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Component shortages, AI-driven demand and a shifting industrial base are testing Europe’s electronics supply chain.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

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Claus-Aasholm

September 24, 2026
The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.

Sponsored content by Koh Young Europe

Koh Young, the industry leader in True 3D™ measurement-based inspection solutions, will participate in the initial EFX, Expo for Electronics Manufacturing, from October 6 to 8, 2026, at Messe Stuttgart. The new industry event will bring together experts, manufacturers, and suppliers to explore innovations, exchange ideas, and build partnerships across the electronics manufacturing process chain.

September 14, 2026
Under the agreement, Samsung will integrate Mistral’s AI services and solutions — including its flagship large language model, Mistral Large — across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure.

Sponsored content by TME Transfer Multisort Elektronik

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Automatic quality control was once associated with costly smart cameras and elaborate vision systems. Today, the development of artificial intelligence and compact embedded platforms means that many AI Vision Inspection applications can be implemented much more simply. How does modern quality control using AI work and where is it best to start your own project?

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

Sponsored content by KOH YOUNG

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026, March 16 to 19 at the Anaheim Convention Center. At Booth 1824, Koh Young will demonstrate how AI-powered inspection and software solutions help electronics manufacturers improve stability and productivity amid tighter tolerances, higher mix production, and rising quality expectations.

Indiana

August 31, 2026
The investment — the largest the company has made in the United States — modernized advanced manufacturing across the Indianapolis campus and added full engine-test capability, including new ground test facilities, and an altitude test facility in West Lafayette.

Indiana_groundbreaking

August 28, 2026
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

Yeoju-production-complex

August 26, 2026
South Korean inspection solutions provider Koh Young Technology is building a second production centre at its Yeoju complex in Gyeonggi Province, South Korea, targeting completion in August 2027. The new 12,800 square-metre facility will double the company's total production capacity.

LS_Electric_MOU

August 13, 2026
The collaboration will focus on key DC infrastructure areas, including power conversion systems for energy storage systems, solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs).

Kawasaki-main-office

August 04, 2026
Through this MOU, Chunghwa Telecom, Fujitsu and 1Finity will further advance their existing All-Photonics Network (APN) initiatives and accelerate their collaboration to expand next-generation communication infrastructure in Taiwan.

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July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

Intel-deal-2026

June 05, 2026
Foxconn and Intel are teaming up to jointly develop and deploy next-generation AI infrastructure and intelligent computing platforms, combining Intel's processor and silicon capabilities with Foxconn's manufacturing scale and system integration expertise.

Tessalia

June 04, 2026
Foxconn, Radiall and Thales laid the foundation stone of their future JV. Tessalia is expected to have 800 employees at full production. Production is expected to start at the end of 2029 and to reach more than 50 million SiP components per year by 2033.

Molten_MOU

March 31, 2026
Under the arrangement, Molten will produce graphite via methane pyrolysis, which Posco Future M will then process into spherical graphite through its subsidiary FutureGraph before producing natural graphite anode material at its Sejong plant.

AMD_MOU

March 30, 2026
The companies will collaborate on HBM4 supply for AMD Instinct MI455X GPUs and next-generation DDR5 solutions for AMD EPYC processors and the AMD Helios platform.

Sila_MOU

March 27, 2026
Under the agreement, Posco Future M plans to push advanced battery material technology further by combining the company’s cathode and anode material capabilities with Sila’s silicon anode material technology.

Expo-TMP-2025-003

March 24, 2026
Evertiq Expo Tampere returns on 26 March 2026, bringing together Finland’s electronics community for a day focused on semiconductor reliability, advanced manufacturing, automation strategies, and the evolving business landscape of the European EMS industry.

Sponsored content by KOH YOUNG

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026, March 16 to 19 at the Anaheim Convention Center. At Booth 1824, Koh Young will demonstrate how AI-powered inspection and software solutions help electronics manufacturers improve stability and productivity amid tighter tolerances, higher mix production, and rising quality expectations.

PCB-South_Korea_2

March 05, 2026
The ongoing war between the United States, Israel and Iran could disrupt supplies of key semiconductor manufacturing materials, raising concerns within the global chip industry. The warning was issued by a South Korean ruling party lawmaker after discussions with semiconductor companies and industry groups, according to a report by Reuters.

researchers-working

February 19, 2026
Austria-based AT&S is funding the establishment of a new microelectronics research group at Graz University of Technology (TU Graz), with a focus on IC substrates and advanced packaging technologies.

Scholarship-2

January 21, 2026
Evertiq continues its commitment to supporting the next generation of electronics professionals as the Evertiq Scholarship returns to Tampere in 2026. The scholarship will once again be awarded in connection with Evertiq Expo Tampere, taking place on March 26, 2026.

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The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.

Sponsored content by PEDC

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The Pan-European Electronics Design Conference (PEDC) will take place on 21–22 January 2026 in Prague (www.pedc.eu). Hosted by Fachverband Elektronikdesign und fertigung e. V. (FED) and the Global Electronics Association, PEDC offers a unique, peer-reviewed forum for the electronics design community. The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” Topics will include development, design for excellence (DfX), software and tools, and electronic systems design process.

Roh_Samsung

November 21, 2025
Roh will continue to oversee the company’s mobile business as Head of Mobile eXperience (MX) Business, while Young Hyun Jun will remain Head of Memory Business.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

chip_wafer_v2killer7603

October 27, 2025
India’s L&T Semiconductor Technologies Ltd (LTSCT) will utilize HYS’s facilities in Taiwan to engineer and produce wafers to meet specifications tailored for automotive and industrial applications.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

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