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Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Siemens acquires Nextflow Software
June 11, 2021
Siemens to integrate Nextflow Software’s meshless CFD technology into the Xcelerator software portfolio for fast and automated analysis of complex applications with transient flows and motion.
Automotive IC marketshare slips in 2020 after steady gains
June 10, 2021
However, after a 3% drop in 2020, the automotive IC market is forecast to surge more than 25% in 2021, says IC Insights
designLED Products acquired by automotive tech company
June 09, 2021
LED lighting technology company, designLED Products, has been acquired by Faurecia for an undisclosed sum. Livingston based designLED has developed a technology suited to a growing range of automotive lighting and human machine interface (HMI) applications.
Bosch officially opens wafer fab in Dresden
June 08, 2021
Fully connected, data-driven, self-optimising - those are the three keywords used to describe Bosch's new, massive, wafer fab in Dresden.
GF and GlobalWafers partner to expand semiconductor wafer
June 08, 2021
The USD 800 million supply deal includes USD 210 million in capital expansion, the creation of more than 75 jobs in Missouri and will provide wafers for GlobalFoundries' manufacturing facilities in New York and Vermont.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Bosch gives the official go-ahead in Dresden
June 04, 2021
Next week - on June 7th, 2021 - the Bosch semiconductor factory in Dresden will officially open. The Saxon high-tech industry association 'Silicon Saxony' is hoping that it will send a positive signal to other companies.
The global chip shortage - a timeline of unfortunate events
June 04, 2021
COVID-19 has sent traumatic ripples through supply chains around the globe, but the semiconductor supply chain was fragile long before governments shut down and catastrophe struck. In a culmination of negative variables, the chip shortage has amassed over the years from a series of unfortunate events.
CATL plans a new battery plant in Shanghai
June 03, 2021
China's CATL is reportedly planning a new, major, automotive battery plant to be located in Shanghai.
TI tops Analog IC supplier list with room to spare
June 03, 2021
Skyworks Solutions posts the strongest sales increase in 2020 as the top-10 suppliers collectively accounted for 62% of total analog sales, reports market researcher IC Insights.
Quarterly revenue of top 10 foundries breaks records in 1Q21
May 31, 2021
Owing to soaring demands for various end devices, manufacturers have been ramping up their component procurement activities, and foundry capacities, as a result, have been in shortage since 2020, with various foundries raising their wafer prices and adjusting their product mixes to ensure profitability, according to TrendForce.
Murata expands Minato MIRAI Innovation Center
May 31, 2021
Murata Manufacturing announces the opening of Murata Mirai Mobility, an exhibition facility for automotive products, and Murata Interactive Communication Space, a facility to promote open innovation, in its Minato MIRAI Innovation Center.
Sponsored content by Shenzen Kinwong Electronic
The development trend of printed circuit board products and Kinwong's solution
With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).
Follow-up order for in microchip production for Manz
May 27, 2021
Manz AG is seeing increasing interest in equipment for realising Fan-Out Panel Level Packaging (FOPLP). Now, Manz has received a follow-up order in the mid-single-digit million euro range from an unnamed company operating in the field of microchip manufacturing.
Toyoda Gosei to close its UK operations
May 27, 2021
Toyoda Gosei UK Ltd. (TGUK) has informed its employees of a proposal to close the business in the United Kingdom (UK). TGUK has enter a formal period of consultation with its employees regarding the proposed changes.
Global 200mm fab capacity on pace to record growth
May 26, 2021
Semiconductor manufacturers worldwide are on track to boost 200mm fab capacity by 950,000 wafers, or 17%, from 2020 through 2024 to reach a record high of 6.6 million wafers per month, SEMI reports.
VIA optronics to acquire Germaneers
May 25, 2021
VIA optronics AG a supplier of interactive display systems and solutions has closed a definitive agreement under which VIA will acquire Germaneers GmbH, a high-tech engineering company focusing on automotive system integration and user interfaces.
MFS Technology awarded ANSI/ESD S20.20-2014 certificate
May 25, 2021
MFS Technology was recently awarded the ANSI/ESD S20.20-2014 certificate for its Yiyang factory (MFSY) in Hunan, China.
Nordic Semi expands presence in India
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May 24, 2021
Nordic Semiconductor says it is expanding its sales and support presence in India, allowing the company to provide faster customer support to the country’s burgeoning high-tech wireless design and manufacturing sectors in a rapidly expanding IoT market.
