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AiRob-Piotr-Owczarek_2_1

"Artificial intelligence will support us, not replace us"

March 10, 2026
High-mix, low-volume production has long been one of the most complex operational environments in the EMS industry. Short production runs, high product variability, frequent changeovers and constant time pressure mean that factories operate in a state of near-constant adaptation. At the same time, customer expectations for quality and flexibility continue to rise, while the availability of skilled labour remains limited. In such conditions, manufacturing ceases to be a collection of independent processes — it becomes a system in which every change carries wider operational consequences.


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Equipment

Defence electronics in 2025: Key developments followed by the Evertiq audience

December 22, 2025
Defence electronics has become one of the fastest-growing segments of Europe’s technology landscape. Rising military budgets, new procurement cycles, digitalisation of battlefield systems and the need for resilient supply chains are transforming the electronics industry into a strategic pillar of national security. Reading patterns on Evertiq clearly show that the audience is most interested in topics related to industrial collaboration, AI in defence, robotics, component manufacturing, sourcing, and critical materials.




hq

Toppan boosts FC-BGA substrate production for AI chips

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.





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