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PCB-EU_2

March 25, 2025
Participants whose requests are selected will have access to FAMES technologies as they become available. Open-Access Calls will take place each spring through 2028.

engineer-looking-at-wafer

February 19, 2025
The European semiconductor industry is receiving a boost through the APECS pilot line project, which has been awarded funding under the EU Chips Act. This initiative focuses on developing and providing new packaging and integration solutions for the industry.

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FAMES

July 01, 2024
France's CEA-Leti lab has officially launched its FAMES Pilot Line to support higher-performance, more energy-efficient and more sustainable chip designs across Europe.

flags

May 23, 2024
European Commission officials believe the EU Chips Act can attract huge inwards investment and propel the continent's semiconductor space to global prominence by 2030.

European-Chips-Act

April 18, 2024
On 11 April, the Public Authorities Board of the Chips Joint Undertaking selected four pilot production lines for semiconductor chips that will receive funding from the EU. The selected pilot line in Finland will be set up by Tampere University and the VTT Technical Research Centre of Finland.

lab

March 01, 2024
The European Union has issued a call for proposals to its PREVAIL consortium, which was set up to accelerate the development of next-generation, edge-AI technologies across the continent.

Bittium-Headquarters-Oulu-Finland

February 28, 2024
The members of a research and business consortium led by Bittium Wireless Ltd, a subsidiary of Bittium Corporation, have signed a framework agreement as part of the indirect industrial cooperation related to the procurement of F-35 fighter jets with Lockheed Martin.

chip

November 16, 2023
While people within the industry know and understand the significant role that semiconductors play in our society, those in power have finally realised its strategic importance and are looking to boost Europe's capacity and capabilities.

Fabrication-Facility-Finland

April 29, 2022
The European Investment Bank (EIB) has granted EUR 35 million to IQM Quantum Computers to accelerate the development and commercialisation of its quantum processors built at Europe’s first quantum-dedicated fabrication facilities in Espoo, Finland.

evg120

May 16, 2018
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, has received an order for its EVG120 automated resist processing system from VTT Technical Research Centre of Finland (VTT).

grainsense-product

December 28, 2016
Innokas Medical has recently signed a cooperation agreement with Finnish company GrainSense Oy that develops the first truly hand-held device for grain quality measurement.

business-people-closing-deal

December 23, 2015
Thin Film Electronics has been been awarded a grant from the European Commission as part of its Horizon 2020 research and innovation initiative.

hms-dauntless-sea-trial

July 07, 2015
Rolls-Royce is to lead a new EUR 6.6 million project - The Advanced Autonomous Waterborne Applications Initiative - that could pave the way for autonomous ships.

printed-electronics

May 22, 2015
Thin Film Electronics has been selected by the European Commission to participate in a group research and innovation initiative focused on the advancement of printed electronics technology.

circuit-design

July 31, 2013
Linear Technology announces the LTC3676 and LTC3676-1, complete PMIC power management solutions for portable processors including Freescale’s i.MX6 series, PXA, OMAP, ARM Cortex and other advanced portable microprocessor-based systems.

fragile

May 09, 2013
JOT Automation has moved its HQ to Oulu, Finland. The new premises are owned by Technopolis Oyj and comprise of approximately 2000 sq. meters and will accommodate approximately 80 employees.

electronics

April 08, 2013
International Rectifier has introduced the IR3847 high current Point-of-Load (POL) integrated voltage regulator that extends the current rating of IR’s third generation SupIRBuck® family up to 25A in a compact 5x6 mm package.

June 15, 2012
Samsung C&T Corporation heads an international project that looks for ways of improving the energy efficiency of properties.

June 13, 2012
Samsung C&T Corporation heads an international project that looks for ways of improving the energy efficiency of properties.

May 08, 2012
VTT has built an energy self-sufficient test apartment in Oulu, Finland, for the research and development of building-specific energy production.

FR-product-X

March 18, 2010
Organic and printed electronics offers novel solutions for the brand protection of consumer goods and industrial products. Electrically coded radio tags link back to the legitimate manufacturer to detect falsification at the point of sale.

electronics_www

January 09, 2009
Flexible electronics is set to bring about revolutionary changes in the design and conceptualization of electronics devices in the consumer, medical, and military sectors. The emerging field has demonstrated huge implications in terms of cost reductions owing to printed manufacturing techniques being developed for volume production.

electronics_www

September 19, 2008
Photovoltaics (PV) is progressing from the old crystalline and amorphous silicon to thin film technologies that are increasingly printed. There are several types of solar cell involved and they are all needed as the market grows and fragments.

electronics_www

August 05, 2008
According to market reaserch firm IDTechEx, printed electronics will rise to the order of $300 billion dollars in twenty years from now.

electronics_www

June 11, 2008
Printed and potentially printed electronics was first seen as a way of sharply reducing the cost of everything from lighting to personal electronics. That remains an objective.

070201

February 01, 2007
Swiss based company Ciba Specialty Chemicals and VTT Technical Research Centre of Finland have agreed to a new research collaboration in the field of organic electronics.

November 09, 2006
Datacon Technology GmbH, has received an order for Laurier M9 ultra-high precision flip-chip die bonder from Finnish VTT.

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