Fujifilm partners with Gujarat to boost chip materials manufacturing July 01, 2026 Fujifilm India aims to assess opportunities to establish a semiconductor materials production base in Dholera, Gujarat, while working closely with government stakeholders, industry bodies and private enterprises to strengthen a semiconductor supply chain.
Nightfood Holdings signs LOI to acquire 51% of Jiun Jiang July 01, 2026 The proposed transaction furthers Nightfood’s anticipated transformation into a diversified automation and advanced-manufacturing platform positioned at the intersection of semiconductor manufacturing, AI infrastructure, robotics, pharmaceutical automation, and industrial technology.
MKS expands Atotech site in Guangzhou with $25 million investment June 30, 2026 MKS is expanding its Atotech equipment manufacturing site in Guangzhou, China, adding around 323,000 square feet of space and aiming to double the site's production capacity by the fourth quarter 2027. The investment totals USD 25 million.
Teledyne MEMS expands Edmonton operations June 30, 2026 Teledyne MEMS is expanding its manufacturing operations in Edmonton, Canada, backed by a CAD 620,000 grant from the Government of Alberta's Investment and Growth Fund. The expansion strengthens the province's role in the global semiconductor supply chain.
Five cities, five expos, one season – and then something new June 29, 2026 Dennis Dahlgren and Ewelina Bednarz reflect on the spring Expo season and look ahead to their first trip to the International in4ma EMS & PCB Forum in Würzburg.
SK keyfoundry develops Bi-SCR-based On-Chip EMC protection tech June 29, 2026 While conventional ESD protection devices were primarily limited to controlling momentary discharges during chip manufacturing or assembly processes, the new technology enables complete on-chip control of harsh system-level EMC environments.
MKS opens Supercenter Factory in Malaysia with $96M investment June 29, 2026 Located on a 17-acre site with approximately 350,000 square feet of built-up space, the facility in Penang, Malaysia, will support the growing global demand for wafer fabrication equipment.
Incap Slovakia adds cleanroom capability in Námestovo June 26, 2026 Incap Electronics Slovakia has invested in cleanroom production capability at its Námestovo facility in Slovakia to support customers with contamination-sensitive assembly requirements, particularly in semiconductor-related applications.
Quantum tech firm Aegiq opens new headquarters in Sheffield June 26, 2026 The UK startup’s goal is to deliver quantum computers at scale based on photonics, leveraging chip manufacturing supply chains, working with industry leaders to deliver real-world impact in advanced manufacturing, defence, clean energy and healthcare.
Hitachi Energy expands power semiconductor production at Swiss site June 25, 2026 The expansion is part of Hitachi Energy’s USD 9 billion USD global investment program to increase capacity and add 15,000 people to scale manufacturing, R&D, and digitalization, including boosting efficiency through AI-enabled processes.
C-DOT, IIT Hyderabad to advance next-gen communication tech June 25, 2026 As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.
EU clears €76 million German state aid for QuantumDiamonds June 24, 2026 The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.
Nearfield Instruments raises $380 million in largest ever Dutch deep-tech round June 24, 2026 Rotterdam-based semiconductor metrology company Nearfield Instruments has closed a USD 380 million Series D funding round, valuing the company at USD 1.6 billion. The round is the largest deep-tech funding round ever completed in the Netherlands.
QCi acquires NHanced in deal valued at up to $145 million June 24, 2026 By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.
TSMC partners with Amkor to accelerate advanced packaging in US June 24, 2026 The agreement establishes a collaboration framework for TSMC to procure from Amkor advanced packaging and testing services. By working together as partners to expand capacity, the companies aim to enable a more efficient, mutually beneficial operating model.
Nokia announces $30M semiconductor investment in Pennsylvania June 22, 2026 The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.
Renesas acquires Pictorus to accelerate embedded system development June 19, 2026 With the acquisition of Pictorus, Renesas gains a cloud‑based behavioral modeling platform that accelerates embedded system development, moving the engineering experience beyond point tools by providing a connected platform for model-based system design.
Brewer to acquire Heraeus Epurio’s semiconductor chemical business June 19, 2026 The acquisition expands Brewer Science’s advanced materials portfolio and strengthens its ability to support semiconductor customers with highly specialized, ultrapure chemical solutions critical to advanced lithography and microdevice fabrication.
Rohm partners with Aixtron to scale GaN power device production June 18, 2026 The installation of Aixtron’s G10-GaN system at the Hamamatsu plant supports Rohm’s transition toward increased vertical integration and strengthens its ability to scale production for next-generation power semiconductor applications.
QBit Semiconductor acquires 60% stake in Singapore’s SinChip June 17, 2026 This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.
GE Aerospace, Wolfspeed to accelerate high-voltage SiC adoption June 17, 2026 The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.
Rapidus, Fondazione Chips-IT sign MoU to boost chip manufacturing June 17, 2026 The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.
Semiconductor market hits record quarter, driven by memory surge June 16, 2026 Semiconductor revenue grew 27% QoQ in Q1 2026 to reach USD 319 billion – the highest quarterly growth Omdia has recorded since it began tracking the market in 2002. It marks the third consecutive quarter of double-digit growth, putting the market on track to surpass USD 700 billion in the first half of 2026.
India’s Ethereal Machines raises $28.5 million in Series B June 16, 2026 The fresh funds will be used to expand manufacturing infrastructure, develop India’s first indigenous multi-axis CNC controller, strengthen its software stack, support semiconductor manufacturing initiatives, and accelerate international expansion.
Cadence unveils fully autonomous virtual engineer for chip design June 15, 2026 Built on Cadence’s AI-driven electronic design automation (EDA) portfolio with Nvidia Nemotron models, and secured by Nvidia OpenShell runtime, the new agentic capabilities enable customers to run dynamic simulations in automated workflows.
Quobly secures €115M to advance silicon-based quantum computers June 15, 2026 The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.
CADFEM APAC, SilTerra partner to advance semiconductor innovation June 15, 2026 The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.
The semiconductor industry as it is, not as it is told June 12, 2026 At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.
Forge Nano secures wafer fab equipment order from photonics firm June 12, 2026 Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.
India’s Polymatech establishes manufacturing hub in Singapore June 12, 2026 The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.
Applied Materials opens $500 million manufacturing campus in Singapore June 11, 2026 Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.
Infineon to supply SiC power modules for Siemens circuit breakers June 11, 2026 Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.