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New-Logistics-Hub

October 09, 2026
Lam Research has gathered all of its logistics operations in California under one roof in Livermore. At the heart of the new hub is an automated storage system that retrieves parts in under 30 seconds.

sign-tom-edman-ceo

October 09, 2026
Six weeks after the deal was announced, TTM Technologies has completed its acquisition of the software-defined radio maker. TTM now says explicitly that the purchase will dilute its earnings per share next year.

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cosmos-2

October 09, 2026
Signing the agreement marks a step toward creating a hub for developing an internationally competitive telecommunications sector and advancing the emergence of a wider Latvian space innovation ecosystem.

October 09, 2026
Under the agreement, GF will provide manufacturing service to TSMC, and add fabrication capacity at its Malta, New York facility, supporting growing demand for high-performance computing and AI systems.

building

October 09, 2026
Israeli PCB manufacturer PCB Technologies is buying Gorilla Circuits in San Jose, California. The deal gives the company its first manufacturing base in the US and a way into contracts that require onshore production.

battery_recycling

October 09, 2026
The French company aims to demonstrate on an industrial scale that a battery that has reached the end of its first life cycle can become a new resource for manufacturing new batteries in France.

Opens-Automation-Robotics-Center-Stuttgart-Germany

October 08, 2026
Delta Electronics has opened a centre in Stuttgart where customers, partners and system integrators can test the company's robots and automation solutions. Around seven engineers will be based at the site.

ZuriQ-partnership-advance-scalable-quantum-chips

October 08, 2026
Infineon and Swiss quantum computing start-up ZuriQ are expanding their collaboration to scale ZuriQ's trapped-ion architecture towards larger qubit counts. The partnership combines ZuriQ's chip design with Infineon's semiconductor manufacturing, advanced packaging and integrated photonics.

advanced-packaging-centre-Tokyo

October 08, 2026
Japanese PCB and substrate technology developer Elephantech will open a new facility in Tokyo in March 2027. The Toyosu Advanced Packaging Center is intended to scale up manufacturing and advance packaging R&D for AI servers.

gan-sic-periodic-table

October 07, 2026
Navitas Semiconductor has completed its acquisition of Claros, a developer of integrated voltage regulators (IVR) for AI data centres. The deal adds the last stage of power conversion, closest to the processor, to Navitas' GaN and SiC portfolio.

signing-the-contract_2

October 06, 2026
Altera Corporation and Rutronik have signed a strategic distribution agreement to expand access to Altera’s FPGA portfolio across the European market, the companies announced in a press release.

dresden-cleanroom

October 06, 2026
Infineon Technologies has completed its acquisition of C2i Semiconductors, a Bengaluru-based company specialising in software-defined multiphase controllers and smart power stages for AI data centres. The C2i team now becomes part of Infineon's Power Systems division.

October 06, 2026
Huawei and Qualcomm have signed a multi-year cross-licence agreement covering their patent portfolios in 5G, compute, AI and networking. As part of the deal, Qualcomm will also buy some of Huawei's US patents.

building

October 05, 2026
Under the agreement, Aviat has granted DEAPL, a subsidiary/JV of Indian EMS provider Dixon, a limited license to use specified intellectual property, including technical know-how, solely for the manufacture, use, offer for sale and sale of microwave radios.

October 05, 2026
The collaboration will combine Sony’s sensing and AI technologies with Aramco’s industrial data, operational experience, established infrastructure and portfolio of real-world industrial use cases.

Reactive_Technologies

October 05, 2026
Reactive Technologies’ platform, known as GridVerix, provides real-time measurements of key indicators of grid stability, including inertia as well as the strength and stability of voltage across different parts of the grid.

Electronics_chiller_factory

October 05, 2026
The company plans to invest a total of USD 110 million in a new air-cooled chiller production facility in the US and in expanding two air-cooled chiller production lines in South Korea.

Safran_Brazil

October 05, 2026
A key initiative under the agreement will be to establish solid rocket motor development and production capabilities at Brazilian EDGE Group entity SIATT’s facilities in Brazil.

modern-factory-with-robots_4

October 05, 2026
The new funding brings the total capital raised by the US startup to USD 500 million, valuing it at USD 1.45 billion. The fresh capital will accelerate the scaling of Palette Neat, an agentic software environment for Physical AI.

team

October 02, 2026
German energy-tech company Reverion’s solid oxide technology converts gas electrochemically into electricity, without combustion, and captures the CO₂ in the fuel stream in pure form that can be reused or permanently stored.

TDB

October 02, 2026
The technology is intended to support applications including wide-area and long-range surveillance, human and vehicle detection, and target classification, while enabling imaging across diverse weather and lighting conditions.

interceptors

October 02, 2026
Building on agreements between Raytheon and the Department of War, this long-term order ensures a consistent, reliable supply of SM-6s for the U.S. Navy.

signing-the-contract_2

October 02, 2026
Founded in Shanghai in 2016, Puya Semiconductor supplies NOR Flash and EEPROM memories spanning a wide range of densities, voltage options, temperature grades, and package configurations for industrial, consumer, wearable, PC, mobile, automotive and IoT applications

opens-backend-manufacturing-hub-Thailand

October 01, 2026
Infineon Technologies has inaugurated a new backend manufacturing site in Samut Prakan, Bangkok. The site currently has one module but is designed to grow to five, which could make it one of Infineon's largest backend sites over time.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

EPIC-center

September 30, 2026
Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.

Gotion

September 30, 2026
German automaker Volkswagen and Chinese battery manufacturer Gotion High-Tech are expanding their cooperation in electric vehicle battery production. Gotion will invest €1.1 billion (around $1.25 billion) in the PowerCo plant in Valencia, Reuters reported. Following the transaction, the Chinese company will hold a 49% stake in the factory, while Volkswagen will retain a majority stake.

Substrates

September 30, 2026
LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.

building_logo

September 30, 2026
Samsung Electronics to invest USD 500 million; five other Samsung affiliates investing the remainder. Samsung commits to Helix’s global AI infrastructure build-out alongside KKR, Kuwait Investment Authority, NVIDIA and Vistra.

Discussion-Krakow-2026

September 29, 2026
In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.

Electronics_Besi_MOU

September 29, 2026
Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

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