Mitsubishi Fuso-Hino merger: 4 firms collaborate to boost Japan’s automotive sector
July 02, 2025
The four firms agreed to collaborate based on a shared desire to create the future of commercial vehicles and will work together to address issues involving commercial vehicles, such as carbon neutrality and logistics efficiency.
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Toshiba introduces 2-channel automotive high-speed digital isolators
July 02, 2025
The devices ensure the safety and reliability of the on-board charger (OBC) and battery management system (BMS) used in hybrid electric vehicles (HEVs) and electric vehicles (EVs).
Compal's new automotive electronics facility in Poland stands ready
July 01, 2025
Taiwanese electronics manufacturer Compal Electronics has completed the first phase of its new automotive electronics facility in Czeladź, Silesian Voivodeship, Poland, marking a key step in the company's expansion into the European market.
SEALSQ partners with ColibriTD, Xdigit to develop solution for wafer yields
June 30, 2025
The solution aims to significantly improve wafer yield for advanced semiconductor designs at nodes below 7nm by addressing IR Drop issues. It features an advanced mathematical modeling of IR Drop and leverages quantum computing’s ability to solve the resulting complex Partial Differential Equations.
Toyota Tsusho, LG Energy establish battery reclamation JV in US
June 27, 2025
Going forward, Green Metals Battery Innovations (GMBI) plans to build a facility with an objective to achieve annual processing capacity of up to 13,500 tons of scrap, equivalent to more than 40,000 automotive battery units.
NXP Semiconductors completes acquisition of TTTech Auto
June 27, 2025
The open and modular offering of the NXP CoreRide platform and TTTech Auto’s MotionWise safety middleware helps automakers overcome software and hardware integration barriers, while reducing complexity and development efforts and increasing scalability and cost-efficiency required for next-generation vehicles.
Taiwanese Radiant acquires Finland's Inkron Oy
June 26, 2025
Radiant Opto-Electronics is acquiring Finnish advanced optical materials company Inkron Oy from Japan’s Nagase Group for JPY 1.035 billion (EUR 6.12 million).
SCS relocates to new custom-built site in Switzerland
June 25, 2025
Specialty Coating Systems (SCS), formerly Comelec SA, has relocated its Swiss operations to a new custom-built facility.
IPC becomes Global Electronics Association
June 24, 2025
The organization known as IPC – originally the Institute of Printed Circuits – is changing its name to the Global Electronics Association, and unveils a new study on the electronics industry.
Continental launches semiconductor unit, partners with GlobalFoundries
June 24, 2025
Continental's Automotive Group Sector has established a new internal unit — Advanced Electronics & Semiconductor Solutions (AESS) — to design and verify application-specific semiconductor circuits, as the company prepares for its planned spin-off into the standalone entity Aumovio.
Claus Aasholm on the ripples and tsunamis in the chip supply chain
June 23, 2025
“This tide does not lift all boats” – Aasholm warns of structural industry shifts driven by AI, geopolitics and China’s quiet semiconductor conquest.
Tata Elxsi, Infineon partner to accelerate EV innovation in India
June 20, 2025
Tata Elxsi brings its design, system integration and validation capabilities, while Infineon will provide early access to its latest semiconductor technologies—such as SiC-based components, microcontrollers and ICs.
Voltfang raises €15M to boost grid resilience across Europe
June 19, 2025
With this new capital, German cleantech startup Voltfang aims to scale its production capacities and deliver an additional 250 megawatt-hours of sustainable battery storage across Europe by the end of 2026.
LG Chem, Noritake co-develop paste for automotive power semiconductors
June 19, 2025
The silver paste co-developed by LG Chem and Noritake is a high-performance paste containing nano-sized silver (Ag) particles, combining LG Chem’s particle engineering technology with Noritake’s particle dispersion expertise.
TI to invest $60 billion is US manufacturing expansion
June 18, 2025
Texas Instruments plans to invest more than USD 60 billion in US-based semiconductor manufacturing, marking what the company describes as the largest investment in foundational chip production in US history. The investment spans seven fabs across three major sites in Texas and Utah and is expected to support more than 60,000 new jobs.
Flex CEO sees AI and healthcare as US manufacturing bright spots
June 18, 2025
The CEO of global electronics manufacturer Flex, Revathi Advaithi, sees the most optimism for US manufacturing in sectors tied to AI, data centres, and healthcare, while consumer electronics and automotive continue to face headwinds.
