Northrop Grumman secures $3 billion in missile defence deals August 04, 2026 US Department of War signs framework agreements with Northrop Grumman to ramp production of PAC-3, THAAD components.
Linde wins semiconductor supply deal, to invest $1 billion in US August 04, 2026 Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.
Understanding semiconductor datecodes in long-lifecycle electronics August 04, 2026 The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another issue may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.
Alfen, CATL to deploy 5 GWh sodium-ion BESS in Europe August 04, 2026 This initiative enables Alfen to diversify its battery material portfolio, optimise the cost structure of its energy storage products and strengthen resilience against lithium price volatility.
Dawn raises $25M to advance reusable space transportation August 03, 2026 This Series B funding will directly finance New Zealand-Dutch company Dawn Aerospace’s global rollout, scaling commercial and operational teams in the US and Europe to support its expanding international customer base.
ESCATEC expands advanced SMT capabilities in UK August 03, 2026 The investment will enhance production efficiency and flexibility while strengthening ESCATEC’s ability to support medical manufacturing programmes in the UK.
Intel partners with Lens to boost advanced semiconductor packaging August 03, 2026 Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.
Waldom appoints Jim Kaplan to Advisory Board July 31, 2026 Kaplan, former President and CEO of Cornell Dubilier Electronics, brings nearly four decades of leadership experience in the electronic components industry.
TOP500 Supercomputer List: China Returns to the Top, Europe Holds Strong Position July 31, 2026 The latest edition of the TOP500 ranking of the world's most powerful supercomputers has brought a change at the top. China's LineShine has overtaken the United States' El Capitan, while the number of exascale systems has increased to five. Europe has maintained its position among the world's leading high-performance computing regions.
AccelerComm powers Eclipse’s 5G physical layer for next-gen spacecraft July 31, 2026 Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.
Confidee's answer to shortages: full transparency and the freedom to cancel orders July 30, 2026 As material shortages push lead times for advanced printed circuit boards towards 2028, four-year-old PCB supplier Confidee has built its strategy around the opposite of locking customers into rigid commitments: complete transparency and a clear policy allowing customers to cancel or rebalance production without damaging the relationship. That is according to board member Didrik Bech.
Altus expands headquarters to showcase manufacturing capability July 30, 2026 The investment will enable Altus to install a complete inline manufacturing solution at the heart of its facility, allowing customers to see first-hand how a full production environment can be configured across SMT assembly, THT assembly, backend production and component management.
AI infrastructure boom reshapes electronics supply chain, says in4ma July 29, 2026 The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.
India’s Sigma Advanced Systems acquires Bromford for $16M July 29, 2026 UK-based Bromford’s capabilities complement Sigma’s expertise in manufacturing larger components for the same OEM customers, giving the combined platform a deeper full-range product offering for global aerospace and power generation customers.
FR 4 base materials: shortages, price increasing and allocations July 29, 2026 Why PCB procurement strategies should be reviewed?
Anglia sounds alarm bell on CEM/broker ‘cartel’ July 29, 2026 The issue centres on how blurred lines between manufacturing, distribution and open-market sourcing affect company governance. Anglia said it believes in forging strong, three-way supply chain partnerships between component manufacturer, the customer and the distributor.
AI data centres are consuming PCBs – Chinese lead times stretch to 2028 July 28, 2026 In an interview with Evertiq, Didrik Bech, board member of PCB supplier Confidee, described how the AI infrastructure boom is creating an unprecedented demand for materials, resulting in supply shortages that could reshape market conditions across several European industries.
The ESG bottleneck: finding time for hands-on implementation July 28, 2026 For Europe's electronics manufacturers, sustainability has become far more than a long-term ambition. Customer questionnaires, ESG platforms and an expanding regulatory framework are rapidly becoming part of everyday business, requiring companies not only to improve their environmental performance but also to demonstrate it through an increasing number of reporting frameworks.
Taara launches link planner for wireless optical communications July 24, 2026 The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.
AdvancedPCB installs new SES line at Aurora facility July 23, 2026 Supplied by Equip Tech and manufactured by Universal Circuit Board Equipment (UCE), the SES line incorporates automated chemical management, conveyorized material handling, and integrated process controls throughout the strip, etch and strip (SES) cycle.
