ASMPT and IBM extend chiplet R&D collaboration
ASMPT and IBM have renewed their agreement to conduct research on chiplet packaging technologies. They will work together to advance thermo-compression and hybrid bonding technology using ASMPT’s Firebird TCB and Lithobolt hybrid bonding tools.
Weeroc pledges $4.5 million for Malaysian expansion
France's fabless microelectronics company Weeroc has signed a letter of intent with the Selangor Information Technology & Digital Economy Corporation (Sidec).
Infineon signs MOU with Chinese battery supplier EVE Energy
Under the agreement, Infineon will supply a chipset solution for EVE Energy's next-generation battery management system.
Singapore woos wafer fabs with real estate offer
A Singaporean government agency has announced an 11% increase in land allocated for wafer manufacturing in an attempt attract more inward investment.
SEMI launches MoU to foster collaboration on sustainability
The semiconductor trade body SEMI has formed a partnership with the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES) to promote sustainable manufacturing.
Shinryo lines up buy-out of Indian cleanroom firm
Japanese industrial giant Shinryo Corporation will acquire GMP Technical Solutions, India’s 2nd largest cleanroom business.
Samsung acquires UK-based knowledge graph company
Samsung Electronics has signed an agreement to buy Oxford Semantic Technologies in a move that should accelerate the development of on-device AI in its smartphones and home appliances.
EU and South Korea launch joint chip research projects
The European Union and the Republic of Korea have announced four jointly funded projects to boost innovation in semiconductors. The partners will invest €6 million each in the scheme.
TSMC beats expectations with bumper Q2 profits
The world's largest contract chip manufacturer, TSMC, has reported Q2 net profits of $7.60 billion – up from around £5 billion a year earlier.
Vietnam partners with US firms on semiconductor training
Vietnam's National Innovation Center will work with two American firms, Qorvo and Cadence Design, to train 50,000 Vietnamese semiconductor engineers by 2030.
SK to restructure chip processing and distribution arm?
SK Group is rumoured to be planning an internal reorganisation that will merge SK Inc's semiconductor processing and distribution company, Essencore, with its industrial gas company, SK materials airplus.
US government approves $400m grant to GlobalWafers
The Biden administration will assign USD 400 million to help Globalwafers develop its manufacturing projects in Texas and Missouri.
LG to open HVAC R&D lab in Frankfurt
LG Electronics will form a 'global R&D triangle' comprising existing labs in Changwon, South Korea, and Atlanta, US, and a just-announced 10,000 square foot facility in Germany.
BYD to build $1bn EV megaplant in Turkey
The fast-growing Chinese automaker BYD has announced plans to build a vast manufacturing facility in Turkey's Manisa province.
Systrome opens new manufacturing plant in Kerala
India's Systrome Networks has launched a new $12m electronics manufacturing facility in Thiruvananthapuram in its home region of Kerala.
Smartphone sales up 6.5% in Q2 2024
The recovery is well under way: After many quarters of decline, the market for smartphones is booming again according to new data from IDC.
AESC Group starts work on a $1.1bn battery plant in Spain
Japan-based electric vehicle (EV) battery manufacturer AESC has broken ground on a full scale facility at Navalmoral de la Mata in Spain’s Caceres province.
Mouser wins global distribution deal with Sanan
Mouser Electronics has signed an agreement with with Sanan Semiconductor to sell and distribute the latter's silicon carbide (SiC) products, including industrial and automotive SiC Schottky barrier diodes (SBDs) and SiC MOSFETs.
L&T and Aditya Infotech team up to develop SoCs for CCTV
Two Indian electronics firms have formed an official collaboration to develop and supply systems-on-chip (SoC) and other solutions for CCTV cameras.
Chinese EDA startup slashes workforce in half
X-Epic, a Chinese developer of electronic design automation (EDA) tools, is rumoured to be laying off 50% of its workers.
Huawei completes $1.4bn Lianqiu R&D facility
The vast centre has enough capacity to be home to around 35,000 researchers and even comprises its own miniature train network.
Melexis opens its largest wafer testing plant
Belgian microelectronics engineering firm Melexis has opened a 4,500 square metre wafer testing facility in Kuching, Malaysia. It says the architect-designed plant is its biggest to date.
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