Alchip expands its footprint with new design centres
June 12, 2025
Alchip Technologies has announced the expansion of its global design operations with the establishment of new design centres in Vietnam and the addition of a second office in Japan.
Ad
SEMI Europe and SEI to advance green shift in semiconductors
June 12, 2025
SEMI Europe has signed a three-year Memorandum of Understanding (MoU) with the Stockholm Environment Institute (SEI) to collaborate on sustainability initiatives within the semiconductor industry.
RIR expands manufacturing of 1200V SiC diodes in collaboration with PASC
June 11, 2025
Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.
NXP reportedly to close four 8-inch fabs in shift toward 12-inch production
June 11, 2025
NXP Semiconductors is reportedly planning to shut down four of its 8-inch (200mm) wafer fabrication plants – one in the Netherlands and three in the United States — as part of a strategic transition to 12-inch (300mm) wafer production.
Orbic Electronics to build $110 million manufacturing hub on Long Island
June 11, 2025
Orbic Electronics Manufacturing has broken ground on a EUR 110 million advanced manufacturing facility in Hauppauge, Suffolk County. The project, which involves reshoring production operations from India and China, is expected to create over 1,000 high-tech and skilled jobs while retaining 66 existing positions.
Fujitsu sells power modules business to India’s L&T for $13.8 M
June 11, 2025
The business will be bought by L&T’s semiconductor arm. Separately, Kaynes Semicon (KS) will acquire the production facilities related to the power modules business from Fujitsu.
Sony to release stacked SPAD depth sensor for automotive LiDAR applications
June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.
Mycronic’s Global Technologies acquires Surfx Technologies
June 10, 2025
Swedish high-tech company Mycronic's Global Technologies division has acquired Surfx Technologies, a US-headquartered provider of atmospheric plasma solutions used in advanced electronics manufacturing, including semiconductor processing and packaging.
SEMI: Global chip equipment billings up 21% in Q1 2025
June 10, 2025
Global semiconductor equipment billings reached USD 32.05 billion in the first quarter of 2025, marking a 21% increase compared to the same period in 2024, according to the latest Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report published by SEMI.
ERS electronic opens demonstration centre in Taiwan
June 10, 2025
ERS electronic GmbH has opened a new demonstration centre in Zhubei, Taiwan, aimed at supporting the rising demand for panel-level packaging (PLP) in the region.
India approves Micron’s $1.5 billion Gujarat SEZ proposal
June 10, 2025
US semiconductor company Micron Technology will set up its SEZ facility in Sanand, Gujarat, while Indian diversified contract manufacturer Aequs will set up its SEZ in Dharwad, Karnataka.
GENESIS project launches to steer Europe towards sustainable chipmaking
June 09, 2025
With a budget of close to €55 million, GENESIS will drive innovative solutions in emission control, eco-friendly materials such as alternatives to PFAS-based ones, waste minimization, and raw material reuse.
Tata Electronics partners with BEL to bolster India’s chip ambitions
June 09, 2025
Tata Electronics and Bharat Electronics Limited (BEL) will explore collaboration opportunities to identify fab, OSAT and design services solutions from Tata Electronics based on the current and future requirements of BEL.
Siemens expands OSAT Alliance to boost US chip supply chains
June 06, 2025
Mosaic Microsystems will use Siemens‘ EDA technologies to develop ADKs for its thin glass substrate technology, while NHanced Semiconductors will employ Siemens EDA tech to develop ADKs for their silicon interposer-based tech.
Samsung develops next-gen cooling tech with Johns Hopkins
June 06, 2025
By leveraging newly created thin-film Peltier semiconductor devices advanced through cutting-edge nano-engineering technology for the first time, the research team has successfully developed and demonstrated a high-performance Peltier refrigerator.
AMD acquires Brium to enhance Open AI software ecosystem
June 05, 2025
AMD said the acquisition was a reflection of its strategic commitment to AI. This is AMD’s fourth strategic acquisition in the past two years — the semiconductor giant previously acquired Silo AI, Nod.AI and Mipsology.
China’s GigaDevice opens global headquarters in Singapore
June 05, 2025
This strategic move marks a major milestone in GigaDevice’s international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
Nvidia selects Navitas to collaborate on 800 V HVDC architecture
June 04, 2025
Navitas’ high-power GaNSafe power ICs integrate control, drive, sensing and critical protection features, enabling reliability and robustness.
Air Liquide’s gas supply deal with VSMC to boost Singapore’s chip industry
June 03, 2025
Strategically located within the Tampines Wafer Fab Park, one of Singapore’s four key wafer fabrication hubs, the new facility will bolster Singapore’s position as a global semiconductor powerhouse.
IIT Kharagpur, A*STAR team up to advance semiconductor innovation
June 02, 2025
The MoU opens new avenues for joint research in advanced CMOS and post-CMOS technologies; heterogeneous integration and packaging; AI hardware accelerators; next-generation memory systems; photonics and quantum devices; and chip reliability, thermal management and failure analysis.
EdgeCortix secures $21M to develop energy-efficient AI chiplet
June 02, 2025
This funding will drive the development of NovaEdge — a next-generation, energy-efficient edge AI chiplet designed for high-performance generative AI inference and on-device learning.
Celtonn bags ESA contract to develop chip hardware for satellites
June 02, 2025
As the project lead, Celtonn will develop a high-linearity, low-noise amplifier (LNA) for V-band feeder uplink — a key enabler for next-generation satellite communication payloads.
Materion expands its semiconductor footprint and capabilities
June 02, 2025
Materion is expanding its presence in Asia’s semiconductor market through the acquisition of a newmanufacturing facility in South Korea.
SCI raises $3.3M to develop security-enhanced microcontroller
May 30, 2025
CHERI, which stands for ‘capability hardware enhanced RISC instructions,’ aims to protect against cyber attacks that use software memory misallocation, buffer over flows and other memory hacks.
U.S. imposes new export restrictions on chip design software to China
May 30, 2025
The United States has instructed a wide range of companies to halt shipments of various products to China without a license, and has revoked previously issued licenses for certain vendors, according to a report from Reuters.
Horiba to set up new production base in Malaysia
May 29, 2025
The Horiba Group is set to significantly expand its operations in Malaysia with plans to establish its first manufacturing facility in the state of Kedah.
Trumpf Electronics opens technical centre in Malaysia
May 28, 2025
German plasma power specialist Trumpf Electronics has opened a new technical centre in Malaysia, marking its first facility in Southeast Asia
AT&S to open Europe's first advanced IC substrate facility in June
May 28, 2025
AT&S is preparing to open a new high-tech production facility for advanced IC substrates and packaging technologies in Leoben, Austria. Set to officially launch in June 2025, the site will be the first of its kind in Europe and is expected to play a key role in strengthening Europe's microelectronics supply chain.
TSMC to launch European chip design centre in Munich
May 27, 2025
Taiwanese semiconductor giant TSMC is preparing to strengthen its European presence with the opening of a new design centre in Munich, Germany.
ST expands "Lab-in-Fab" initiative in Singapore
May 27, 2025
STMicroelectronics says that it is partnering with the A*STAR Institute of Microelectronics (A*STAR IME) and ULVAC, to expand its “Lab-in-Fab” (LiF) in Singapore. The focus of the collaboration is to advance piezoelectric MEMS for applications in personal electronics, medical devices, and other applications.
Load more news
