CML recertified according to ISO 9001:2015
CML announces that CML Europe and CML Automotive GmbH have successfully passed the ISO 9001 recertification audit and have renewed the certification.
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Tobey Gonnerman named Fusion Worldwide's new President
The global sourcing distributor announces that Tobey Gonnerman has been appointed as the company’s new President.
Industry R&D spending to rise 4% after 2020 record
Intel stays on top of research and development ranking, but its share of total industry R&D expenditures dipped after its spending decreased 4% in 2020. AMD moved into the R&D top 10, says new report.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Solving the Cable TV Infrastructure Downstream Transmitter Challenge
Driven by demand for faster internet connectivity, the cable TV industry has developed new network architectures for the delivery of multigigabit services to subscribers. This fiber deep approach, using a remote PHY device (RPD), moves critical hardware closer to the users by using digital fiber.
Farnell becomes a global distribution partner NI
the distributor of electronic components, products and solutions has been appointed as an NI Authorized Distributor, expanding its product portfolio to include NI software-connected test and measurement solutions for customers of all sizes.
Foxconn and Winbond invest in chipmaker Kneron
Foxconn and Winbond joins companies such as Qualcomm, Horizons, Sequoia and Weltrend as high profile investors in Kneron
Denso team up with Aeva to develop sensing and perception systems
Mobility supplier Denso says that it is partnering with U.S. LiDAR and perception systems company, Aeva, to develop next-generation sensing and perception systems.
Fire hit Taiwanese MLCC manufacturer in China
On January 13 a fire broke out at Taiwanese passive component maker Walsin Technology’s Dongguan, China site.
New Korean Zestron Technical Center opens for customers
The provider of high precision cleaning products has expanded its operations by opening a new Technical Center, located in Anyang, Korea.
A2 Global Electronics names new executives
Electronic component distribution and supply chain service provider, A2 Global Electronics, has appointed Anthony Andriano as its new Chief Financial Officer and promoted Jesper Romell as its new President.
ROHM expands production capacity of SiC power devices
ROHM has recently held an opening ceremony announcing the completion of a new building at ROHM Apollo's Chikugo plant, which the company started building back in February 2019, to enhance the production capacity of SiC power devices.
TDDI IC shipments poised for growth due to strong end-demand
Given the forecasted recovery of the smartphone market and the corresponding rise in TDDI IC demand throughout this year, total smartphone TDDI IC shipment for 2021 is expected to reach 760 million units, according to TrendForce’s latest investigations.
LG and Magna team up to tackle the electric powertrain market
LG Electronics and Magna International are forming a joint venture to manufacture e-motors, inverters and on board chargers and, for certain automakers, related e-drive systems to support the growing global shift toward vehicle electrification.
Padget Electronics to manufacture smartphones for Motorola
Indian EMS provider Dixon Technologies, announces that its subsidiary, Padget Electronics, has signed agreement with Motorola for manufacturing of smart phones.
A2 Global expands with new facility in Singapore
Electronic component distribution and supply chain service provider, A2 Global Electronics, announces the opening of its new distribution facility located in the New Tech Park area of Singapore.
TSMC to kick off mass production of Intel CPUs in 2H21
Intel has outsourced the production of about 15-20% of its non-CPU chips, with most of the wafer starts for these products assigned to TSMC and UMC, according to TrendForce’s latest investigations.
iCoupler Technology Benefits Gallium Nitride (GaN) Transistors in AC/DC Designs
Highly efficient ac/dc power supplies are key to the evolution of the telecom and datacom infrastructure, as power consumption grows rapidly due to hyperscale data centers, enterprise servers, or telecom switching stations. However, the power electronics industry has reached the theoretical limit of silicon MOSFETs.
Geely and Foxconn form joint venture
Geely Holding and Foxconn are looking to establish a joint venture company to provide OEM and customised consulting services – providing whole vehicles, parts, intelligent drive systems and automotive ecosystem platforms to global automotive companies.
ViTrox with a new sales channel partner in Thailand
Machine vision inspection solutions provider, ViTrox Technologies, has entered into a partnership with MTSC (Thailand) Co., Ltd for Thailand region.
UTAC completes acquisition of Singapore wafer bumping assets
UTAC Holdings Ltd. says that its affiliate has completed its purchase of the Singapore-based wafer bumping assets from Powertech Technology (Singapore) Pte. Ltd.
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