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SMT & Inspection | November 09, 2006

Datacon to deliver Laurier M9 flip chip die bonder to Finland

Datacon Technology GmbH, has received an order for Laurier M9 ultra-high precision flip-chip die bonder from Finnish VTT.

VTT is an independent research organization in Finland and according to a spokesperson from the organization the Laurier M9 flip-chip die bonder will be used in a broad range of development projects in the realm of opto-electronic, RF and MEMS applications.
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December 12 2019 10:59 am V14.8.5-2