New Huawei phones feature SMIC's newest 7nm chips
April 26, 2024
Huawei’s latest Pura 70 series smartphones comprise an advanced made-in-China processor in defiance of US export curbs.
Samsung starts mass production of next-gen V-NAND
April 26, 2024
Samsung Electronics has started making 286-layer NAND flash memory chips, which expand bit density by 50% compared with 8th-generation V-NAND tech.
Micron: government grant will kickstart $50bn investment
April 26, 2024
US memory giant Micron has officially announced its USD 6.1 billion CHIPS and Science Act grant, and says the cash injection will support a huge CAPEX project to 2030.
TSMC: A16 manufacturing will start in 2026
April 26, 2024
The race is on to manufacture the worlds fastest chips, and TSMC has just made a bold claim to be winning it.
China beefs up its chip production – grew 40% in 1Q24
April 25, 2024
Backed by official support and continued industry investments, China's total chip production reportedly surged by 40% during the first quarter of 2024 – reaching 98.1 billion units.
Silicon Creations hits milestone of 10 million wafers in production with TSMC
April 23, 2024
Silicon Creations, a supplier of high-performance analog and mixed-signal IP, has reached a significant milestone: surpassing 10 million wafers in production containing its IP in collaboration with semiconductor foundry TSMC.
Toshiba to axe 5,000 jobs as re-structure continues
April 22, 2024
Japan's Toshiba Corp is reported to have cut its staff count by 5000 – that's 10% of the total – as it tries to streamline its operations as a private company.
Unnamed firm buys world's second High-NA EUV machine
April 22, 2024
ASML has disclosed that it has shipped a second Extreme Ultraviolet Lithography (EUV) machine, but it hasn't named the customer.
State-backed fund takes over photoresist specialist JSR
April 22, 2024
The Japanese government and the state-backed Japan Investment Corp (JIC) have acquired a majority stake in JSR.
Intel builds the world's most advanced EUV litho machine
April 19, 2024
Intel's newly-formed chip foundry business says it has successfully assembled the most advanced piece of semiconductor kit ever made: a High Numerical Aperture Extreme Ultraviolet lithography scanner.
SK hynix and TSMC to collaborate on HBM4 innovation
April 19, 2024
SK hynix has signed an MoU with TSMC for work together on next-generation HBM, with plans to mass produce HBM4 chips from 2026.
Eindhoven University unveils Future Chips project
April 19, 2024
The Eindhoven University of Technology (TU/e) has announced a major new project to 'boost the position of the Netherlands and Europe in the global chip sector.'
Micron standing by for $6.1bn CHIPS and Science Act package
April 19, 2024
US memory chip specialist Micron Electronics will receive a US government subsidy worth USD 6.1 billion next week, say multiple reports.
Tampere University secures EU funding for semiconductor pilot line
April 18, 2024
On 11 April, the Public Authorities Board of the Chips Joint Undertaking selected four pilot production lines for semiconductor chips that will receive funding from the EU. The selected pilot line in Finland will be set up by Tampere University and the VTT Technical Research Centre of Finland.
Samsung to receive $6.4B Chips Act boost for Texas fab
April 17, 2024
The Biden administration will award Samsung Electronics with up to USD 6.4 billion in direct funding to expand the company's semiconductor production in Texas as part of the CHIPS and Science Act.
R2 Semiconductor files lawsuit against Intel in France
April 17, 2024
R2 Semiconductor has filed a patent infringement lawsuit in Le Tribunal Judiciaire de Paris against the French subsidiaries of Intel and its customers, Dell Technologies and Hewlett Packard Enterprise Company and HP Inc.
FPT says its “all In” on AI, automotive and semiconductors
April 17, 2024
FPT Corporation has unveiled its strategic directions for the 2024-2026 period, with five focused areas defined as AI, Automotive, Semiconductor, Digital Transformation, and Green Transformation.
Soitec CEO: we could build a US facility
April 15, 2024
French semiconductor materials company Soitec is weighing up the benefits of constructing a factory in the US in a bid to be near to its key customers.
Gudeng to build EUV pod factory in Japan
April 15, 2024
Gudeng Precision Industrial Co will launch a new facility in Fukuoka Prefecture’s Kurume to reduce its reliance on Taiwanese and Chinese production.
Rapidus establishes subsidiary in Silicon Valley
April 15, 2024
Japanese chip manufacturer Rapidus is targeting the the lucrative US market by setting up a division in the backyard of some of the country's biggest tech firms.
Applied Materials could abandon $4bn US R&D project
April 15, 2024
Sources say Applied Materials might cancel its proposed Silicon Valley research unit because of a lack of government investment.
Apple to supercharge Mac range with AI-optimised M4 chip
April 15, 2024
Apple is preparing for a major overhaul of its laptop and desktop line-up by powering them with its new M4 chipset, which prioritises AI applications.
Shin-Etsu to build semiconductor materials plant in Japan
April 12, 2024
Industrial giant Shin-Etsu Chemical has confirmed it will invest $547 million in a new facility at Isesaki in Japan's Gunma Prefecture.
Huawei to develop lithography tech at new R&D centre
April 12, 2024
Chinese tech giant Huawei is reported to be building a new research unit in Shanghai. It wants to develop chipmaking tools that could eventually rival those of ASML, Canon, and Nikon.
Arm, Intel Google and Meta launch self-designed AI chips
April 12, 2024
The future direction for dominance in the AI chip space took another turn this week as four huge stakeholders revealed their own products.
Coherent has secured $15m of CHIPS Act funding
April 12, 2024
US-based Coherent Corp has received a funding boost from the US government to accelerate the development of its wide and ultrawide bandgap semiconductors for defence purposes.
Arena team up with AMD
April 11, 2024
AMD and Arena are looking to scale the deployment of the first AI test solution to enhance next-generation GPU performance optimisations.
CSA Catapult opens new advanced packaging facility
April 11, 2024
A new GBP 1.6 million facility to help accelerate electrification across the UK has officially opened at the Compound Semiconductor Applications (CSA) Catapult in Newport, South Wales.
Global semiconductor equipment billings slip in 2023
April 11, 2024
Worldwide sales of semiconductor manufacturing equipment edged down 1.3% to USD 106.3 billion in 2023 from an all-time record of USD 107.6 billion in 2022, SEMI reports.
South Korea to spend $6.94bn fighting 'all-out AI war'
April 09, 2024
South Korean President Yoon Suk Yeol has promised to invest 9.4 trillion won (USD 6.94 billion) to keep the country in the global AI race for the next 30 years.
Has Samsung secured an advanced packaging deal with Nvidia?
April 09, 2024
Online reports say Samsung has sealed an advanced packaging order for NVIDIA’s AI processors.
Tata to take over Pegatron's iPhone assembly plant?
April 09, 2024
Speculation is rising that Taiwan's Pegatron is in talks to hand over control of its Indian iPhone manufacturing facility to the Tata Group.
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