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Top trends for 2022 - what can we expect?
Market researcher Trendforce has made prediction on what to watch out for in 2022. Here are three things the semiconductor industry might want to keep and eye on.
The foundry industry welcomes the arrival of 3nm process technology courtesy of TSMC’s FinFET and Samsung’s GAA technologies As semiconductor manufacturing processes gradually approach physical limits, chip development must now turn to either “changes in transistor architecture” or “breakthroughs in back-end packaging technology or materials” in order to achieve faster performances, reduced power consumption, and smaller footprints. After incorporating EUV lithography at the 7nm node in 2018, the semiconductor industry will welcome yet another revolutionary process technology in 2022 – the 3nm node. More specifically, TSMC and Samsung are expected to announce their respective 3nm process technologies in 2H22. While the former will continue to adopt the FinFET architecture that it has been using since the 1Xnm node, Samsung will for the first time utilize its own implementation of GAAFET, called MBCFET (multi-bridge channel field-effect transistor) for its 3nm process technology. In contrast with the FinFET architecture, in which the gate makes contact with the source/drain channel on three sides, the GAAFET architecture consists of a gate that surrounds the nanowire or nanosheet channel on four sides, thus increasing the surface area of contact. The GAAFET design significantly reduces leakage currents by giving the gate a greater degree of control over the channel. Regarding possible applications, the first batch of products mass produced at the 3nm node in 2H22 is expected to primarily be HPC and smartphone chips since these products place a relatively high demand on performance, power consumption, and chip compactness. While DDR5 products gradually enter mass production, NAND Flash stacking technology will advance past 200 layers The three dominant DRAM suppliers (Samsung, SK Hynix, and Micron) will not only gradually kick off mass production of next-gen DDR5 products, but also continue to increase the penetration rate of LPDDR5 in the smartphone market in response to demand for 5G smartphones. With memory speed in excess of 4800Mbps, DDR5 DRAM can massively improve computing performances via their fast speed and low power consumption. As Intel releases its new CPUs that support DDR5 memory, with Alder Lake for the PC segment, followed by Eagle Stream for the server segment, DDR5 is expected to account for about 10-15% of DRAM suppliers’ total bit output by the end of 2022. Regarding process technologies, Samsung and SK hynix will kick off mass production of 1 alpha nm products manufactured with EUV lithography. These products’ market shares will likely increase on a quarterly basis next year. Turning to NAND Flash products, their stacking technologies have yet to reach a bottleneck. Hence, after 176L products entered mass production in 2021, suppliers will continue to migrate towards 200L and above in 2022, although these upcoming products’ chip densities will remain at 512Gb/1Tb. Regarding storage interfaces, the market share of PCIe Gen4 SSDs will likely skyrocket in the consumer PC segment next year. In the server segment, as Intel Eagle Stream CPUs, which support PCIe Gen 5, enter mass production, the enterprise SSD market will also see the release of products that support this interface. Compared to the previous generation, PCIe Gen 5 features double the data transfer rate at 32GT/s and an expanded storage capacity for mainstream products at 4/8TB in order to meet the HPC demand of servers and data centers. Additionally, the release of PCIe Gen 5 SSDs is expected to quickly raise the average data storage capacity per server unit. Regarding the server market, flexible pricing schemes and diverse services offered by CSPs have directly propelled the cloud service demand of enterprises in the past two years. From the perspective of the server supply chain, the predominant business model has gradually transformed from traditional server brands to ODM Direct, meaning that traditional server brands will see fundamental, structural changes, such as providing colocation servers or full-service cloud migration support, in their business models. This shift also means that enterprise clients will come to rely on more flexible pricing schemes and diverse risk mitigation measures in response to an uncertain global environment. In particular, while the pandemic accelerated changes in work and everyday life in 2020, hyperscalers are expected to account for nearly 50% of total demand for servers in 2022. In addition, the growth in ODM Direct server shipment is expected to surpass 10% YoY as well. The third-generation semiconductor industry will move towards 8-inch wafers and new packaging technologies while expanding in production capacity The gradual phasing out of ICE vehicles by various governments across the 2025-2050 period is set to both accelerate the pace of EV sales and increase the penetration rate of SiC and GaN devices/modules. Energy transition activities worldwide as well as the rapid growth of telecom applications such as 5G technology have also led to a persistent bull market for third-generation semiconductors, resulting in strong sales of SiC and Si substrates. However, as current efforts in substrate production and development are relatively limited, suppliers are able to ensure a steady yield of SiC and GaN substrates only by manufacturing them with 6-inch wafers. Such a limitation has, in turn, led to a long-term shortage in foundries’ and IDMs’ production capacities. In response to this quandary, substrate suppliers, including Cree, II-VI, and Qromis, are now planning to not only expand their production capacities in 2022, but also migrate their SiC and GaN production to 8-inch wafers, in hopes that these plans will gradually alleviate the prevailing shortage in the third-generation semiconductor market. On the other hand, foundries such as TSMC and VIS are attempting to shift to 8-inch wafer fabrication for GaN on Si technology, while major IDM Infineon is releasing products based on the latest CoolSiC MOSFET, delivering trench designs that enable significant power efficiency for semiconductor devices. Finally, telecommunication component provider Qorvo has also released a new GaN MMIC copper flip chip packaging architecture for military applications.
