Lam Research to invest more than $3 billion in global R&D lab network August 18, 2026 Lam Research plans to invest more than USD 3 billion over the next five years to expand its global research and development lab network. The investment is expected to increase experiment capacity by more than 50% and further compress product development cycles for semiconductor customers.
SK hynix invests $38 billion in chip plants in South Korea August 17, 2026 SK hynix’s board has approved about 54.3 trillion won ($38 billion) of investments through 2031, including 35.2 trillion won for the second phase of construction of its chip fabrication plant in Yongin and 19.1 trillion won for its M17 chip plant in Cheongju.
US firm ChipAgents expands Series A funding to $134 million August 17, 2026 The funding will support ChipAgents' next phase of expansion as the company scales customer deployments, grows its engineering and go-to-market teams, and accelerates development of its AI-native semiconductor design platform.
Sivers announces $3.4M program with SemiNex for InP light sources August 14, 2026 The program targets high-power external laser sources for co-packaged optics (CPO), high-channel-count DFB arrays for wavelength-multiplexed links, and SOA gain stages that extend optical reach as channel counts scale.
SPHERE AX partners with Blaize to advance edge AI computing August 14, 2026 US firm Blaize and South Korean company SPHERE AX plan to develop a next-generation physical AI solution targeted at the global market by combining Blaize’s AI semiconductor technology, optimized for physical AI, with SPHERE AX’s core software expertise.
Infineon partners with LS Electric to advance DC power solutions August 13, 2026 The collaboration will focus on key DC infrastructure areas, including power conversion systems for energy storage systems, solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs).
NXP breaks ground on assembly and test factory in Malaysia August 13, 2026 Adding approximately 500,000 square feet of production space, the facility will expand NXP’s current operations in Malaysia, which are dedicated to supporting the assembly and testing of NXP’s broad product portfolio.
Tokyo Electron, Nvidia expand collaboration for agentic AI, robotics August 13, 2026 Tokyo Electron (TEL) is collaborating with Nvidia, utilizing Nvidia Agent Toolkit including Nvidia NeMo, Nvidia NIM, Nvidia NemoClaw blueprints and the open robot development platform Nvidia Isaac within TEL’s “Epsira” concept for digital transformation (DX) solutions.
Canada’s Stathera raises $55 million to scale silicon timing August 12, 2026 Stathera will use the proceeds to fund mass production of its GEN2 silicon timing portfolio while accelerating development of its next-generation platform for AI data centers and growing the company’s engineering and commercial teams.
Navitas files patent infringement lawsuit against Renesas August 12, 2026 The lawsuit comes weeks after Japanese semiconductor company Renesas sued US-based Navitas in the California federal court, claiming the company poached its employees to steal trade secrets for developing next-gen GaN chips.
Sony, TSMC plan $6.4 billion image sensor factory in Japan August 11, 2026 Sony Semiconductor Solutions will hold a controlling stake in the venture — about 60% — with TSMC owning the remaining 40%.
Has the semiconductor market changed since spring? August 11, 2026 Earlier this year, several discussions at Evertiq Expo pointed to the same conclusion: while the semiconductor industry continues to grow, that growth is far from evenly distributed. AI, memory and data centres have driven record revenues, while other parts of the electronics industry continue to face a very different reality.
Ardian Semiconductor invests in French fabless firm VSORA August 10, 2026 Through its investment, Ardian Semiconductor will support VSORA in accelerating its go‑to‑market strategy to strengthen the company’s recognition across the value chain and reinforce VSORA’s access to senior semiconductor industry expertise.
Former SK hynix employee jailed for leaking information to Chinese firm August 10, 2026 The employee, who formerly worked at SK hynix's office in China, was found to have printed out or took photos of documents containing trade secrets downloaded from the company's internal server, according to Yonhap news agency.
Siemens to acquire EDA software firm Precision Innovations August 07, 2026 Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.
SpaceX, Tesla to initially spend $16.8 billion on Texas chip plant August 07, 2026 Terafab, a vertically integrated semiconductor fabrication plant in Grimes County, Texas, with over 100 million square feet of manufacturing space, will employ at least 3,000 people.
Rashi Peripherals announces JV with Japan’s Restar August 07, 2026 Rashi will transfer its semiconductor business division into a wholly owned subsidiary headquartered in Bengaluru and step-down subsidiary headquartered in Singapore. Restar Corporation will subsequently acquire a 26% equity stake in the subsidiary.
TE Connectivity to acquire power solutions provider Astrodyne August 06, 2026 Headquartered in New Jersey, Astrodyne is recognized for its engineering expertise and close collaboration with customers developing next-gen technologies across semiconductor manufacturing equipment, medical, defense and industrial applications.
Fuji enables SMT placement of large, heavy components for AI servers August 06, 2026 The company can handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines.
Air Liquide invests $150M in Idaho semiconductor gas plant August 06, 2026 Scheduled to begin operations in 2028, Air Liquide’s production unit will deliver large volumes of ultra-pure nitrogen, oxygen and argon, essential for manufacturing advanced memory chips.
Renesas Gen 3 MRDIMM chipset solutions advance performance August 05, 2026 Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.
ASIP breaks ground on $260 million OSAT facility in India August 04, 2026 The 30-acre facility in Andhra Pradesh will have an annual production capacity of 96 million chips and serve high-growth sectors such as AI, high-performance computing, data centres and high-speed communications.
Linde wins semiconductor supply deal, to invest $1 billion in US August 04, 2026 Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.
Understanding semiconductor datecodes in long-lifecycle electronics August 04, 2026 The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another issue may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.
Incap reports 21% increase in half-yearly revenue August 03, 2026 In the January–June 2026 period, Incap reported revenue of EUR 130.2 million, an increase of 21.1% from last year. It reported revenue of EUR 74.2 million for the April–June 2026 quarter, a year-on-year increase of 34.1%.
Intel partners with Lens to boost advanced semiconductor packaging August 03, 2026 Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.
Siemens, Nvidia advance self-verifying agentic AI workflows July 31, 2026 The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.
TOP500 Supercomputer List: China Returns to the Top, Europe Holds Strong Position July 31, 2026 The latest edition of the TOP500 ranking of the world's most powerful supercomputers has brought a change at the top. China's LineShine has overtaken the United States' El Capitan, while the number of exascale systems has increased to five. Europe has maintained its position among the world's leading high-performance computing regions.
Marvell to invest $250 million in India, expand Bangalore facility July 31, 2026 The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications
IonQ receives approval to complete $1.8B acquisition of SkyWater July 31, 2026 Following the close of the transaction, SkyWater will continue to serve a full range of customers as a US-based semiconductor foundry, operating as a wholly owned subsidiary of IonQ under the SkyWater name.
UMC reports 17% increase in YoY second quarter revenue July 30, 2026 Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.