India’s Raghu Vamsi Aerospace Group raises $40 million July 23, 2026 The capital will be used to expand manufacturing capacity across the group’s facilities in India, the UK and the US, accelerate development of its upcoming manufacturing campus, and strengthen its mission systems and deep-tech & autonomous systems businesses.
Stop lobbying, start listening: Better policy begins with a conversation July 22, 2026 In late June I spent a full day in Brussels, moderating a room full of speakers, panelists, policymakers and manufacturers, all there to talk about the future of European electronics. By the end of it, one thing was obvious. Everyone in that room agreed the industry matters. Almost nobody disagreed about the stakes. And yet agreement is not the same as alignment, and the gap between "we support you" and "here is what we will actually do" is exactly where good intentions tend to disappear.
Apple overtakes Nvidia again to become the world's most valuable company July 22, 2026 Apple has once again become the world's most valuable publicly traded company - according to Reuters. The iPhone maker has overtaken Nvidia, which had held the top spot for nearly a year thanks to the artificial intelligence boom. Apple is now valued at about USD 4.88 trillion.
Wistron opens Texas facility to produce Nvidia AI systems July 22, 2026 The 324,000-square-foot plant in Fort Worth, Texas produces Nvidia Grace Blackwell Ultra and will produce Vera Rubin Superchips — part of a combined USD 700 million investment in advanced American manufacturing by the US chipmaker.
Keiron raises €20.7M to advance LiFT precision solder paste printing July 22, 2026 Solder paste printing is responsible for over 70% of PCBA defects. Keiron’s HF2 LiFT (Laser-Induced Forward Transfer) printer replaces the stencil printer, jet printer and SPI inspection system with one digital, non-contact platform.
Aerospace OEM adopts machine-agnostic in-situ QA July 21, 2026 The machine-agnostic approach of AmiRIS, the in-process quality assurance (QA) solution from Australian company Additive Assurance, enables a consistent method of collecting and interpreting in-process data across different powder bed fusion platforms and supply chain partners.
Automation without perfection: How intelligent robots can handle HMLV manufacturing July 21, 2026 Traditional automation performs best in a highly organised environment. Products must always arrive in the same position, production lines need to maintain a fixed rhythm, and individual tasks should remain predictable and repetitive. However, the European electronics industry is increasingly operating under completely different conditions. Short production runs, frequent product changes, component shortages and unpredictable order schedules can make a factory resemble a living organism rather than a precisely calibrated machine. Speaking at Evertiq Expo Kraków 2026, Piotr Owczarek, CEO of AiRob, argued that machine vision, 3D modelling and artificial intelligence could make robots better suited to this complex environment.
Tower Semiconductor announces capacity expansion in Japan July 20, 2026 Track one adds new 300mm Silicon Photonics capacity, with full production readiness expected during the fourth quarter of 2027. It consists of repurposing the Arai facility for 300mm Silicon Photonics capacity and advanced packaging capabilities.
Electronic components market: A crisis gathering momentum July 20, 2026 Artificial intelligence, geopolitical tensions, rising raw material prices, and increasingly longer delivery times create a combination of factors that could make life much more difficult for electronics manufacturers.
IndiGo selects Honeywell avionics, APUs to equip 810 new aircraft July 20, 2026 Under this agreement, Honeywell Aerospace will supply 131-9A auxiliary power units, advanced weather radar systems, traffic collision avoidance systems and flight management systems to Indian carrier IndiGo for its order of new Airbus A320neo aircraft.
SWISSto12 raises €73M to meet growing multi-orbit demand July 20, 2026 With this new round, the company is scaling its capacity to meet accelerating demand from commercial and sovereign government customers, spanning HummingLink — advanced, multi-orbit payload solutions — and HummingSat, SWISSto12’s GEO satellite product line.
Sponsored content by ELEMASTER ELECTRONIC EQUIPMENT (SHANGHAI) CO., Ltd Elemaster Shanghai: global standards, local agility “We are where you are”. That’s Elemaster’s founding mantra and it explains why the group built a plant in Shanghai thirteen years ago: to follow its global clients into China, without lowering the bar. “The way we set up the Chinese site was to try to be, as much as possible, a replica, in terms of process and quality, of what we do in Italy and in the rest of the world,” says General Manager Sergio Bonacina. The same consumables, the same key machinery, the same ERP, PLM and MES systems as in Italy: nothing about the plant is a local adaptation.