Sparc Foundry secures €17.2M public funding for photonic chip plant
June 18, 2025
Sparc Foundry, a Spanish startup focused on photonic semiconductors, has received a EUR 17.2 million capital injection from the Spanish Society for Technological Transformation (SETT). The funding has been approved by the Council of Ministers under the national PERTE Chip initiative and represents 43.9% of the company's capital expansion.
New research highlights radar sensor risks in harsh environments
June 17, 2025
During Evertiq Expo Malmö on 15 May 2025, Jeongmin Kang, postdoctoral researcher at Halmstad University, presented new findings on how dust and moisture can impair the performance of radar sensors in autonomous vehicles. In a follow-up interview, Kang expanded on the implications for sensor design, placement, and future research directions.
Applied Materials and CEA-Leti expand joint lab
June 17, 2025
Applied Materials and CEA-Leti have entered what they call the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Under a memorandum of understanding (MOU), the companies plan to expand their joint lab and develop materials engineering solutions to address emerging infrastructure challenges in AI data centres.
Rheinmetall secures major order from North American truck maker
June 16, 2025
The order involves a mid-six-figure quantity of CWA 2000 high-voltage coolant pumps being used in the North American manufacturer’s battery-powered medium and heavy duty trucks.
MIPS partners with Cyient to enhance RISC-V-based intelligent power solutions
June 13, 2025
The partnership will focus on enabling real-time, safety-critical applications, power delivery, and compute efficiency in demanding platforms for automotive, industrial and data center markets.
AESC starts battery production at Douai gigafactory
June 12, 2025
EV battery manufacturer Automotive Energy Supply Corporation (AESC) has officially started production at its French gigafactory in Douai.
RIR expands manufacturing of 1200V SiC diodes in collaboration with PASC
June 11, 2025
Besides serving existing domestic Indian and US customers, shipping from Taiwan also provides improved access to strategic high-growth markets for SiC devices in the South East Asian region.
NXP reportedly to close four 8-inch fabs in shift toward 12-inch production
June 11, 2025
NXP Semiconductors is reportedly planning to shut down four of its 8-inch (200mm) wafer fabrication plants – one in the Netherlands and three in the United States — as part of a strategic transition to 12-inch (300mm) wafer production.
Sony to release stacked SPAD depth sensor for automotive LiDAR applications
June 11, 2025
The new sensor product employs a dToF pixel unit composed of 3×3 (horizontal × vertical) SPAD pixels as a minimum element to enhance measurement accuracy using a line scan methodology.
IMI to divest Czech manufacturing operations to Keboda
June 10, 2025
Philippines-based EMS provider Integrated Micro-Electronics Inc. (IMI) has signed a definitive agreement to divest its Czech Republic manufacturing subsidiary, IMI Czech Republic (IMI CZ), to Keboda Deutschland GmbH & Co. KG, a unit of the Chinese automotive electronics company Keboda Technology.
Samsung develops next-gen cooling tech with Johns Hopkins
June 06, 2025
By leveraging newly created thin-film Peltier semiconductor devices advanced through cutting-edge nano-engineering technology for the first time, the research team has successfully developed and demonstrated a high-performance Peltier refrigerator.
China’s GigaDevice opens global headquarters in Singapore
June 05, 2025
This strategic move marks a major milestone in GigaDevice’s international growth journey, underscoring its commitment to closer customer engagement, building a resilient and agile supply chain, and strengthening its ecosystem and brand presence across key global markets.
Ecobat completes sale of European battery distribution business to Endless
June 05, 2025
The battery distribution division has been a meaningful part of Ecobat’s European portfolio, supplying a comprehensive range of batteries for various applications, including automotive, commercial vehicles, marine, leisure and industrial uses.
GF looks to reshore chipmaking in $16B US investment
June 04, 2025
Working with the Trump administration and supported by tech companies seeking to onshore critical supply chain components, GlobalFoundries plans to invest USD 16 billion to expand its manufacturing and advanced packaging capabilities in New York and Vermont.
TDK offers 3-terminal filters for automotive applications at higher voltages
June 04, 2025
By optimizing the material selection and product design, the new products feature significantly higher withstand voltage, ranging now from 6.3 V to 35 V, and considerably higher capacitance, ranging now from 0.47 μF to 4.7 μF.
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