Infineon to pay $837 million to settle long-pending Qimonda dispute
August 23, 2024
Qimonda's administrator had sued Infineon in 2010 for 3.35 billion euros, arguing the German chipmaker had transferred operations to it at an inflated price.
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How the "golden screw" is changing purchasing behavior
January 20, 2023
The procurement of components has been very rocky in the past two years. Shortages disrupted manufacturing lines often because just one small component was missing. Such "golden screws" literally have been a gold mine for brokers.
Arrow names Jörg Strughold as president EMEA components
May 16, 2022
Arrow Electronics announces that Jörg Strughold will take over as president of its components business in EMEA. He succeeds Martin Bielesch who has decided to leave the company.
Neumonda brings Intelligent Memory to EMEA
January 11, 2022
Neumonda, a specialty memory company with the “DNA” of former memory manufacturer Qimonda, announces that it has brought its subsidiary, Intelligent Memory (IM) – an independent manufacturer of industrial grade memory solutions – to Europe.
Is this the birth of a new German memory powerhouse?
November 16, 2021
Two experts with experience from executive positions at Memphis Electronic and Qimonda, will lead a new venture – Neumonda – comprised of tree separate entities, a distributor, a manufacturer and technology focused company with a substantial IP.
Tsinghua Unigroup’s DRAM fab will have some hurdles to overcome
September 13, 2019
Tsinghua Unigroup’s DRAM fab is scheduled for completion in 2021 but technology remains the biggest challenge to production, says TrendForce
97 IC wafer fabs closed or repurposed during past 10 years
March 06, 2019
The IC industry has been on a mission to pare down older capacity (that is ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. IC Insights can now show that due to the surge of merger and acquisition activity in the middle of this decade and with more companies producing IC devices on sub-20nm process technology, suppliers are eliminating inefficient wafer fabs.
92 IC wafer fabs closed or repurposed from 2009-2017
March 07, 2018
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers.
Arrow Electronics appoints new VP of sales EMEA Components
January 26, 2016
Arrow Electronics has appointed Jörg Strughold as vice president sales EMEA (Europe, Middle East and Africa) Components. He joined Arrow from Atmel, where he was vice president sales EMEA.
IC manufacturers close or repurpose 83 wafer fabs from 09-14
June 18, 2015
Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older capacity (i.e., ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers.
WiLAN acquires Qimonda patent portfolio from Infineon
June 03, 2015
WiLAN's subsidiary, Polaris Innovations Limited, has acquired the vast majority of Qimonda AG's patent portfolio from Infineon.
TI ups analog marketshare; Skyworks gains from Apple
May 12, 2015
The top 10 suppliers accounted for 57 percent of analog sales in 2014; and 9 of 10 of the top suppliers have analog sales greater than USD 1.0 billion.
Rochester adds two senior managers in Asia
May 08, 2015
Rochester Electronics has further underlined its commitment to customers in Asia by announcing two new senior management appointments.
Infineon and Qimonda insolvency administrator reach partial settlement
September 25, 2014
Infineon will pay 260 million euros, including 125 million euros for the acquisition of the Qimonda patents. The lawsuit on the economic re-establishment of a shell company and liability for impairment of capital continues however.
IC manufacturers close 72 wafer fabs from 2009-2013
July 01, 2014
150mm wafer fabs take the brunt as suppliers strive for greater efficiency; more fabs on the bubble in 2014.
Court rules in favour of Qimonda
December 18, 2013
Computer manufacturer Hewlett-Packard GmbH has been served with an injunction and ordered to render account and pay damages for infringing on patents registered to Qimonda AG.
Thinfilm names Dr. Peter Fischer as its Chief Product Officer
September 18, 2013
Dr. Peter Fischer will join Thinfilm as its new Chief Product Officer, serving as the company's technical lead in Product Marketing and Business Development.
Qimonda administrator signs MoU with MOSAID
August 15, 2013
The insolvency administrator over the estate of Qimonda AG, Dr. jur. Michael Jaffé and MOSAID Technologies have entered into a Memorandum of Understanding (“MoU”).
DRAM Market grows up
June 25, 2013
It’s said that adversity breeds character—and that certainly seems to be the case for the global market for DRAM (dynamic random access memory).
Qimonda: 7'500 patents and patent applications worldwide on sale
November 22, 2012
The insolvency administrator over the estate of Qimonda AG, Dr. Michael Jaffé, has started the international sales process regarding the patent administration, exploitation and licensing business of the semiconductor manufacturer.
Qimonda: 7'500 patents and patent applications worldwide on sale
November 22, 2012
The insolvency administrator over the estate of Qimonda AG, Dr. Michael Jaffé, has started the international sales process regarding the patent administration, exploitation and licensing business of the semiconductor manufacturer.
Qimonda insolvency administrator doubles claims against Infineon
June 15, 2012
The insolvency administrator of Qimonda AG has increased his request for payment in the lawsuit pending in the Munich District Court I over the alleged economic re-establishment of Qimonda AG.
Qimonda insolvency administrator doubles claims against Infineon
June 15, 2012
The insolvency administrator of Qimonda AG has increased his request for payment in the lawsuit pending in the Munich District Court I over the alleged economic re-establishment of Qimonda AG.
DRAM troubles come to an end, key to success is cloud storage
June 08, 2012
According to TrendForce, this year’s biggest DRAM industry event, the announcement that Japanese manufacturer Elpida will join hands with U.S. maker Micron, marks the end of a perfectly competitive market as Samsung, Hynix, and the new Micron team become the three main players in an oligopolistic market.
Elpida filing to affect 2012 DRAM market
February 27, 2012
With USD 5.53 billion debt, Elpida filed for bankruptcy protection at Tokyo District Court and to affect 2012 DRAM market.
Elpida filing to affect 2012 DRAM market
February 27, 2012
With USD 5.53 billion debt, Elpida filed for bankruptcy protection at Tokyo District Court and to affect 2012 DRAM market.
IC companies close 49 wafer fabs from 2009-2011
February 17, 2012
Japan and North America with most closures, 150mm afer fabs account for 43% of closures.
4GB contract price trend stays strong in 1HFeb
February 15, 2012
4GB contract price trend stays strong in 1HFeb, Elpida's potential industry withdrawal would have a severe negative impact.
4GB contract price trend stays strong in 1HFeb
February 15, 2012
4GB contract price trend stays strong in 1HFeb., Elpida's potential industry withdrawal would have severe negative impact.
Qimonda insolvency administrator quantifies claims against Infineon
February 14, 2012
The insolvency administrator of Qimonda AG has filed an alternative request for payment in the lawsuit pending in Munich District Court I over the alleged economic re-establishment of Qimonda AG.
Infineon provides update on its outlook
October 17, 2011
Infineon Technologies AG announced preliminary results for the fourth quarter of the 2011 fiscal year, the outlook for the first quarter of the 2012 fiscal year and additional provisions relating to the insolvency of its subsidiary Qimonda AG.
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