Raltron's Compact Multiband LTE Dipole Antenna Supports Band 71
December 02, 2020
Raltron, a global leader in high performance frequency management components and antenna products, has launched a multiband LTE dipole antenna that covers the entire LTE frequency band in a compact formfactor.
FormFactor acquires MicroProbe
September 04, 2012
FormFactor, Inc. has signed a merger agreement with Astria Semiconductor Holdings, Inc., the parent company of MicroProbe, Inc. Under the terms of the merger agreement, FormFactor will acquire MicroProbe for $100 million in cash and $16.8 million in stock, subject to customary adjustments.
Dyconex offers via fill and stacked via process
February 25, 2010
As a further step towards miniaturization of printed circuit boards, Dyconex has implemented a via filling process for mechanical, laser and plasma drilled blind vias.
FormFactor appoints new Head of European Operations
April 25, 2008
FormFactor announced that it has hired Ronald Vogel, a 19-year veteran of LSI Corporation, as vice president and general manager, Europe.
Sanmina-SCI names new COO
September 21, 2007
EMS provider Sanmina-SCI names new COO and director.
Two industry veterans join Cavendish Kinetics
November 01, 2005
Cavendish Kinetics, which offers a novel new embedded non-volatile memory (NVM) technology, has appointed Don Pinchetti as its Director of Process Engineering, based in 's-Hertogenbosch, The
Netherlands and Paul Billig as its Vice President of Marketing, based in Newark, CA,
USA.
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