Evertiq - First In Electronics News & Expo

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WARSAW2026-60

November 13, 2026
Growing demand driven by advances in artificial intelligence is exacerbating problems with the availability of electronic components. Manufacturers are increasingly having to source components outside official distribution channels, raising the risk of buying counterfeit products or parts that are unsuitable for assembly. Klaudia Cyzio from HTV Alter Technology discussed these industry challenges in an interview conducted during Evertiq Expo 2026 in Warsaw.

building_logo

November 13, 2026
The total investment in the expansion is about USD 155 million. The building will be renovated, introducing cleanrooms and other arrangements to make it suitable for semiconductor production equipment (SPE) production.

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Devices_Alif_Semiconductor

November 13, 2026
In September, Analog Devices, Inc. (ADI) and Alif Semiconductor had announced that they had entered into a definitive agreement under which ADI would acquire Alif in an all-cash transaction for USD 1.35 billion.

Lauterbach_acquisition

November 13, 2026
German firm Lauterbach develops comprehensive, modular and extensible development and verification tools for microprocessors and embedded CPU cores in the form of hardware-assisted debuggers and real-time trace tools.

g-10-asp

November 12, 2026
US photonics company Aeluma has bought an Aixtron G10-AsP system to expand production of photodetectors and lasers on its non-indium phosphide (non-InP) platform. The tool supports 150 mm and 200 mm wafers and has been configured for Aeluma’s own processes.

capstone-jorg-strughold

November 12, 2026
Arrow Electronics has launched Capstone, a new global business dedicated to interconnect, passive and electromechanical (IP&E) components. The launch is part of a wider realignment of Arrow’s components business, which is moving from a geographic to a technology-based operating model.

Ferrotec-opening-Kulim-plant-2026

November 12, 2026
Ferrotec has opened its second manufacturing plant in Kulim, Malaysia, which will create more than 1,000 new jobs. The new plant brings the company’s total investment in its two Kulim sites to about MYR 1.9 billion.

Indie

November 12, 2026
The collaboration seeks to boost the companies’ competitive position in India’s market. By leveraging their resources and capabilities, Sanken Electric and Kaynes aim to mitigate risks associated with fluctuations in demand while maximizing investment efficiency.

building_logo

November 11, 2026
The solution establishes a unified digital thread by connecting people, processes and data across the semiconductor lifecycle, from IP management, new product introduction and supplier collaboration to quality and regulatory compliance.

ICs

November 10, 2026
European distribution of electronic components grew by 42.7% YoY to EUR 5.4 billion in the third quarter, according to DMASS. For the first nine months, sales rose by 30.2% to EUR 15.0 billion.

November 10, 2026
US company Diamond Foundry says it has grown the first single-crystal diamond with a diameter of 200 mm, the same size as a standard semiconductor wafer. The company sees it as a step towards using diamond as a substrate material in chip manufacturing.

wafer-silicon-sic-gan

November 10, 2026
Infineon has processed 300 mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, using existing silicon manufacturing equipment. The company says it’s the first to do so in a full-scale semiconductor fab.

PCB-India_2

November 10, 2026
The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.

nvlink_fusion

November 09, 2026
Supported by Korea’s Ministry of Science and ICT (MSIT), the collaboration aims to support AI services tailored to Korea’s language, industries and priorities, connecting Korean semiconductor development with the systems and operational capabilities needed to deliver AI at scale

November 09, 2026
The 512GB DDR5 module vertically stacks DRAM dies interconnected by through-silicon vias (TSVs) to maximize density within individual DRAM packages while preserving the performance modern data center architectures demand.

LX61101

November 09, 2026
LX61101 is an MCU optimized for motor control in automotive body electronics. Beginning with vehicles that Hyundai Motor and Kia plan to produce in the second half of this year, LX61101 will be applied to a broader range of vehicle models.

Austin-campus

November 06, 2026
Applied Materials is increasing its investment in BE Semiconductor Industries N.V. (Besi), a Netherlands-based manufacturer of assembly equipment for the semiconductor industry, to approximately 20 percent of Besi’s outstanding shares.

