Evertiq - First In Electronics News & Expo

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robots-in-factory

China has blocked SoftBank Group’s acquisition of ABB’s robotics business in the country. The ruling is a setback for the USD 5.375 billion deal, which ABB and SoftBank agreed in October last year.

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ASMPT has decided to keep its SMT Solutions segment, ending the review of strategic options it began in January. The company now expects the business, which includes the Siplace placement platform and DEK printers, to double its revenue by 2027 on the back of demand from AI infrastructure.

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A fire at a Panasonic factory in Hsinchu County, Taiwan, has injured five people, and two employees are still missing. The plant belongs to Panasonic Industrial Devices Materials Taiwan, which develops and manufactures high-speed PCB materials and semiconductor packaging materials.

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Japanese component maker Murata plans to invest about JPY 1 trillion (about EUR 5.7 billion) over five years to expand its global production capacity for multilayer ceramic capacitors (MLCCs). The company expects MLCC sales in fiscal 2030 to be at least double those of fiscal 2025.

Mastering Heat, Securing Performance Würth Elektronik eisos

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Various cooling concepts are available to efficiently dissipate heat from electronic components. However, if power losses are not removed reliably, performance degradation, premature aging, or even component failure may result. Selecting the appropriate heat sink and thermal interface material is therefore essential.

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Taiwanese PCB maker Unimicron plans to dissolve Unimicron Germany, its PCB plant in Geldern, to reduce operating costs. The group is injecting up to EUR 35 million into the company to complete existing orders, cover severance payments and pay for the liquidation.

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SK hynix expects demand for memory to outstrip supply through 2030. The Korean memory maker has already secured long-term agreements covering more than half of its production capacity for 2027 and 2028, and reported record revenue of KRW 104.6 trillion (about EUR 70.2 billion) in the third quarter.

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For the first time, the defence industry has become Aspocomp’s largest customer segment, accounting for 40% of the Finnish PCB manufacturer’s net sales in the third quarter. Orders received rose 169% to EUR 15.3 million.

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Dutch photonic chip foundry New Origin has cleared what it describes as the biggest obstacles for its planned fab at Kennispark in Enschede. Feasible solutions are now in place for both power and water supply, although the agreements still need to be worked out and finalised.

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construction-new-HQ-2026

Danish SMT equipment supplier CORE-emt is building a new headquarters in Aars, Denmark, and expects to move in in March 2027. The company says growing demand from EMS and OEM customers in Scandinavia and the Baltic region has left the company short of space.

TTM Technologies has agreed to acquire the Ophir Optics business from MKS for around USD 650 million in cash. Ophir Optics makes infrared thermal imaging and laser optics, and the deal adds optical components to TTM’s defence and industrial offering.

Toshiba plans to double its production capacity for hard disk drives (HDDs) used in AI data centres within fiscal 2027, compared with 2025 levels, Nikkei reports. The company will invest around JPY 60 billion (about USD 380 million) in expanding its plant in the Philippines.

TSMC plans to build a new 3nm fab in Tainan, with production slated to start in the first half of 2028. The company is also moving some 5nm capacity over to 3nm as demand for its leading-edge processes continues to grow.

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GlobalFoundries has been selected to operate two new fabs at its site in Malta, New York, financed by Japan through up to USD 21 billion under the US-Japan trade agreement. In a separate agreement, the US government will also take an equity stake of around 4% in the company.

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Component shortages, AI-driven demand and a shifting industrial base are testing Europe’s electronics supply chain.

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A former 200mm memory fab in Eugene, Oregon, originally built by SK hynix, has been put up for sale. The site has about 170,000 square feet (15,800 square metres) of potential cleanroom production space, and much of the infrastructure is still in place.

Nokia is selling Enterprise Campus Edge, its private wireless and industrial edge business, to investment firm Aurelius. The divestment is another step in Nokia’s strategy to concentrate its resources on fewer areas.

TTM Technologies is putting another USD 400 million into expanding production of advanced PCBs for AI data centres. Rather than building new plants, the company will expand four existing facilities in China and its plant in Penang.

inaguration-Toulouse

An arson attack in the summer of 2024 destroyed much of CSI Sud-Ouest’s PCB factory in Toulouse. Two years on, the Cimulec subsidiary has rebuilt and inaugurated the plant, and none of its 57 employees has been made redundant.

Micron's revenue reached USD 54.2 billion in the fourth quarter of its 2026 fiscal year, almost five times the level of the same quarter last year. Rising memory prices pushed the gross margin to 87%, and the company expects supply to become even tighter in 2027 and 2028.

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Leonardo DRS has established a new subsidiary, DRS UK, and launched local production of tactical radars in the United Kingdom. The new purpose-built production site is intended to meet growing demand for counter-UAS, air defence and active protection systems.

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Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.

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Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

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Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.

Substrates

LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.

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Kitron has broken ground on its new production site in Gålnäs, Örnsköldsvik, Sweden. Construction is starting earlier than planned. In the spring, the company expected construction to begin in early 2027.

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Swiss EMS provider Variosystems is expanding its conformal coating, gluing and specialised manufacturing capabilities at its site in Steinach. The investments target customers in highly regulated industries such as Aerospace & Defence and Medtech & Life Science.

MLCCs

Japanese and Korean MLCC makers are cutting supply to the consumer market to prioritise capacity for AI applications. The shift is opening doors for Chinese suppliers, several of which are now undergoing qualification with global brands such as Dell, HP, ASUS and Acer, according to market research firm TrendForce.

Nexperia-deal

Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.

Ventec Electronics (Suzhou), a subsidiary of Taiwanese laminate specialist Ventec International Group, is leasing an additional 20,000 square meters of factory space in Kunshan, Jiangsu Province, according to a stock exchange filing.

Taichung-Taiwan

Labour unions representing nearly two-thirds of Micron Technology's Taiwan workforce are threatening to strike unless the US memory chip maker changes how it distributes profits to employees, Reuters reports. More than 80% of union members who took part in an internal survey in August backed strike action.

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Amkor Technology has announced a Phase 2 expansion of its Arizona advanced packaging and test campus, increasing the total planned investment to approximately USD 12 billion. The expansion adds 60,000 square metres of cleanroom space, bringing the campus to approximately 93,000 square metres in total.

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A Chinese court has ordered the freezing of equity interests in five Nexperia subsidiaries in China, valued at approximately CNY 2.14 billion, approximately EUR 274 million. The order was obtained by Wingtech, Nexperia's Chinese parent, in connection with an ongoing lawsuit seeking CNY 8 billion in damages.

Old-dustry-electronics

The gap between how long electronics manufacturers need their products to last and how long component makers are willing to keep producing them is widening. For industries like aerospace, medical and defence – where a product can be in service for twenty or thirty years – the shift toward consumer-driven semiconductor lifecycles is creating a slow-moving crisis that is only now getting the attention it deserves.

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