Evertiq - First In Electronics News & Expo

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Expo-ZRH26-claus-speaking

June 12, 2026
At Evertiq Expo Zürich, Claus Aasholm of Semiconductor Business Intelligence delivered a data-driven examination of a semiconductor industry in structural transition – and the picture looked considerably different from what most quarterly reports suggest.

axonite_chip

June 12, 2026
Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

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Singapore_facility

June 12, 2026
The facility is positioned as a dedicated commercial-scale LED Chip-on-Board (CoB) packaging unit and is expected to create approximately 50 high-value engineering and manufacturing roles in Singapore over five years.

Singapore-facility

June 11, 2026
Applied Materials has expanded its manufacturing and R&D operations in Singapore with the opening of the Tampines Campus, a USD 500 million facility that more than doubles the company's cleanroom capacity in the country. The campus is already operating at volume production.

SiC-Wafer

June 11, 2026
Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

Samsung_chip_design

June 09, 2026
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

June 09, 2026
US semiconductor manufacturer Onsemi is reportedly planning to cut between 200 and 300 jobs at its plant in Rožnov pod Radhoštěm in the Czech Republic, according to Czech media outlet e15. The cuts follow an earlier round of approximately 170 layoffs at the same facility in 2025.

PCB-Japan_2

June 09, 2026
As a result of this latest capital increase by Japan’s Information-Technology Promotion Agency (IPA), Rapidus’ funding now totals 424.95 billion yen (about USD 2.7 billion).

Santa-Clara-HQ-Entrance

June 08, 2026
As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.

Samueli_semiconductor_hub

June 08, 2026
The mission of the semiconductor hub is to foster sustained collaboration between leading faculty and industry partners Broadcom, Applied Materials, GlobalFoundries, Meta and Synopsys to drive advances in connectivity, computing and intelligent systems.

Nanopower_agreement

June 08, 2026
Norwegian company Nanopower Semiconductor’ nPZero Gen1 power management IC extends system lifetime by reducing the load on the main MCU. The agreement aims to reduce IoT power and increase battery life for UK and EU customers.

quantum-technologies-1

June 05, 2026
Rather than relying on a single architecture, SEALSQ is investing into several complementary approaches to fault-tolerant quantum computing and binding them to its own QS7001 secure hardware, QVault TPM and PQC product portfolio.

3dIC

June 05, 2026
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.

axonite_chip

June 05, 2026
The technology combines micro-scaled opto-semiconductor chips capable of 12V single-chip operation with a high-voltage (HV) driver technology, enabling a reduction of more than 10% in the number of driver-related components used in hybrid and electric vehicles.

Chips-Act

June 04, 2026
The European Commission has presented the European Technological Sovereignty Package, a set of legislative and strategic measures aimed at reducing Europe's dependence on foreign suppliers in semiconductors, AI, cloud computing and open source technology.

Tessalia

June 04, 2026
Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.

Marco-Mezger-2026

June 03, 2026
For years, memory sourcing followed a familiar logic. Buyers negotiated hard, and, when prices rose, trusted that the cycle would eventually rebalance. That approach worked – until it didn’t.

tsmc_chip_design

June 03, 2026
Nvidia CUDA-X libraries and AI models are accelerating TSMC workloads across lithography, transistor and process simulation, advanced process control and fab operations optimization.

June 02, 2026
AMD says it plans to invest more than USD 10 billion across Taiwan's semiconductor ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The company also confirmed that its Helios rack-scale platform is on track for deployment in the second half of 2026.

June 02, 2026
French computing company Bull and Foxconn have announced a strategic partnership to manufacture AI and cloud infrastructure in Europe. The collaboration combines Bull's AI systems design and go-to-market capabilities with Foxconn's manufacturing scale, with an initial investment exceeding EUR 120 million.

PCB-India_2

June 01, 2026
The facility in the Indian state of Odisha will focus on advanced packaging glass core substrates, high-density interconnect substrates and associated semiconductor technologies, with Intel supporting technology know-how and process expertise.

geralt-computer-chip

June 01, 2026
The QUANTIX project involves an estimated investment of EUR 40 million dedicated to the development of a Semiconductor Design and Personalization Center in the Region of Murcia, with advanced capabilities in cybersecurity, post-quantum technology, AI, and RISC-V systems.

Bloomington-Minnesota-manufacturing-facility

May 28, 2026
Less than a week after parent company Wingtech filed a CNY 8 billion lawsuit against its interim leadership in a Chinese court, Nexperia has announced a manufacturing partnership with US-based foundry Polar Semiconductor for the production of next-generation power MOSFETs.

May 28, 2026
US semiconductor packaging and test provider Amkor Technology has secured an additional 67-acre parcel of land adjacent to its existing campus in Peoria, Arizona, expanding its footprint for future advanced packaging and test capacity.

He-Tingbo

May 27, 2026
At the IEEE International Symposium on Circuits and Systems in Shanghai on May 25, Huawei presented the Tau scaling law — a new principle for guiding semiconductor development that the company proposes as a replacement for Moore's Law, which has underpinned the industry for more than five decades.

May 27, 2026
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

Quantum_Wafer

May 27, 2026
The CHIPS incentive from the US Department of Commerce will support R&D efforts of a new IBM company, Anderon, which will operate as a 300-mm quantum wafer foundry. In addition to the USD 1 billion CHIPS incentive, IBM will contribute USD 1 billion of cash into Anderon.

PCB-India_3

May 26, 2026
The fresh funding will be deployed to advance the company’s product R&D roadmap across custom power semiconductors and custom ASSPs, build in-house chip validation and testing infrastructure, and support working capital requirements.

May 25, 2026
Currently, China’s most advanced proven chipmaking capability is believed to be around 7nm, and experts say 1.4nm is likely the global limit for advanced chipmaking around the end of the decade. So the Chinese tech giant’s claims could represent a breakthrough.

Expo-Zurch-2026-Nikolaos-Florous-memphis-electronic-interview

May 25, 2026
Following his presentation at Evertiq Expo Zürich, Memphis Electronics' Nikolaos Florous had a conversation with Evertiq to go deeper on the market outlook. The short version: conditions will stay difficult, and procurement teams that haven't adapted yet are running out of time.

axonite_chip

May 25, 2026
Moov's platform supports the sourcing and sale of semiconductor fabrication, packaging, test, EMS and SMT equipment, as well as surplus, idle and scrap tools.

PCB-EU_1

May 25, 2026
Germany notified plans to support Zeiss’s ‘HNA@SCALE’ project, which will introduce and industrialise the next generation of EUV optical columns, and Zadient’s ‘Sic-Pro' investment project for the construction of a factory for SiC.

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