Tessalia plans €250M semiconductor packaging site in France June 04, 2026 Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.
Nvidia, TSMC use AI to advance chip design and manufacturing June 03, 2026 Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.
Global EMS grew in 2025 – Europe watched from the sidelines June 01, 2026 Following his keynote at Evertiq Expo Zürich, in4ma founder and analyst Dieter Weiss had an interview with Evertiq to discuss the numbers behind global EMS growth in 2025 – and what they reveal about where the European industry stands.
Fractile raises $220M to build next generation of inference hardware May 28, 2026 The financing round was led by Accel, Factorial Funds, and Founders Fund, with participation from Conviction, Gigascale, 01A, Felicis, Buckley Ventures and 8VC, alongside existing backers.
Huawei proposes Tau Scaling Law as successor to Moore's Law May 27, 2026 At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.
IBM announces US quantum chip foundry with $1B CHIPS support May 27, 2026 The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.
SK hynix unveils ‘iHBM’ thermal solution to boost AI performance May 27, 2026 This latest heat management solution helps reduce thermal resistance by 30% and enables chips to operate stably even in high-temperature and high-pressure conditions.
Huawei says it can deliver 1.4-nm equivalent chips by 2031 May 25, 2026 Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.
Commission approves €288M German state aid for chip value chain May 25, 2026 Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.
Wingtech sues Nexperia leadership – invoking China's anti-sanctions law May 25, 2026 The Nexperia dispute has taken a significant new turn. Parent company Wingtech Technology has filed a lawsuit against Nexperia and three members of its leadership team in a Chinese court, demanding CNY 8 billion (EUR 1 billion) in damages and calling for the reversal of Dutch governance measures it characterises as discriminatory.
UK firm Quantum Motion raises $160 million in Series C May 20, 2026 The financing positions Quantum Motion to deliver utility-scale and commercially viable quantum computers that fit inside existing standard data centres and racks.
Meta partners with AWS on Graviton chips to power agentic AI May 20, 2026 This agreement builds on Meta’s long-standing relationship with AWS, and expanding to include Amazon’s custom silicon, supports Meta’s broader goal of diversifying compute to meet the demands of the AI systems it’s building.
Evertiq Expo Lund: Strategies, security and the hardware Europe is missing May 19, 2026 Factories are being built, strategies are being written and investments are being made at a pace the electronics industry has not seen in decades. What is actually happening — and what is still missing — is the theme of this year's Expo in Lund.
Indian semiconductor startup HrdWyr raises $13 million May 14, 2026 HrdWyr develops chips for sectors such as consumer electronics, EVs, industrial systems and data centres. The funding will accelerate the development of the company’s AISoC products and expand customer engagements across key global markets.
Indian startup BigEndian Semiconductors raises $6 million May 11, 2026 The fresh funds will be used to commercialise the Bengaluru-based fabless startup’s first system on chip SoC, scale product engineering, and boost partnerships across foundries, IP ecosystems and OEMs.
Inside Fab 21: TSMC reveals Arizona chip production site May 08, 2026 TSMC has released a video showcasing its semiconductor manufacturing operations in Arizona, offering a rare glimpse inside its expanding US production site, known as Fab 21.
NEO partners with South Korean Army to advance battery solutions May 08, 2026 The agreement builds on NEO’s momentum in its Korean Defense Integration Strategy and serves as a milestone due to the Capital Defense Command’s ability to advocate for the prompt implementation of non-Chinese battery solutions.
Lattice Semiconductor to buy software firm AMI in $1.65B deal May 08, 2026 The acquisition brings together Lattice’s low power FPGAs with AMI’s platform firmware and infrastructure manageability solutions for cloud and AI to create a complete portfolio of secure management and control solutions.
India approves semiconductor projects worth $400 million May 07, 2026 Crystal Matrix will establish an integrated facility for compound semiconductor fabrication and ATMP while Suchi Semicon will set up an OSAT facility for manufacturing discrete semiconductors, in Gujarat.
Applied Materials acquires NEXX business from ASMPT May 06, 2026 US semiconductor equipment maker Applied Materials has entered into a definitive agreement to acquire the NEXX business from ASMPT, adding panel-level electrochemical deposition technology to its advanced packaging lineup.
Rebellions partners with SKT, Arm to bolster AI infrastructure May 06, 2026 This alliance aims to address the surging demand in the inference market and set standards for high-performance, energy-efficient sovereign AI infrastructure.
Mosaic SoC raises $3.8M to advance spatial intelligence May 06, 2026 The Swiss semiconductor startup builds integrated circuits that process visual and positional sensor data to give devices a real-time understanding of where they are and what’s around them.
Europe is building a system without a physical foundation May 05, 2026 Europe is investing billions in artificial intelligence, semiconductors, and data centres. These investments are meant to strengthen the region’s technological position and reduce external dependencies. But the question is becoming harder to ignore: to what extent is Europe building a system on a foundation that does not physically exist?
GPV improves profitability in Q1 despite falling sales May 05, 2026 Danish EMS provider GPV reported improved earnings in the first quarter of 2026, as structural measures implemented during 2025 began to take effect — even as sales declined and supply chain pressures mounted.
Digitalisation increases risk. Companies are not ready May 05, 2026 Just a year ago, during the panel “Cybersecurity in the era of integrated electronic systems” at Evertiq Expo Kraków, uncertainty dominated the discussion. Companies knew new regulations were coming, but lacked clarity – both in terms of scope and implementation. Today, that situation is beginning to shift. Regulations are coming into force, and with them, pressure is mounting – particularly in the industrial and electronics sectors – to treat cybersecurity as an operational concern, not merely a formal requirement.
Rheinmetall, Boeing partner on German MQ-28 Ghost Bat May 04, 2026 Boeing’s MQ-28 Ghost Bat, a proven autonomous collaborative combat aircraft (CCA), has completed more than 150 flights and has been designed, developed and manufactured in Australia for the Royal Australian Air Force and other allied nations.
Advantest partners with Applied Materials, joins EPIC platform May 04, 2026 As the first automated test equipment (ATE) company to join the platform, Advantest will partner with Applied Materials to strengthen the links between front-end manufacturing technologies and back-end testing of chips and packages.
Accenture, Vodafone Procure & Connect, SAP advance humanoid robotics May 01, 2026 SAP led the integration of the robots into the warehouse management system, while Accenture designed and deployed the robot intelligence and operational framework, drawing on its expertise in physical AI, advanced robotics and digital twin environments.
IndieSemiC, Nordic to develop wireless modules for connected devices April 27, 2026 Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.
Rina, Hanwha to advance battery-hybrid propulsion systems April 27, 2026 The partnership brings together Hanwha’s expertise in propulsion, energy storage and systems integration with Rina’s regulatory and certification know-how, fostering the development and adoption of next-generation propulsion solutions for the maritime sector.
Neura partners with AWS to accelerate Physical AI at scale April 27, 2026 By running the Neuraverse on Amazon Web Services (AWS) and connecting Neura Gym to AWS services, Neura Robotics can accelerate how robotic intelligence is trained, tested, and continuously improved across customer, partner and internal use cases.
ASML reports €8.8 billion in Q1 sales, raises full-year outlook April 22, 2026 ASML reported total net sales of EUR 8.8 billion and net income of EUR 2.8 billion for the first quarter of 2026.