Intel appoints former board member Lip-Bu Tan as CEO
March 13, 2025
Tan, a chip industry veteran, replaces interim co-CEOs David Zinsner and MJ Holthaus, who took temporary charge in December when Patrick Gelsinger was ousted as Intel CEO.
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Teradyne to acquire Quantifi Photonics
March 12, 2025
Teradyne has entered into a definitive agreement to acquire Quantifi Photonics, a privately held company specialising in photonic integrated circuit (PIC) testing. The acquisition is expected to be finalised in the second quarter of 2025.
ASML and imec team up to advance European research and sustainability
March 11, 2025
ASML and imec have entered into a new five-year strategic partnership aimed at advancing semiconductor research and sustainability in Europe. The agreement will leverage both companies' expertise to drive technological innovation and sustainable initiatives in the semiconductor industry.
Global Semiconductor sales increase 17.9% YoY in January
March 11, 2025
Global semiconductor sales hit USD 56.5 billion during the month of January 2025, an increase of 17.9% compared to the January 2024 total of USD 47.9 billion but 1.7% less than the December 2024 total of USD 57.5 billion, reports the Semiconductor Industry Association (SIA).
Nearfield Instruments expands to the US
March 11, 2025
Dutch developer of advanced metrology and inspection solutions for the semiconductor industry, Nearfield Instruments, has established a US subsidiary – strengthening the company's presence in North America.
Shannon Poulin to lead Teradyne's semiconductor test division
March 11, 2025
Teradyne has appointed Shannon Poulin as the next President of its Semiconductor Test Division, succeeding Rick Burns, who will retire on June 1, 2025. Poulin is set to take over in the second quarter of 2025 after a transition period.
KIST develops high-performance sensor based on 2D chip
March 10, 2025
Using integral imaging technology, the team at Korea Institute of Science and Technology (KIST) achieved the acquisition and reproduction of RGB full-color 3D images.
UBE breaks ground on $500M battery material plant in Louisiana
March 10, 2025
The plant will produce 100,000 tons of DMC per year and 40,000 tons of EMC derived from DMC annually. The facility is scheduled for completion in July 2026, and begin operations in November 2026.
indie partners with GF to boost automotive radar tech
March 07, 2025
These high-performance radar systems-on-chip (SoC), manufactured on GlobalFoundries’ 22FDX platform, will target 77 GHz and 120 GHz radar applications for advanced driver assistance systems.
GaN semiconductor devices market to reach $19.5B by 2031
March 07, 2025
The expansion of 5G networks globally is significantly contributing to the demand for Gallium Nitride (GaN) semiconductor devices in RF and power electronics applications.
South Korea plans $34B fund for strategic sectors like chips, AI
March 07, 2025
The state-run Korea Development Bank’s 50 trillion won (USD 34.37 billion) fund will be offered to firms in national strategic industries through cheap loans and other investments.
CDIL teams up with Infineon to make power chips
March 07, 2025
Under the agreement, German firm Infineon will supply bare semiconductor wafers to CDIL, which the Indian company will process and use for assembly and packaging to make power chipsets.
Finwave announces global distribution agreement with RFMW
March 07, 2025
This partnership between the two American companies represents a significant step in Finwave’s evolution from a technology-driven company to a product-driven company.
Infineon and ARAI to advance automotive semiconductor solutions
March 06, 2025
Infineon and the Automotive Research Association of India (ARAI) have signed a Memorandum of Understanding (MoU) to collaborate on developing advanced semiconductor solutions for the Indian automotive sector.
US to hold over 20% of advanced chip capacity by 2030
March 06, 2025
The US is projected to hold 22% of global advanced semiconductor manufacturing capacity by 2030, driven by TSMC’s expanded investment in US production, according to TrendForce. TSMC has increased its total investment in its US operations to USD 165 billion, with three newly planned fabs set to begin mass production after 2030.
Malaysia partners with Arm to boost semiconductor innovation
March 06, 2025
The Government of Malaysia has entered into a strategic partnership with Arm Limited through a Memorandum of Understanding (MOU) and contract, taking a significant step in the nation’s semiconductor and artificial intelligence (AI) development efforts.
Tata Electronics to set up display chip unit in Gujarat
March 06, 2025
Tata Electronics signed an MoU with Taiwan’s Himax Technologies and PSMC to boost India’s display and ultralow power AI sensing product and technology ecosystem.
Trump slams CHIPS act in congress – credits tariffs for investments
March 05, 2025
In an address to Congress on Tuesday, US President Donald Trump called the CHIPS Act a “horrible, horrible thing” and credited his administration's economic policies for a surge in domestic investment.
Intel postpones $28 billion chip manufacturing project
March 05, 2025
Intel has announced the postponement of its planned USD 28 billion chip manufacturing project in Ohio until 2030.
Jabil expands with new factory in India
March 05, 2025
EMS provider Jabil says that it will open a new factory in Gujarat, its second factory in India.
eXception PCB boosts production with new DI system
March 05, 2025
UK-based PCB manufacturer eXception PCB has invested in a Nuvogo 1000R. The direct imaging solution enhances production of high-density interconnect (HDI) PCBs, flex and rigid-flex PCBs, and multilayer PCBs.
Mycronic receives order for an MMX metrology system
March 05, 2025
Swedish high-tech company Mycronic has received an order for an MMX metrology system from an existing customer in Asia.
Toray opens semiconductor R&D centre in Taiwan
March 05, 2025
The new facility will reinforce R&D in advanced semiconductor technologies and materials and provide technical services in the Taiwan market.
Vietnam approves $500 million for semiconductor plant
March 05, 2025
The new plant will focus on the production of small-scale, high-tech chips to support domestic industries and national security, reducing Vietnam’s reliance on global supply chains.
GF and MIT to advance research on essential chips for AI
March 04, 2025
GlobalFoundries (GF) and the Massachusetts Institute of Technology (MIT) have entered into a new master research agreement aimed at advancing semiconductor technologies.
Nordic Semi partners with Skylo
March 04, 2025
Nordic Semiconductor and Skylo, a specialist in Non-Terrestrial Network (NTN) communications, have entered into a strategic partnership to certify Nordic’s nRF9151 low-power cellular module on Skylo’s satellite network service.
Benchmark breaks ground on its fifth facility in Penang
March 04, 2025
EMS provider Benchmark has officially broken ground on its new PT4 facility – which is also the company's fifth facility in Penang, Malaysia.
TSMC details its $100 billion Arizona investment
March 04, 2025
Building on its ongoing USD 65 billion investment in semiconductor manufacturing in Phoenix, Arizona, TSMC plans to invest an additional USD 100 billion, bringing its total US investment to USD 165 billion.
Aspocomp forecasts growth after challenging 2024
March 04, 2025
Finnish PCB manufacturer Aspocomp has reported significant improvements in its fourth-quarter performance, marking a strong conclusion to an otherwise challenging year in 2024.
RRP Electronics partners with Deca to boost wafer packaging
March 04, 2025
India’s RRP Electronics will integrate Deca’s Wafer-Level Chip Scale Packaging (WLCSP) and M-Series Fan-Out Wafer-Level Packaging (FOWLP) technologies into its state-of-the-art processes.
TSMC to invest $100B in Arizona semiconductor operations
March 03, 2025
TSMC is planning to invest at least USD 100 billion in its Arizona semiconductor manufacturing operations, marking the largest foreign direct investment in U.S. history, US President Donald Trump announced alongside TSMC CEO C.C. Wei.
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