Paras, BroadPak to develop advanced packaging facility in India
The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification.
India’s Paras Semiconductors, a subsidiary of Paras Defence and Space Technologies, has announced a technology partnership with US-based BroadPak Corporation to develop advanced semiconductor packaging capabilities in India, according to a report by Indian news agency PTI.
Through the partnership, Paras Semiconductors aims to set up an advanced heterogeneous integration and 3D packaging OSAT facility in India.
The proposed unit will focus on 2.5D/3D packaging, chiplet integration, hybrid bonding, wafer-level and panel-level fan-out packaging, co-packaged optics, and testing and qualification, the company said, according to the PTI report.
“Our entry into the semiconductor sector represents a strategic expansion into a technology domain that is increasingly critical to India’s AI and data centres and industrial capabilities,” Munjal Sharad Shah, Managing Director, Paras Defence and Space Technologies, said.
