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Kawasaki-main-office

August 04, 2026
Through this MOU, Chunghwa Telecom, Fujitsu and 1Finity will further advance their existing All-Photonics Network (APN) initiatives and accelerate their collaboration to expand next-generation communication infrastructure in Taiwan.

Albuquerque-facility-2022

August 04, 2026
US Department of War signs framework agreements with Northrop Grumman to ramp production of PAC-3, THAAD components.

PCB-India_2

August 04, 2026
The 30-acre facility in Andhra Pradesh will have an annual production capacity of 96 million chips and serve high-growth sectors such as AI, high-performance computing, data centres and high-speed communications.

CATL_partnership

August 04, 2026
This initiative enables Alfen to diversify its battery material portfolio, optimise the cost structure of its energy storage products and strengthen resilience against lithium price volatility.

Aerospace_spaceplane

August 03, 2026
This Series B funding will directly finance New Zealand-Dutch company Dawn Aerospace’s global rollout, scaling commercial and operational teams in the US and Europe to support its expanding international customer base.

sign

August 03, 2026
The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

Dallas_Center

August 03, 2026
The Texas Demo Center will showcase MIRTEC’s advanced inspection portfolio, including 3D AOI and 3D SPI systems designed to help manufacturers improve quality, increase throughput, and enhance process control.

glass_substrate

August 03, 2026
Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

July 31, 2026
The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications

li-battery_1

July 31, 2026
Under the MOU, US-based company Factorial Energy and South Korea’s SK On will jointly evaluate the technical feasibility and manufacturing considerations for Factorial’s FEST solid-state battery technologies.

Indie

July 30, 2026
The collaboration brings together Eros Innovation’s expertise in sovereign AI, multimodal foundation models, cultural intelligence, healthcare AI and digital platforms with Thakers’ expertise in chip design, embedded systems, aerospace and space technologies.

tes_logo

July 30, 2026
The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.

new-technologies_2

July 29, 2026
The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.

Henna-Virkkunen

July 29, 2026
The meeting reviewed progress under the Trade and Technology Council’s (TTC’s) three work strands: digital connectivity and strategic technologies; clean and green technologies; and trade, investment and resilient value chains.

sign

July 29, 2026
Together, Silvaco’s physics-based simulation portfolio and Nvidia accelerated computing and AI will help customers design, simulate and optimize increasingly complex semiconductor technologies.

signing-the-contract_2

July 29, 2026
The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Playground_Global_MOU

July 28, 2026
The collaboration aims to strengthen the pathway from laboratory innovation to global commercial impact by combining Playground’s expertise in building and scaling frontier technology companies with the CEA’s scientific research and technology-transfer capabilities.

sign-on-building

July 24, 2026
Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.

of_Arizona

July 24, 2026
The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.

link_planner

July 24, 2026
The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.

SES_Line

July 23, 2026
Supplied by Equip Tech and manufactured by Universal Circuit Board Equipment (UCE), the SES line incorporates automated chemical management, conveyorized material handling, and integrated process controls throughout the strip, etch and strip (SES) cycle.

Phil-Stoten-2

July 22, 2026
In late June I spent a full day in Brussels, moderating a room full of speakers, panelists, policymakers and manufacturers, all there to talk about the future of European electronics. By the end of it, one thing was obvious. Everyone in that room agreed the industry matters. Almost nobody disagreed about the stakes. And yet agreement is not the same as alignment, and the gap between "we support you" and "here is what we will actually do" is exactly where good intentions tend to disappear.

Indie

July 22, 2026
Paras Semiconductors, a subsidiary of Indian company Paras Defence and Space Technologies, has signed an MOU with the Madhya Pradesh government’s department of science and technology to jointly set up an OSAT facility in the state’s Indore-Ujjain region.

chip

July 22, 2026
Farnell will offer Hailo’s AI products via their global distribution network, e-commerce platforms, and engineering community, enabling engineers, developers and enterprises to integrate advanced edge AI capabilities into their edge designs more efficiently and at scale.

Paul_Rooimans_CEO

July 22, 2026
Solder paste printing is responsible for over 70% of PCBA defects. Keiron’s HF2 LiFT (Laser-Induced Forward Transfer) printer replaces the stencil printer, jet printer and SPI inspection system with one digital, non-contact platform.

team

July 21, 2026
The financing will support the US company’s continued development of scalable superconducting quantum computing technologies, expansion of semiconductor collaborations, and acceleration of its target toward fault-tolerant quantum computing.

Indigo

July 20, 2026
Under this agreement, Honeywell Aerospace will supply 131-9A auxiliary power units, advanced weather radar systems, traffic collision avoidance systems and flight management systems to Indian carrier IndiGo for its order of new Airbus A320neo aircraft.

Hexadrone_MOU

July 17, 2026
By combining Vietnamese firm Gremsy’s stabilization and multi-sensor technology with French company Hexadrone’s versatile, open-innovation aircraft architecture, the two companies are set to accelerate the commercialization of turnkey aerial systems.

Energy_Storage

July 17, 2026
The facility is equipped with advanced Industry 4.0 technologies, Automated Guided Vehicles (AGVs), intelligent material handling, automated assembly lines, and advanced testing and quality assurance systems.

cooperation-1

July 16, 2026
ELIgnite, a new Horizon Europe project coordinated by the Extreme Light Infrastructure ERIC (ELI), will streamline access to advanced laser facilities, making it easier for researchers to discover, apply for, and use ELI’s capabilities.

PCB-India_2

July 16, 2026
Companies involved in the manufacturing and R&D of the machines and manufacturing of materials, chemicals and gases that are essential for manufacturing semiconductors will be incentivized.

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