Evertiq - First In Electronics News & Expo

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Products_headquarters

May 01, 2026
Under the agreement, the US company will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon and hydrogen for Samsung’s new semiconductor fab.

30-04-2026

April 30, 2026
Worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025, reports SEMI.

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Estonia-Kuressaare

April 30, 2026
Finnish EMS provider Incap reported revenue growth of 7.3% in the first quarter of 2026, but profitability fell sharply as component availability issues, foreign exchange headwinds, and acquisition-related costs weighed on the result.

Expo-ZRH26-claus-speaking

April 30, 2026
During Evertiq Expo Zurich on April 23, 2026, Claus Aasholm, founder of Semiconductor Business Intelligence, offered a pointed assessment of a semiconductor industry growing rapidly — but not evenly. In his keynote and a follow-up conversation, Aasholm argued that while headline figures suggest unprecedented expansion, underlying dynamics point to structural imbalances across the supply chain.

Oulu-Factory-Finland

April 29, 2026
Finnish PCB manufacturer Aspocomp closed the first quarter of 2026 with its highest-ever order book, even as revenue and profitability declined against a strong comparison period.

zrh2027-003

April 29, 2026
Evertiq Expo made its debut in Zürich on April 23, bringing together the Swiss electronics industry for a day of networking, insights, and focused discussions.

Valtech_agreement

April 29, 2026
By combining Indian company MELSS’s manufacturing expertise with Valtech’s global strengths, the joint venture is positioned to deliver high-performance solutions that meet the evolving needs of next-generation electronics.

Rhea1

April 28, 2026
European processor developer SiPearl has appointed Guillaume Etorre as Chief Operating Officer, strengthening its executive team as the company prepares to bring its first-generation Rhea1 CPU to market in the coming weeks.

semiconductor-revenue-growth-2026

April 28, 2026
Omdia has significantly raised its 2026 semiconductor revenue forecast, now projecting growth of 62.7%, citing sustained AI-driven demand and tightening supply conditions in memory markets.

Tuscaloosa-Alabama-facility

April 28, 2026
US semiconductor company Microchip Technology has opened a new manufacturing facility in Tuscaloosa, Alabama, to increase production capacity for its hydrogen masers and reduce lead times.

cobots

April 28, 2026
US-based EMS provider Flex is expanding its partnership with Teradyne Robotics to accelerate the deployment of automation technologies across its global production footprint.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

Veloce_proFPGA

April 24, 2026
Nvidia and Siemens have been able to capture tens of trillions of cycles over a span of just a few days by taking advantage of Siemens’ Veloce proFPGA CS scalable and performance-optimized hardware architecture and combining it with Nvidia’s performance-optimized chip architecture.

TSMC

April 23, 2026
TSMC is working with Siemens to enhance productivity in custom integrated circuit (IC) design to enable multi-step, multi-tool automations for DRC-centric physical verification with Siemens’ Calibre software.

Newen

April 23, 2026
The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

Microsystems

April 23, 2026
This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.

April 22, 2026
The combination of TI’s sensing technologies and the Lattice Holoscan Sensor Bridge solution will provide developers with a flexible hardware foundation for synchronized, low latency sensor data pipelines in advanced robotics and industrial applications.

April 22, 2026
ASML reported total net sales of EUR 8.8 billion and net income of EUR 2.8 billion for the first quarter of 2026.

X-raymetrology_Onto

April 22, 2026
By combining Rigaku’s X-ray technologies with Onto Innovation’s complementary optical metrology and advanced analytics software, the companies aim to deliver next-generation hybrid metrology solutions for increasingly complex semiconductor devices.

cleanroom

April 22, 2026
Designed as a central hub for innovation, the semiconductor cleanroom facility will support the assembly of new equipment, along with testing, validation and customer demonstration activities.

PCB-Japan_2

April 21, 2026
A magnitude 7.7 earthquake struck off the coast of northern Japan on April 20, prompting a brief tsunami alert and a government advisory warning of an elevated risk of a potential megaquake, the Associated Press reports.

office-render

April 21, 2026
Advantest Corporation has opened a new innovation center in San Jose and is preparing a second facility in Sunnyvale, as the company looks to strengthen collaboration across the semiconductor value chain.

April 21, 2026
Molex has completed its acquisition of Smiths Interconnect, a subsidiary of Smiths Group plc, marking the largest acquisition in the company’s history.

chip_packaging_Odisha

April 20, 2026
The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.

Liquide_Japan

April 20, 2026
Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.

April 20, 2026
The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.

center_NY_Creates

April 17, 2026
Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

server-hall

April 15, 2026
Extended lead times for key semiconductor and hardware components are increasingly shaping supply conditions in the server market, according to TrendForce.

motherboard-Switzerland

April 15, 2026
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.

Claude-Loeffen

April 15, 2026
Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?

Opens-Analysis-Center-and-Rapidus-Chiplet-Solutions

April 14, 2026
Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.

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