Nano_gigafactory

November 06, 2026
The acquisition adds a high-volume production coating business, an established global customer base and a complementary material and equipment portfolio to Forge Nano’s ALD platform.

nexperia-5

November 05, 2026
Nexperia has taken legal action in the Netherlands against its Chinese parent Wingtech, Nexperia China and its former CEO, Zhang Xuezheng, seeking damages it currently estimates at USD 2 billion. At the same time, a Dutch court has granted Nexperia an injunction protecting its intellectual property rights in the EU.

Siplace-machines-2026

November 05, 2026
ASMPT has decided to keep its SMT Solutions segment, ending the review of strategic options it began in January. The company now expects the business, which includes the Siplace placement platform and DEK printers, to double its revenue by 2027 on the back of demand from AI infrastructure.

fire-alarm-bells-ringing

November 04, 2026
A fire at a Panasonic factory in Hsinchu County, Taiwan, has injured five people, and two employees are still missing. The plant belongs to Panasonic Industrial Devices Materials Taiwan, which develops and manufactures high-speed PCB materials and semiconductor packaging materials.

equipment

November 04, 2026
Axcelis Technologies and Veeco Instruments now expect their all-stock merger to close by the end of the first quarter of 2027. The deal is still waiting for approval from China’s competition authority, SAMR, and the companies must also refile with US regulators.

MEGTRON-material

November 03, 2026
Panasonic Industry will invest about JPY 92 billion (about EUR 520 million) to expand production of high-performance PCB materials and conductive polymer capacitors for AI servers, and to build a new R&D centre for next-generation semiconductor packaging materials.

semiconductor-engineer

November 03, 2026
Bosch will move its semiconductor business into a dedicated division from January 2028. The company aims to reach semiconductor sales of around EUR 5 billion by 2030, and plans to open up more of its manufacturing capacity to external customers.

Vytautas-Gene

November 03, 2026
Europe says it wants its PCB industry back. But when Vytautas Ilgūnas, CCO of TLT PCB, asks whether customers actually mean it, industry veteran Gene H. Weiner’s answer is blunt: “They say yes, but behave no.” Ilgūnas himself sees a European market that has started to move – though not everywhere at the same speed.

building_logo

November 02, 2026
Marvell Technology has agreed to acquire optical component maker Lumentum in an all-stock deal that values Lumentum at an enterprise value of USD 115 billion. The companies plan to combine Marvell’s electrical interconnect and custom silicon with Lumentum’s lasers and optical transceivers as AI data centres move from copper to optical connectivity.

Guwahati_Tata_Electronics

November 02, 2026
With an aim to address the growing need for a skilled workforce in the Indian semiconductor industry, this collaboration will develop educational and training programs aligned with industry requirements.

November 02, 2026
While the importance of semiconductors in vehicles continues to grow structurally, demand for wafer manufacturing capacity for high-voltage technologies is rising sharply. With the extended supply agreement, Elmos aims to address these developments at an early stage.

Penang_factory

November 02, 2026
The new facility will primarily focus on semiconductor equipment manufacturing and AI solutions, with dedicated space for contract manufacturing activities.

Semiconductor_WICOP

October 30, 2026
With WICOP, Seoul Viosys and its parent company Seoul Semiconductor have already developed and mass produced ultraviolet, blue, green, red and infrared LEDs under 100 µm. WICOP 3 now extends that capability to white light without rare earth elements.

Factory-Manu-Skytta-ceo-2024

October 29, 2026
For the first time, the defence industry has become Aspocomp’s largest customer segment, accounting for 40% of the Finnish PCB manufacturer’s net sales in the third quarter. Orders received rose 169% to EUR 15.3 million.

flags

October 27, 2026
Volkswagen Group has chosen NXP as a strategic technology partner for its future zonal vehicle architecture. NXP’s S32K5 family of microcontrollers will serve as a common building block across all the group’s brands and vehicle segments, and the first vehicle using the new architecture is planned for 2027.

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