Evertiq - First In Electronics News & Expo

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October 27, 2026
Intel has agreed to acquire Classiq, an Israeli developer of quantum computing software. The deal would combine Classiq’s software with Intel’s own silicon spin qubits and manufacturing, turning Intel’s quantum computing group into a full-stack business.

Chip-fab-new-Villach-inside-01

October 27, 2026
Infineon will invest around EUR 1.1 billion by 2034 to set up high-volume production of gallium nitride (GaN) power semiconductors on 300mm wafers at its site in Villach, Austria. According to the company, it will be the first high-volume GaN fab of its kind in the world, with production scheduled to start by the end of 2027.

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geralt-computer-chip

October 26, 2026
As part of the agreement, Rambus is adopting the ChipAgents platform companywide, including deployment across its chip and silicon IP design and verification workflows to accelerate the pace of development.

USA

October 23, 2026
Under the final awards, each company will conduct R&D to address critical projects spanning power semiconductor devices, modules and materials essential to the semiconductor supply chain.

TOP-10

October 22, 2026
The ten largest semiconductor suppliers grew their revenue by more than 30% in 2025, almost three times as fast as the rest of the industry. According to Omdia data presented at Evertiq Expo Warsaw on October 22, they now account for nearly 68% of a market worth USD 831 billion.

AI-Chip

October 22, 2026
Nvidia and Samsung Electro-Mechanics will jointly invest in dedicated ABF substrate production lines in South Korea, under a multi-year agreement that makes the Korean company a supplier of package substrates for Nvidia's AI processors and networking switches.

substrate

October 21, 2026
Samsung Electro-Mechanics will supply package substrates for memory semiconductors to an unnamed global customer throughout 2027, under a long-term supply agreement worth KRW 360.5 billion (approximately USD 271 million).

iphone18

October 21, 2026
Qnity Electronics will produce films for the variable aperture camera in the iPhone 18 Pro in the US. The deal is part of an expansion of Apple’s American Manufacturing Program, under which nearly 100 components in Apple’s newest iPhones now come from American companies.

foundry-building-render

October 21, 2026
Dutch photonic chip foundry New Origin has cleared what it describes as the biggest obstacles for its planned fab at Kennispark in Enschede. Feasible solutions are now in place for both power and water supply, although the agreements still need to be worked out and finalised.

Stephane-Klajzyngier

October 20, 2026
We have become very good at defending what little we have left. That instinct must be balanced with the winning spirit.

October 19, 2026
TSMC plans to build a new 3nm fab in Tainan, with production slated to start in the first half of 2028. The company is also moving some 5nm capacity over to 3nm as demand for its leading-edge processes continues to grow.

Joonas-Mikkila-top

October 19, 2026
Technology Industries of Finland publishes its recommendations on the Chips Act 2.0. The Commission has built the right framework. Whether it works depends on where the money goes and who decides.

leadership

October 19, 2026
The London-based startup will use the investment to grow its engineering and commercial teams, bring its products to market, support customers as they adopt its chips, and strengthen its presence in the US alongside its UK and European base.

Team

October 16, 2026
Autonomous machines need three kinds of computing to work together so they can perceive, think and act in the real world. German startup Ubitium is building one universal processor to replace the stack of specialised chips.

quantum-computer_geralt

October 16, 2026
The fresh funding will enable the Spanish company to scale and industrialize its quantum computers, advance the development of new generations of chips, and increase its manufacturing and deployment capacity.

new-york-fabs-2026

October 14, 2026
GlobalFoundries has been selected to operate two new fabs at its site in Malta, New York, financed by Japan through up to USD 21 billion under the US-Japan trade agreement. In a separate agreement, the US government will also take an equity stake of around 4% in the company.

employees-at-specialty-manufacturing-facility-Eindhoven-Netherlands

October 14, 2026
Eindhoven-based specialty foundry XIVER has received EUR 28 million in debt financing from ABN AMRO. The money is part of a EUR 55 million programme to expand and modernise its production of photonic chips and other microsystems.

Poland-1

October 14, 2026
Poland’s semiconductor market could grow from USD 5.1 billion in 2025 to USD 23.7 billion by 2035. A report by Bank Gospodarstwa Krajowego (BGK), Poland’s state development bank, also identifies opportunities for the domestic sector not in building chip fabrication plants, but in developing integrated circuit design, power electronics, photonics, and semiconductor assembly and testing technologies. The outlook for an industry that is becoming increasingly important to European manufacturing will also be discussed at Evertiq Expo in Warsaw, scheduled for 22 October at PGE Narodowy Stadium.

EPIC-centre-2026

October 13, 2026
Applied Materials has unveiled its EPIC Center in Sunnyvale, California, where chipmakers, equipment suppliers and universities will develop new semiconductor processes alongside the company’s own engineers. TSMC, Intel, Samsung, SK hynix and Micron are among the founding partners.

axonite_chip

October 12, 2026
Tessolve is a Bangalore-based semiconductor engineering company offering end-to-end solutions across chip architecture, design, validation, testing and embedded systems. The investment round was spearheaded by US firm Vector Line.

Dresden-2026

October 12, 2026
GlobalFoundries has reached a construction milestone in its EUR 1.1 billion expansion in Dresden. The company also plans to develop and manufacture its next generation of FD-SOI technology at the site.

ZuriQ-partnership-advance-scalable-quantum-chips

October 08, 2026
Infineon and Swiss quantum computing start-up ZuriQ are expanding their collaboration to scale ZuriQ's trapped-ion architecture towards larger qubit counts. The partnership combines ZuriQ's chip design with Infineon's semiconductor manufacturing, advanced packaging and integrated photonics.

PCB-India_2

October 08, 2026
Gradiant named Hari Prasad as Managing Director, India, to lead its growth across semiconductors, data centers, and energy. The new contracts span chips, electronics, and clean energy, and include a repeat award from a global chipmaker expanding its fab.

Cellnex-Poland

October 07, 2026
Cellnex Poland has selected Ericsson as one of its suppliers for the modernisation and expansion of its 5G radio access network. The scope covers radios, RAN compute modules, microwave links, antennas and enclosures, and several of the products are being deployed at scale for the first time.

Taichung-Taiwan

October 07, 2026
A union representing Micron employees in Taoyuan, Taiwan, has secured its members' backing for a strike over the company's bonus scheme, Reuters reports. Taiwan is a key production base for Micron's DRAM and HBM chips, and a strike could add to supply concerns in an already tight memory market.

breaks-ground-new-cleanroom-Erfurt-2026

October 06, 2026
X-FAB has started construction of a new cleanroom at its site in Erfurt, Germany, to expand production of microsystems and photonics. The Fab4Micro project receives EUR 127.4 million in funding from the German federal government and the state of Thuringia under the EU Chips Act.

Electronics_chiller_factory

October 05, 2026
The company plans to invest a total of USD 110 million in a new air-cooled chiller production facility in the US and in expanding two air-cooled chiller production lines in South Korea.

Liquide_gases

October 02, 2026
Air Liquide will build, own and operate several production units to deliver large volumes of ultra-pure nitrogen, oxygen, argon and hydrogen, including significant backup storage capacity.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

EPIC-center

September 30, 2026
Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.

CSBC_agreement

September 28, 2026
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

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