GlobalWafers increases its offer for Siltronic
GlobalWafers says it has increased its all-cash takeover offer of Siltronic, by its subsidiary GlobalWafers GmbH, to EUR 140 per Siltronic share.
CML recertified according to ISO 9001:2015 CML announces that CML Europe and CML Automotive GmbH have successfully passed the ISO 9001 recertification audit and have renewed the certification.
Tobey Gonnerman named Fusion Worldwide's new President The global sourcing distributor announces that Tobey Gonnerman has been appointed as the company’s new President.
Industry R&D spending to rise 4% after 2020 record Intel stays on top of research and development ranking, but its share of total industry R&D expenditures dipped after its spending decreased 4% in 2020. AMD moved into the R&D top 10, says new report.
Sponsored content by Shenzen Kinwong ElectronicThe development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Solving the Cable TV Infrastructure Downstream Transmitter Challenge Driven by demand for faster internet connectivity, the cable TV industry has developed new network architectures for the delivery of multigigabit services to subscribers. This fiber deep approach, using a remote PHY device (RPD), moves critical hardware closer to the users by using digital fiber.
Farnell becomes a global distribution partner NI the distributor of electronic components, products and solutions has been appointed as an NI Authorized Distributor, expanding its product portfolio to include NI software-connected test and measurement solutions for customers of all sizes.
Foxconn and Winbond invest in chipmaker Kneron Foxconn and Winbond joins companies such as Qualcomm, Horizons, Sequoia and Weltrend as high profile investors in Kneron
Denso team up with Aeva to develop sensing and perception systems Mobility supplier Denso says that it is partnering with U.S. LiDAR and perception systems company, Aeva, to develop next-generation sensing and perception systems.
TrendForce expects 5-10% price hike for LED chips While major OEMs such as Apple and Samsung prepare to release their new notebook computers, tablets, and TVs that are fully equipped with Mini LED backlights this year, various companies in the LED supply chain began procuring Mini LED chips ahead of time in 4Q20, leading to an explosive demand growth for these chips, which in turn crowded out the LED suppliers’ production capacities for other mainstream LED chips.
Fire hit Taiwanese MLCC manufacturer in China On January 13 a fire broke out at Taiwanese passive component maker Walsin Technology’s Dongguan, China site.
New Korean Zestron Technical Center opens for customers The provider of high precision cleaning products has expanded its operations by opening a new Technical Center, located in Anyang, Korea.
A2 Global Electronics names new executives Electronic component distribution and supply chain service provider, A2 Global Electronics, has appointed Anthony Andriano as its new Chief Financial Officer and promoted Jesper Romell as its new President.
ROHM expands production capacity of SiC power devices ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant, which the company started building back in February 2019, to enhance the production capacity of SiC power devices.
TDDI IC shipments poised for growth due to strong end-demand Given the forecasted recovery of the smartphone market and the corresponding rise in TDDI IC demand throughout this year, total smartphone TDDI IC shipment for 2021 is expected to reach 760 million units, according to TrendForce’s latest investigations.
Limited IC supply to bottleneck monitor panel shipments The stay-at-home economy generated by the COVID-19 pandemic has resulted in persistent demand for IT products such as monitors, says TrendForce.
LG and Magna team up to tackle the electric powertrain market LG Electronics and Magna International are forming a joint venture to manufacture e-motors, inverters and on board chargers and, for certain automakers, related e-drive systems to support the growing global shift toward vehicle electrification.
Security that builds value: managed NAND as a foundation for IoT security One of the fastest growing markets in the semiconductor industry is that of non-volatile memory (NVM). Among the main drivers for this enormous growth in data generation are vast movements towards cloud storage, the Internet of Things (IoT), and autonomous driving.
Padget Electronics to manufacture smartphones for Motorola Indian EMS provider Dixon Technologies, announces that its subsidiary, Padget Electronics, has signed agreement with Motorola for manufacturing of smart phones.
A2 Global expands with new facility in Singapore Electronic component distribution and supply chain service provider, A2 Global Electronics, announces the opening of its new distribution facility located in the New Tech Park area of Singapore.
TSMC to kick off mass production of Intel CPUs in 2H21 Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations.
Pat Gelsinger to replace Bob Swan as Intel CEO Intel has appointed 40-year technology industry veteran Pat Gelsinger as its new chief executive officer, effective February 15, 2021. He will succeed Bob Swan, who will remain CEO until Pat starts.
iCoupler Technology Benefits Gallium Nitride (GaN) Transistors in AC/DC Designs Highly efficient ac/dc power supplies are key to the evolution of the telecom and datacom infrastructure, as power consumption grows rapidly due to hyperscale data centers, enterprise servers, or telecom switching stations. However, the power electronics industry has reached the theoretical limit of silicon MOSFETs.
Geely and Foxconn form joint venture Geely Holding and Foxconn are looking to establish a joint venture company to provide OEM and customised consulting services – providing whole vehicles, parts, intelligent drive systems and automotive ecosystem platforms to global automotive companies.
Five mega-deals pushed M&A value to $118B last year The value of the mergers and acquisitions seen last year within the semiconductor industry set a new record. Five big acquisition announcements and more than a dozen smaller deals in 2020 pushed the total value of M&A agreements in the year to an all-time high of USD 118.0 billion, surpassing the previous record of USD 107.7 billion reached in 2015
ViTrox with a new sales channel partner in Thailand Machine vision inspection solutions provider, ViTrox Technologies, has entered into a partnership with MTSC (Thailand) Co., Ltd for Thailand region.
Power outage at UMC Lixing causes large-scale voltage drops in vicinity An abnormality which caused a power outage in the GIS (gas insulated switchgear) equipment at UMC’s facilities on Lixing Road, Hsinchu, resulted in a voltage drop for other fabs located in the surrounding area, according to TrendForce’s latest investigations.
UTAC completes acquisition of Singapore wafer bumping assets UTAC Holdings Ltd. says that its affiliate has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology (Singapore) Pte. Ltd.Load more news