Evertiq - First In Electronics News & Expo

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Dallas_office

June 22, 2026
The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.

Sucha-Beskidzka-2026

June 22, 2026
Polish electronics manufacturer Fideltronik has signed an agreement with one of the leading companies operating in the renewable energy industry. The contract, valued at USD 30 million, covers comprehensive printed circuit board (PCB) assembly services.

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Energy_IES_MOU

June 22, 2026
The collaboration is expected to add significant wind power, solar, and energy storage capacity and help create an AI-powered energy infrastructure that integrates energy systems with intelligent systems.

Exolaunch

June 22, 2026
EQT will support Exolaunch in scaling its global operations and investing into the development of new satellite launch and deployment technologies. It will also help drive the expansion into additional services across the satellite mission lifecycle.

Martin_manufacturing

June 22, 2026
The two companies will explore opportunities to accelerate the delivery of critical capabilities and innovation by combining Lockheed Martin’s defense production expertise with General Motors’ advanced industrial capabilities in commercial manufacturing and engineering.

Edge_deal

June 19, 2026
The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.

Announcement-of-the-Top-List

June 18, 2026
With 31 companies in the global EMS/ODM Top 100, Europe has breadth – but not scale. A look at the region's top 20 reveals a manufacturing base spread across 14 countries, led by Germany and with the Nordics punching well above their weight.

quantum-technologies-1

June 18, 2026
The agreement creates a foundation for the companies to jointly identify high-impact industrial use cases and explore quantum and hybrid quantum-classical approaches for next-generation engineering workflows.

June 18, 2026
U.S.-based TTM Technologies has announced plans to acquire Switzerland’s Swiss Technology Group and Germany’s ILFA GmbH. Both transactions are expected to be completed in the third quarter of 2026.

MIMCAP_silicon_interposer

June 18, 2026
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.

LG_Uplus_MoU

June 18, 2026
Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.

partnership_Franz26

June 17, 2026
Under the MoU, the two companies will deploy Airbus Flexrotor UAVs across international markets, leveraging Extensee’s end-to-end operational capabilities with Garuda Aerospace’s drone technology expertise.

Semiconductor_SinChip

June 17, 2026
This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.

Headquarters-Durham

June 17, 2026
The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

headquarters-2021

June 17, 2026
Principal Mineral has acquired Isola Group, a century-old manufacturer of copper-clad laminates and dielectric prepregs, and raised approximately USD 280 million to fund its next phase of growth. The deal closed on June 16, 2026.

Liquide_SK_hynix

June 16, 2026
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.

Honda_Hanoi_MoU

June 15, 2026
The three parties will work together to build an electric two-wheeler ecosystem that includes Battery Swapping Stations in central Hanoi, battery standards, safety management systems, and new platform-based business models for electric two-wheelers.

quantum-computer_geralt

June 15, 2026
The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.

cooperation-3

June 15, 2026
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.

Robotics

June 12, 2026
German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.

motherboard-Germany

June 12, 2026
From AI-driven production planning and advanced PCB manufacturing to supply chain resilience and Europe's industrial competitiveness, Evertiq Expo Berlin 2026 will bring together experts from across the electronics industry to discuss some of the sector's most pressing challenges. Ahead of the event on 18 June, we take a closer look at this year's conference programme.

axonite_chip

June 12, 2026
Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

Europe

June 12, 2026
The Battery Booster Facility established by the European Commission is expected catalyse private investment, accelerate industrial deployment and strengthen Europe’s industrial competitiveness and strategic autonomy in clean technologies.

SiC-Wafer

June 11, 2026
Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

robotics

June 11, 2026
The collaboration will bring together Nvidia’s full-stack accelerated computing platforms with Doosan Group’s capabilities in industrial automation, power generation and advanced electronics materials to support next-generation AI infrastructure.

lab

June 10, 2026
Swedish PCB supplier NCAB has published a stark supply chain outlook in May 2026, describing a market under simultaneous pressure from AI demand, geopolitical disruption and raw material shortages. The company's conclusion is direct: what the industry is experiencing now is not a temporary disruption — it is a structural reset.

LG_AI_factory

June 09, 2026
The collaboration brings together Nvidia’s full-stack, end-to-end AI factory platform with LG Group’s global expertise in consumer electronics, robotics, mobility components, smart spaces and data center technologies.

Samsung_chip_design

June 09, 2026
Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software — including design, verification, simulation and silicon manufacturing enablement — with Samsung Foundry’s latest process technologies.

Aerospace_test

June 09, 2026
The ground test was the company’s first to validate the full integrated system, including GE Aerospace-developed motor/generators, power converters and inverters, controllers, Dowty propellers, Avio Aero gearboxes, and a CT7 engine.

Santa-Clara-HQ-Entrance

June 08, 2026
As AI factories scale globally, this strategic partnership enables memory supply to keep pace with Nvidia’s infrastructure roadmap and the sustained buildout of AI infrastructure worldwide.

Tijuana-Mexico

June 08, 2026
Infineon Technologies says that it will gradually transfer production from its backend manufacturing site in Tijuana, Mexico, to other locations in its global network. The company says the move is aimed at improving scalability, productivity and long-term competitiveness.

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