Micron advances memory innovation with ultra-dense module for servers
The 512GB DDR5 module vertically stacks DRAM dies interconnected by through-silicon vias (TSVs) to maximize density within individual DRAM packages while preserving the performance modern data center architectures demand.
Micron Technology has announced the successful demonstration of the “world’s first” 512GB DDR5 module on multiple server platforms, which is expected to provide enterprise data center and cloud customers with a path to support large and demanding AI, analytics, in-memory database and simulation-heavy workloads with greater efficiency.
Leading semiconductor enablers, AMD and Intel, are both actively validating the module, which will deliver speeds up to 9,200 MT/s, Micron said.
This product vertically stacks DRAM dies interconnected by through-silicon vias (TSVs) to maximize density within individual DRAM packages while preserving the performance modern data center architectures demand. The module enables up to 12TB of DDR5 DRAM in a single 24-slot dual-socket server, the company said.
“A 512GB RDIMM enables multi-terabyte servers, supporting larger AI and database workloads, greater virtualization density and improved power efficiency, all within existing server footprints,” said Raj Narasimhan, senior vice president and general manager of the Cloud Memory Business Unit at Micron.
Micron is collaborating closely with leading ecosystem enablers to validate the 512GB DDR5 RDIMM across next-generation server platforms, ensuring broad compatibility and a smooth path to deployment.
“Our close engineering collaboration with Micron brings compute and memory innovation together to help customers realize the full value of AMD-powered platforms,” said Amit Goel, corporate vice president, Compute and Enterprise AI Platform Solutions Engineering, AMD. “Together, we’re enabling balanced, high-performance infrastructure for the growing scale and complexity of modern workloads.”
“Intel is working closely with Micron to validate its 512GB DDR5 RDIMM and help enable future server platforms designed to meet the growing demands of next-generation data center workloads,” said Karin Eibschitz Segal, general manager of platform and system engineering in Intel’s Data Center Group.
