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IIT_Hyderabad_MOU

June 25, 2026
As part of this collaboration, the Centre for Development of Telematics (C-DOT) is establishing a Centre of Excellence (CoE) at IIT Hyderabad to accelerate research, innovation and capacity building in advanced communication domains in India.

June 24, 2026
Nokia and Lenovo have signed a multi-year, multi-technology patent cross-license agreement. The terms are confidential. The two companies previously signed a similar agreement in 2021.

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Munich-facility

June 24, 2026
The European Commission has approved EUR 76 million in German state aid for QuantumDiamonds GmbH to establish a semiconductor testing equipment facility in Munich, Germany. The facility will be the first in the EU to produce semiconductor metrology and inspection systems based on quantum sensing.

quantum-technologies-1

June 24, 2026
By adding semiconductor and nanophotonics fabrication capabilities, advanced packaging expertise and specialized engineering talent, QCi is strengthening its operational capabilities and manufacturing readiness.

Space_AI

June 24, 2026
The investment will accelerate the commercial rollout of Irish firm Ubotica’s Live Maritime Intelligence platform, which enables governments and maritime agencies to detect emerging threats across maritime territories in real time.

Linz-facility

June 23, 2026
A Munich district court has ruled in favour of Infineon Technologies in two further patent infringement cases against Chinese GaN manufacturer Innoscience. It is the third and fourth legal defeat for Innoscience in an ongoing series of proceedings across Germany and the United States.

Cathie-Gridley-EVP-and-President-Aerospace-Defense

June 23, 2026
TTM Technologies has opened a new Ultra-HDI printed circuit board manufacturing facility in Syracuse, New York, in the United States. The USD 130 million investment – including USD 30 million from the US Department of War – is set to create up to 400 new jobs and bring TTM's total workforce in the region to approximately 1,000.

Dallas_office

June 22, 2026
The investment in advanced test and packaging (ATP) operations in Allentown, Pennsylvania, will increase domestic production capacity of the optical networking technologies that power scalable AI infrastructure connectivity in the US.

Sucha-Beskidzka-2026

June 22, 2026
Polish electronics manufacturer Fideltronik has signed an agreement with one of the leading companies operating in the renewable energy industry. The contract, valued at USD 30 million, covers comprehensive printed circuit board (PCB) assembly services.

Energy_IES_MOU

June 22, 2026
The collaboration is expected to add significant wind power, solar, and energy storage capacity and help create an AI-powered energy infrastructure that integrates energy systems with intelligent systems.

Exolaunch

June 22, 2026
EQT will support Exolaunch in scaling its global operations and investing into the development of new satellite launch and deployment technologies. It will also help drive the expansion into additional services across the satellite mission lifecycle.

Martin_manufacturing

June 22, 2026
The two companies will explore opportunities to accelerate the delivery of critical capabilities and innovation by combining Lockheed Martin’s defense production expertise with General Motors’ advanced industrial capabilities in commercial manufacturing and engineering.

Edge_deal

June 19, 2026
The two companies have also announced a joint venture term sheet for the co-development of an extended-range precision-guided weapon based on the Hammer family.

Announcement-of-the-Top-List

June 18, 2026
With 31 companies in the global EMS/ODM Top 100, Europe has breadth – but not scale. A look at the region's top 20 reveals a manufacturing base spread across 14 countries, led by Germany and with the Nordics punching well above their weight.

quantum-technologies-1

June 18, 2026
The agreement creates a foundation for the companies to jointly identify high-impact industrial use cases and explore quantum and hybrid quantum-classical approaches for next-generation engineering workflows.

June 18, 2026
U.S.-based TTM Technologies has announced plans to acquire Switzerland’s Swiss Technology Group and Germany’s ILFA GmbH. Both transactions are expected to be completed in the third quarter of 2026.

MIMCAP_silicon_interposer

June 18, 2026
By combining high-density embedded capacitors, a scalable modeling framework for passive components, and laser-assisted bonding for III-V chiplet assembly, the platform lays the foundation for next-generation wireless (mmWave and sub-THz) systems.

LG_Uplus_MoU

June 18, 2026
Under the partnership, Samsung Research will develop core Integrated Sensing and Communication (ISAC) and AI-driven 6G technologies while LG Uplus will lead validation including data provision and field-testing infrastructure setup.

partnership_Franz26

June 17, 2026
Under the MoU, the two companies will deploy Airbus Flexrotor UAVs across international markets, leveraging Extensee’s end-to-end operational capabilities with Garuda Aerospace’s drone technology expertise.

Semiconductor_SinChip

June 17, 2026
This move will complement QBit’s existing high-performance SoC platforms, boosting its ASIC design services capability and amplifying the Taiwanese company’s market layout across Edge AI, HPC, optical communications and automotive sectors.

Headquarters-Durham

June 17, 2026
The companies plan to develop standards for high-voltage silicon carbide power modules, supporting solid-state transformers, industrial electrification and next-generation aerospace & defense platforms while strengthening supply chain resilience.

axonite_chip

June 17, 2026
The joint effort with the Fondazione Chips-IT builds on Japan and Europe semiconductor cooperation. Rapidus has also signed an MOU with the UK Semiconductor Centre, a national body promoting the semiconductor industry in the UK.

headquarters-2021

June 17, 2026
Principal Mineral has acquired Isola Group, a century-old manufacturer of copper-clad laminates and dielectric prepregs, and raised approximately USD 280 million to fund its next phase of growth. The deal closed on June 16, 2026.

Liquide_SK_hynix

June 16, 2026
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.

Honda_Hanoi_MoU

June 15, 2026
The three parties will work together to build an electric two-wheeler ecosystem that includes Battery Swapping Stations in central Hanoi, battery standards, safety management systems, and new platform-based business models for electric two-wheelers.

quantum-computer_geralt

June 15, 2026
The French company, bringing semiconductor-grade manufacturing and industrialization to quantum computing, plans to deploy its first commercial quantum computer through the cloud by the end of 2026 under its Alloy product line.

cooperation-3

June 15, 2026
The partnership brings together CADFEM APAC’s expertise in multiphysics simulation, digital engineering and predictive development frameworks with SilTerra’s knowledge of semiconductor manufacturing, process development and fabrication technologies.

Robotics

June 12, 2026
German company Neura Robotics is building a new category of AI infrastructure where cognitive robots continuously learn, collaborate and operate across real world environments through a shared intelligence ecosystem called the Neuraverse.

motherboard-Germany

June 12, 2026
From AI-driven production planning and advanced PCB manufacturing to supply chain resilience and Europe's industrial competitiveness, Evertiq Expo Berlin 2026 will bring together experts from across the electronics industry to discuss some of the sector's most pressing challenges. Ahead of the event on 18 June, we take a closer look at this year's conference programme.

axonite_chip

June 12, 2026
Forge Nano’s TEPHRA platform is designed for high-volume semiconductor manufacturing and delivers the film uniformity, process repeatability, throughput, and manufacturing scalability required for commercial production environments.

Europe

June 12, 2026
The Battery Booster Facility established by the European Commission is expected catalyse private investment, accelerate industrial deployment and strengthen Europe’s industrial competitiveness and strategic autonomy in clean technologies.

SiC-Wafer

June 11, 2026
Infineon Technologies and Siemens have announced a collaboration to advance electrical protection in data centres, production facilities and battery storage systems. Infineon will supply silicon carbide power modules to Siemens for use in its SENTRON 3QD2 semiconductor circuit breakers.

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