Seven more Top Trends can be found on Trendfprce's website.
Seven more Top Trends can be found on Trendfprce's website.
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Intel and ASML strengthen their collaboration Intel has made its first purchase order for ASML’s TWINSCAN EXE:5200 system, marking the next step on the path to EUV 0.55 NA (High-NA) introduction.
Investment firm HAL invests in Prodrive Technologies Netherlands-based high-tech electronics company, Prodrive Technologies, announces a minority investment by investment company HAL.
Chroma acquires ESS Chroma ATE Inc. has acquired 100% of the shares of Environmental Stress Systems, Inc. (ESS).
TSMC earmarks $40+ billion for manufacturing expansion The worlds biggest semiconductor foundry says that it will increase capital spending to between USD 40 billion and USD 44 billion this year – after having spend USD 30 billion last year.
Siltronic and GlobalWafers deal at a standstill In light of current market reports, Siltronic AG has issued an update stating that there has been no real progress on the German investment review of the takeover by GlobalWafers.
Mycronic receives order for an SLX mask writer The Swedish manufacturer of production equipment for the electronics industry says it has received an order for an SLX mask writer from a new customer in Asia.
Semiconductor heavyweights urge congress to act on crisis IBM and 40+ business and academic leaders urges the New York state congressional delegation to act on the semiconductor crisis.
Verimatrix sold its portfolio of NFC patents to Infineon Verimatrix announces that it has sold its historical portfolio of NFC patents to semiconductor company Infineon Technologies AG for nearly USD 2 million.
JLT completes acquisition of French sales partner JLT Mobile Computers, a developer of computing solutions for demanding environments, has completed its acquisition of longtime French sales partner ID Work.
Rohm suspends Tianjin plant amid Covid-19 outbreak Following the outbreak of the new coronavirus variant in Tianjin, China on January 9, restrictions on movement have been imposed, including the start of PCR testing for all citizens. As a result, Rohm has temporarily suspended its Tianjin plant since January 9.
EMD Electronics expands with new factory in Arizona EMD Electronics, the North American Electronics business of Merck KGaA, Darmstadt, Germany, is expanding with a new factory in the greater Phoenix, Arizona area for the manufacture of equipment for its Delivery Systems & Services (DS&S) business.
Swedish biometrics company team up with Infineon Precise Biometrics has teamed up with Infineon to jointly provide fingerprint technology to allow various applications, including automated adjustments of driver settings in vehicles.
STMicro expects Q421 revenues of $3.56B Semiconductor manufacturer, STMicroelectronics, says that its preliminary and unaudited net revenues for the fourth quarter of 2021 are above its business outlook range.
Allegro MicroSystems appoints new Chief Financial Officer Allegro MicroSystems' Senior Vice President Chief Financial Officer and Treasurer, Paul Walsh, will be retiring.
Avnet Embedded opens new design centre in Germany In a move to further strengthen and expand its design competence of standardised and customised embedded products, Avnet Embedded opened a new design center in Deggendorf, Germany, on January 1, 2022.
TANAKA Denshi Kogyo to open new plant in China Japanese company TANAKA Denshi Kogyo will, via a subsidiary, establish a new plant in Hangzhou City, China, for the production of aluminum bonding wires for power semiconductors. The plant is scheduled to commence operations in November of 2022.
A*STAR and Soitec to develop next-gen SiC semiconductors The Institute of Microelectronics (IME) at the Agency for Science, Technology and Research (A*STAR) and Soitec have entered into a research collaboration with the aim of developing next-generation silicon carbide (SiC) semiconductor devices to power electric vehicles.
From Micron to Intel – David Zinsner joins as CFO Intel has appointed David Zinsner as the company’s executive vice president and chief financial officer (CFO), effective Jan. 17, 2022.
Neumonda brings Intelligent Memory to EMEA Neumonda, a specialty memory company with the “DNA” of former memory manufacturer Qimonda, announces that it has brought its subsidiary, Intelligent Memory (IM) – an independent manufacturer of industrial grade memory solutions – to Europe.
ASML provides an update on Berlin fire ASML is providing an update on the fire that occurred inside a part of its factory in Berlin, Germany on the third of January.
Elbit sells its Power and Control business in the UK Elbit Systems says that its UK subsidiary, Elbit Systems UK, has sold the Power and Control Business of its subsidiary Ferranti Technologies, to TT Electronics for approximately USD 12 million in cash.Load more news