IIT Guwahati, Tata Electronics to advance chip packaging research

Indian Institute of Technology Guwahati (IIT Guwahati) has signed an MoU with Tata Electronics to strengthen semiconductor Assembly, Testing, Marking and Packaging (ATMP) education, skill development and research in India. This collaboration facilitates the establishment of a Centre of Excellence (CoE) at the IIT Guwahati campus, with a focus on developing industry-ready talent and advancing research in semiconductor packaging technologies, IIT Guwahati said in a press release.

With an aim to address the growing need for a skilled workforce in the semiconductor industry, this collaboration will develop educational and training programs aligned with industry requirements. Additionally, it will strengthen the semiconductor talent ecosystem in Assam and India’s Northeast region by creating opportunities for students from engineering colleges, polytechnics and other educational institutions, the press release said.

Under this framework, IIT Guwahati will be responsible for leading the development and delivery of education programs.  

“This initiative aims to connect academic institutions, industry and students through specialised education, practical training and collaborative research,” Prof. Devendra Jalihal, Director, IIT Guwahati, said. “By identifying relevant institutions across Assam and supporting the development of semiconductor-focused curricula, the collaboration will broaden access to specialised technical education and strengthen the regional talent pipeline.”