Evertiq - First In Electronics News & Expo

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topping-off-ceremony

October 08, 2025
VisionPower Semiconductor Manufacturing Company (VSMC) has reached a key milestone in the construction of its new 300-millimeter wafer fabrication facility in Singapore.

Arduino

October 08, 2025
Qualcomm Technologies has agreed to acquire open-source hardware and software company Arduino, integrating one of the world’s largest developer ecosystems into its edge computing and AI portfolio.

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graphs-charts

October 07, 2025
The Electronic System Design (ESD) industry revenue increased 8.6% to USD 5,089.4 million in the second quarter of 2025 from the USD 4,685.5 million registered in the second quarter of 2024, according to the ESD Alliance, a SEMI Technology Community. The four-quarter moving average rose 10.4%, based on a comparison of the most recent four quarters to the prior four.

Vietnam-Facility-Cleanroom

October 07, 2025
C-Hawk Technology, a manufacturer of components, assemblies, systems and surface treatment processes for the semiconductor and health imaging industries, has opened its new manufacturing facility in Vietnam.

Arizona-render

October 07, 2025
Amkor Technology has broken ground on its new advanced semiconductor packaging and test campus in Arizona, expanding its planned investment to USD 7 billion.

Yvtautas-Ilgunas-CCO-Campus

October 07, 2025
TLT Manufacturing has been making headlines in recent months with its expansion strategy. In September, the Lithuanian electronics group inaugurated a EUR 320 million expansion in Vilnius, which included four new factories, highlighting its ambition to build a vertically integrated manufacturing park in Europe.

State_funding

October 06, 2025
Funded through the US Defense Advanced Research Projects Agency (DARPA)’s Next-Generation Microelectronics Manufacturing (NGMM) program, the work at Penn State is part of a USD 840 million multi-institutional effort.

cooperation-1

October 03, 2025
L&T Technology Services Limited (LTTS) will support the client’s initiatives across new product development, sustenance engineering, value engineering and platform automation, leveraging its expertise in AI, computer vision, and next-gen automation technologies.

axonite_chip

October 03, 2025
Corintis’s technology focuses on optimized micro-scale liquid cooling for computer chips in data centres. Microsoft in collaboration with Corintis has developed an in-chip microfluidic cooling system that can effectively cool a server running core services.

Forge_chip

October 03, 2025
The partnership establishes a collaborative foundation for developing commercially viable in-space semiconductor manufacturing capabilities, combining Space Forge Inc.’s microgravity-enabled materials deposition processes with United Semiconductors’ expertise in ternary III-V semiconductor crystal growth and wafer processing.

October 03, 2025
This collaboration will bring together the collective strengths of Samsung companies across semiconductors, data centers, shipbuilding, cloud services and maritime technologies.

building

October 03, 2025
Swedish Mycronic says it has received an order for an SLX mask writer from an existing customer, for delivery to the US.

25-years-012

October 02, 2025
The city of ideas, where it all started, will once again host Evertiq’s southernmost Expo. The first Evertiq Expo, then called TEC, was held in Lund in 2011 – and now, fifteen years later, the event returns to its birthplace.

Muse-semiconductor-acqusition

October 02, 2025
GS Microelectronics US, Inc. (GSME), a supplier of IC design and manufacturing solutions, has acquired Muse Semiconductor, a provider of multi-project wafer (MPW) services, enabling chip designs built on TSMC technology.

Kitakami-Plant-2025

October 02, 2025
Kioxia and Sandisk have started operations at a new semiconductor fabrication facility in Kitakami, Japan, aimed at producing advanced flash memory for applications including artificial intelligence.

Handshake

October 02, 2025
According to a report from Semafor, later cited by Reuters, Intel has entered preliminary talks with AMD regarding a potential foundry partnership. Sources familiar with the matter emphasise that the discussions are still at an early stage and no outcome has been decided.

equipment

October 02, 2025
Axcelis Technologies and Veeco Instruments have entered into a definitive agreement to merge in an all-stock transaction that values the combined company at approximately USD 4.4 billion. The deal will create one of the largest US suppliers of semiconductor manufacturing equipment.

PCB-India_2

October 01, 2025
SEALSQ Corp and Kaynes SemiCon have signed a term sheet to form a joint venture, SEALKAYNESQ Ltd, which will establish India’s first Outsourced Semiconductor Test and Personalisation (OSTP) facility.

building

September 30, 2025
Swedish high-tech company Mycronic has received an order for an SLX mask writer from an existing customer in Asia.

European-Chips-Act

September 30, 2025
All 27 EU Member States have called for a reinforced “Chips Act 2.0” to secure Europe’s position in the global semiconductor industry, issuing a joint declaration urging stronger action to reduce vulnerabilities and strengthen technological leadership.

PCB-India_1

September 30, 2025
The partnership will take advantage of UST’s digital engineering, AI-driven process improvements, and real-time data analysis, which are all essential for scale, reliability, and avoiding hidden costs.

quantum_computer_NQCC

September 29, 2025
Aegiq’s on-premises system at NQCC enables exploration and validation of photonic quantum computing use cases through co-development with UK partners, de-risking key technical milestones, and reducing time to commercial impact.

Thomas-Muhleck-Alexander-Tschernev

September 26, 2025
The Kreuzwertheim-based mechanical engineering group Kurtz Ersa has taken over the business operations of the insolvent equipment manufacturer ATV Technologie GmbH, based in Vaterstetten near Munich.

September 26, 2025
The collaboration marks a milestone in the evolution of photonics as a foundational technology for next-gen AI applications, including AR and human-centric digital experiences that require ultra-efficient, lightweight and high-performance optical systems.

September 24, 2025
onsemi has entered into an agreement with Aura Semiconductor to acquire rights to its Vcore power technologies, including associated IP licenses. This deal aims to enhance onsemi’s power management portfolio and roadmap, accelerating its goal to address the complete power tree in AI data centre applications.

Typhoon-Ragasa

September 24, 2025
Taiwanese authorities and residents remain on high alert after Super Typhoon Ragasa caused deadly flooding in Hualien County, leaving at least 14 people dead and more than 150 unaccounted for, Reuters reports.

Opens-Access-to-US-Semiconductor-Facilities

September 23, 2025
Northrop Grumman says that its Microelectronics Center will now provide external access to the company’s three US government-accredited semiconductor manufacturing facilities. The move is intended to expand secure domestic production of defense-grade microelectronics and strengthen US supply chain.

September 19, 2025
The facility is expected to span roughly 6 million square feet and employ about 2,000 people. The plant will include two logic fabs and a research and development facility.

Pocatello-fab

September 18, 2025
US-based LA Semiconductor has launched the sale process for its wafer fabrication facility in Pocatello, Idaho, engaging Macquarie Group to oversee the transaction.

PCB-India_3

September 18, 2025
As part of the collaboration, the companies will establish a state-of-the-art semiconductor validation and production test floor in Bangalore. The facility features clean room capabilities and equipment to productize silicon to volume production.

Megtron-material-Thailand-facility-2025

September 17, 2025
Panasonic Industry says it plans to double the production capacity of its MEGTRON multi-layer circuit board materials over the next five years to meet growing demand from AI server and ICT infrastructure markets.

Production-Front-End

September 17, 2025
Semiconductor manufacturer STMicroelectronics plans to establish a new pilot line for Panel-Level Packaging (PLP) technology at its Tours facility in France, backed by a USD 60 million investment. The pilot line is expected to be operational in the third quarter of 2026.

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