Evertiq - First In Electronics News & Expo

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PCB-India_2

October 14, 2025
India has an ambitious vision of building a USD 500 billion domestic electronics manufacturing ecosystem by 2030–31. Supportive measures such as the Production Linked Incentive (PLI) scheme and improvements in ease of doing business have significantly boosted manufacturing and exports.

nexperia-3

October 13, 2025
The Dutch Minister of Economic Affairs has invoked the Goods Availability Act (Wet beschikbaarheid goederen) in response to "serious governance shortcomings" at semiconductor manufacturer Nexperia.

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topping-off-ceremony

October 08, 2025
VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

State_funding

October 06, 2025
Funded through the US Defense Advanced Research Projects Agency (DARPA)’s Next-Generation Microelectronics Manufacturing (NGMM) program, the work at Penn State is part of a USD 840 million multi-institutional effort.

Forge_chip

October 03, 2025
The partnership establishes a collaborative foundation for developing commercially viable in-space semiconductor manufacturing capabilities, combining Space Forge Inc.’s microgravity-enabled materials deposition processes with United Semiconductors’ expertise in ternary III-V semiconductor crystal growth and wafer processing.

October 03, 2025
This collaboration will bring together the collective strengths of Samsung companies across semiconductors, data centers, shipbuilding, cloud services and maritime technologies.

25-years-012

October 02, 2025
The city of ideas, where it all started, will once again host Evertiq’s southernmost Expo. The first Evertiq Expo, then called TEC, was held in Lund in 2011 – and now, fifteen years later, the event returns to its birthplace.

European-Chips-Act

September 30, 2025
All 27 EU Member States have called for a reinforced “Chips Act 2.0” to secure Europe’s position in the global semiconductor industry, issuing a joint declaration urging stronger action to reduce vulnerabilities and strengthen technological leadership.

peter-wawer-infineon-kazuhide-ino-rhom

September 25, 2025
Rohm and Infineon Technologies have signed a Memorandum of Understanding to collaborate on packages for silicon carbide (SiC) power semiconductors used in applications such as on-board chargers, photovoltaics, energy storage systems, and AI data centres.

PCB-India_3

September 18, 2025
As part of the collaboration, the companies will establish a state-of-the-art semiconductor validation and production test floor in Bangalore. The facility features clean room capabilities and equipment to productize silicon to volume production.

University

September 10, 2025
A team of materials scientists at Rice University in Houston, Texas, optimized the precursor materials to lower the synthesis temperature of the 2D semiconductor and showed that it grows in a controlled, directional manner.

September 09, 2025
NXP Semiconductors says it plans to relocate its German headquarters from Hamburg-Lokstedt to a new site in Hamburg-Bahrenfeld. The move, scheduled for early 2031, will mark the company’s departure from its current location after more than 100 years.

SiC

September 09, 2025
SiC and GaN semiconductors are becoming increasingly critical for the development of modern power electronics systems. As Marcin Mierzejewski (KERAFOL Keramische Folien GmbH & Co. KG) points out in an interview with Evertiq, leveraging these technologies gives engineers new opportunities – enabling component miniaturization, meeting growing demands for higher computing power, and addressing the challenges associated with rising power densities.

Trump-on-phone

September 05, 2025
Trump had said last month that he would impose a 100% tariff on semiconductor imports, but would exempt products from companies that shift their manufacturing to the US.

Expo-GOT23-3

September 03, 2025
Evertiq Expo Gothenburg returns on 4 September 2025 with a programme that spans defence, semiconductors, EMS manufacturing, sustainability, cybersecurity, and much more

Ottawa

September 02, 2025
Canada-based Ranovus is a developer of high-capacity miniaturized optical interconnects, a type of semiconductor that enables faster data transfer between chips using light instead of traditional electrical signals.

column-Dennis1

September 01, 2025
The real crisis isn’t that obsolescence happens – it's that the industry still acts like it won’t.

office_logo

August 28, 2025
Toshiba Electronic Devices & Storage Corporation and SICC have signed a memorandum of understanding (MOU) to explore collaboration on SiC power semiconductor wafers, the companies announced.

August 27, 2025
Japanese foundry Rapidus has entered into a strategic collaboration with Keysight Technologies Japan K.K. The companies have signed a Memorandum of Cooperation to develop a high-precision Process Design Kit (PDK) for Rapidus’ 2nm gate-all-around (GAA) semiconductors

lockheed-martin-deal

August 26, 2025
Korea Zinc and US defence contractor Lockheed Martin have signed a Memorandum of Understanding (MOU) to supply and procure germanium and collaborate on establishing resilient critical minerals supply chains.

virgina-facility-render

August 26, 2025
US-based Rocket Lab Corporation plans to expand its domestic investments to increase semiconductor manufacturing capacity and secure the supply chain for space-grade solar cells and electro-optical sensors used in national security space missions.

satellite_chips

August 22, 2025
The launch of the satellite culminates a decade-long partnership between Texas Instruments (TI) and the Indian Space Research Organization (ISRO) to optimize the performance of the electronic systems responsible for this Earth-observation mission.

chip

August 22, 2025
The Tiling crystal film bonding (CFB) tech developed by Japanese firm OKI allows for 52 repeated tiling operations over the entire surface of a 300 mm silicon wafer using a single 2-inch InP wafer, enabling efficient use of InP-based materials.

Plymouth

August 20, 2025
Haylo Labs has completed its acquisition of UK-based developer of microLED display technology, Plessey Semiconductors, in a move set to strengthen the UK's position in immersive computing and optical computing.

PCB-India_2

August 20, 2025
The four new proposals approved are from SiCSem, CDIL, 3D Glass Solutions and ASIP Technologies. The SiCSem and 3D Glass units will be set up in Odisha, CDIL will expand its facility in Punjab, and ASIP will establish a plant in Andhra Pradesh.

August 19, 2025
Japanese SoftBank Group and US chip manufacturer Intel Corporation have entered into a definitive securities purchase agreement under which SoftBank will invest USD 2 billion in Intel common stock.

Jochen-Hanebeck-portrait

August 14, 2025
Infineon Technologies has completed the acquisition of Marvell Technology's Automotive Ethernet business.

Austin-campus

August 14, 2025
Applied Materials says it will invest more than USD 200 million to build an advanced manufacturing facility in Chandler, Arizona, dedicated to producing components for semiconductor equipment.

hq-600

August 13, 2025
indie Semiconductor has agreed to acquire emotion3D GmbH, an Austrian developer of perception algorithms and software for in-cabin sensing, advanced driver assistance systems (ADAS), and automated driving, the companies announced.

Teledyne

August 11, 2025
Qualified over the industrial temperature range of –40°C to +85°C, this eMMC module is well-suited for embedded applications in aerospace, defense, industrial automation and ruggedized edge computing.

PCB-USA_1

August 08, 2025
President Trump said this week that he plans to impose 100% tariffs on imported semiconductors but indicated he would not charge companies that commit to making chips in the US.

August 08, 2025
As a channel partner, India’s Cyient Semiconductors will provide companies with fabrication access, technical consultation, design enablement, assembly, testing, and other value-added services to accelerate innovation and reduce time-to-market.

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