2024
Intel CEO Pat Gelsinger has officially confirmed the firm's 14A node for the first time. He expects 14A and its variant Intel 14A-E to arrive by 2027.
Intel and UMC's partnership – a win-win for both
January 30, 2024
Intel and UMC officially announced their landmark collaboration on January 25, 2024, geared toward developing the 12-nanometer process. TrendForce believes that this partnership, which leverages UMC’s diversified technological services and Intel’s existing factory facilities for joint operation, not only aids Intel in transitioning from an IDM to a foundry business model but also brings a wealth of operational experience and enhances manufacturing flexibility.
Intel and UMC to develop 12nm process platform
January 26, 2024
Intel and United Microelectronics Corporation (UMC) will collaborate on a 12-nanometer process to be manufactured at Intel fabs in Arizona from 2027.
Apple to be first in line for TSMC's 2nm chips?
January 25, 2024
Online reports say Apple is at the front of the queue for chips built on TSMC's forthcoming 2-nanometer process.
Christian Koitzsch to head TSMC's European operation
January 05, 2024
Christian Koitzsch has left Bosch to become the president of TSMC's under-construction subsidiary in Dresden, Germany.
NXP's investment plans cover four European countries
September 26, 2023
Austria, Germany, the Netherlands, and Romania are all included in NXP Semiconductors’ European expansion plans.
TSMC, Bosch, Infineon, and NXP establishes European JV
August 08, 2023
TSMC, Bosch, Infineon and NXP plans to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services.
US DoD accredits GF's fab in New York
June 02, 2023
The US Department of Defense (DoD), through the Defense Microelectronics Activity (DMEA), Trusted Access Program Office (TAPO), has accredited GlobalFoundries’ advanced manufacturing facility in Malta, New York, as a Category 1A Trusted Supplier with the ability to manufacture secure semiconductors for a range of critical aerospace and defense applications.
Omni Design opens design centre in India
March 21, 2023
Omni Design Technologies, a provider of high-performance, low-power mixed-signal IP products, is opening a new design centre in Hyderabad, India.
TrendForce lists five tech industry trends for 2023
October 11, 2022
TrendForce is detailing 10 major trends that are expected to take place across various segments in the tech industry.
Added pressure on China – US restrictions now include memory
October 10, 2022
The U.S. Department of Commerce announced new semiconductor restrictions on October 7 in the United States. In addition to existing restrictions on the logic IC sector, this new update extends to the memory category.
Qualcomm deepens its ties with GlobalFoundries
August 09, 2022
GlobalFoundries and Qualcomm say they are more than doubling their existing long-term semiconductor manufacturing agreement.
Samsung begins production of 3nm process node with GAA
June 30, 2022
Samsung Electronics today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.
DENSO to take minority stake in TSMC and Sony fab
February 15, 2022
TSMC, Sony Semiconductor Solutions Corporation (SSS) and DENSO Corporation announces that DENSO will take a minority stake in Japan Advanced Semiconductor Manufacturing (JASM), TSMC’s majority-owned manufacturing subsidiary in Kumamoto Prefecture, Japan.
Annual foundry revenue to reach historical high in 2022
October 28, 2021
While the global electronics supply chain experienced a chip shortage, the corresponding shortage of foundry capacities also led various foundries to raise their quotes, resulting in an over 20% YoY increase in the total annual revenues of the top 10 foundries for both 2020 and 2021, according to TrendForce’s latest investigations.
When will this chip squeeze end? In 2H22 says TrendForce
October 07, 2021
A continued high demand and not enough capacity has seen the continuation of a very persistent chip shortage. But the question is, when can we expect this to end? Well, market intelligence provider TrendForce says it wont happen until the second half of 2022.
Top trends for 2022 - what can we expect?
September 20, 2021
Market researcher Trendforce has made prediction on what to watch out for in 2022. Here are three things the semiconductor industry might want to keep and eye on.
Foundry revenue with 6% QoQ growth thanks to persistent demand
August 31, 2021
The panic buying of chips persisted in 2Q21 owing to factors such as post-pandemic demand, industry-wide shift to 5G telecom technology, geopolitical tensions, and chronic chip shortages, according to TrendForce’s latest investigations.
Progress in importation of US equipment dispels doubts on SMIC’s capacity expansion
March 08, 2021
The major suppliers of WFE (wafer fab equipment) in the US are progressing smoothly in the application for license from the US government for the exportation of equipment systems, equipment parts, and customer services for 14nm and above processes to Chinese foundry SMIC, says TrendForce.
Wafer capacity by feature size shows strongest growth at <10nm
November 25, 2020
IC capacity for leading-edge (<10nm) processes is expected to grow and become the largest portion of monthly installed capacity across the industry beginning in 2024, based on information in IC Insights’ Global Wafer Capacity 2020-2024 report.
SK hynix & Robert Bosch invests in memory startup
November 20, 2020
Ferroelectric Memory GmbH (FMC), a developer of ferroelectric hafnium oxide memory technology, has completed a USD 20 million Series B funding.
TSMC files complaints against GlobalFoundries
October 01, 2019
TSMC says it filed multiple lawsuits on September 30, 2019 against GlobalFoundries in the United States, Germany and Singapore for its ongoing infringement of 25 TSMC patents by at least its 40nm, 28nm, 22nm, 14nm, and 12nm node processes.
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