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September 16, 2026
While InoBat will build on its established European presence and planned expansion into North America, Palmer Energy Technology Ltd (PETL) will leverage its strong position in the UK and Ireland. Both companies will address new markets together.

office

September 16, 2026
Aimtron is increasingly focusing on opportunities where electronics manufacturing is accompanied by deeper engineering involvement, higher product complexity and stringent quality requirements.

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headquarters

September 16, 2026
The center in Germany will accelerate the development of next-generation process solutions, deepen collaboration with leading semiconductor manufacturers, and further strengthen SUSS’s position in the fast-growing Advanced Packaging market.

September 16, 2026
Through this investment, Mitsubishi Electric expects to gain early insights into the company’s optical quantum computer hardware development technologies, related components, customers and market trends.

battery_automation

September 16, 2026
Battery-NY has adopted Siemens automation across much of its principal production-equipment landscape and is using the Siemens Battery Automation Framework as a standardization reference.

Foley_Alps_Electric

September 16, 2026
The certification supports Alps Electric EMS’ manufacture of medical devices and reflects the company’s commitment to robust quality systems, full traceability, documentation and risk management, the company said.

Indie

September 15, 2026
The Bengaluru office will serve as a local hub for customer engagement, applications support, training, and strategic partnerships, and will strengthen Teradyne’s ability to support India’s expanding base of chipmakers and electronics manufacturers.

Fortaegis

September 15, 2026
The investment will enable the Dutch company to scale production and commercial deployment of its FPGA products across the United States, Europe, Singapore and Japan and to advance the ASIC roadmap, while growing its engineering and commercial capacity.

Flagship-Building-Yokohama-Technology-Campus

September 15, 2026
The Tokyo-based memory-storage maker has been speaking with lenders such as Bank of America, Goldman Sachs Group and JPMorgan Chase on an offering that could take place in 2027, Bloomberg reports.

ELECTRIC_Utah

September 15, 2026
Under this contract, the South Korean company will supply a full set of key distribution systems for the power infrastructure construction project of a hyperscale data center being developed in Wyoming by Bloom Energy for a local energy infrastructure firm.

Infineon-1

September 14, 2026
The collaboration builds directly on SolarEdge's SST platform with Infineon SiC components, first announced in November 2025. The SST is designed to enable direct medium-voltage (13.8-34.5 kV) to 800-1500 VDC conversion at over 99 percent efficiency.

Ark_Electronics

September 14, 2026
By pairing SiMa.ai’s platform with ARK Electronics’ technology drones and robotics expertise, the partnership aims to deliver a uniquely complete Physical AI foundation, priced for mass-market commercial, industrial, agriculture, and defense deployment at scale.

building

September 14, 2026
Headquartered in Cleveland, Ohio, CPP produces complex super alloy, titanium, aluminum, magnesium and steel castings for a variety of leading commercial and military aircraft, weapon systems, commercial and regional/business jets, helicopters and industrial gas turbines.

building

September 14, 2026
Following ongoing collaboration across energy, next-generation batteries and related industrial fields, Kyushu Electric Power is now moving forward with a strategic investment in ProLogium, extending the relationship from industrial collaboration to strategic capital participation.

building_logo

September 11, 2026
The partnership brings together Sure-Seal Connections’ proven sealed connector technology with Wesgarde’s market expertise and established customer relationships.

Energy

September 11, 2026
The Bangalore-based company plans to continue strengthening the infrastructure and technology platform that delivers safe, reliable and high-uptime energy solutions for a growing customer base of riders, fleet operators and OEM partners.

LG_UWB

September 11, 2026
The collaboration pairs Ceva-Waves UWB baseband IP and software with UWB radio frequency (RF) technology developed by LG's SoC Center, giving customers a silicon-ready platform for integrating UWB into their SoCs. LG's UWB RF supports TSMC's 22nm process.

electronic_system_design

September 11, 2026
By integrating EMA and FlowCAD technology into the Cadence ecosystem, the company is building on a collaboration that spans over 20 years. Deeper integration with Allegro X and OrCAD X platforms will enable scalable library and data management capabilities.

workforce

September 11, 2026
Through this collaboration, Canadian photonic quantum computing company Xanadu and ASML will explore lithography-enabled process approaches for improved patterning control and lower-loss photonic structures.

Belgium_flag

September 10, 2026
A 52-year-old man holding both Belgian and Chinese citizenship has been arrested by Belgian authorities on suspicion of stealing trade secrets related to gallium nitride (GaN) semiconductor technology, according to Reuters. Investigators believe the information he obtained may have been passed to a Chinese company operating in the same industry.

September 10, 2026
GlobalFoundries has finalised a definitive agreement with the US Department of Commerce for a USD 375 million research and development award to advance its Quantum Technology Solutions business. The funding is tied to milestone achievements over a five-year period.

September 10, 2026
German automotive semiconductor manufacturer Elmos Semiconductor and South Korean foundry SK keyfoundry have signed an agreement expanding their collaboration to include 130nm technology, securing long-term wafer capacity through 2037. The two companies have worked together on 350nm technology for 18 years.

building_logo

September 10, 2026
The two companies aim to deepen collaboration on High NA EUV lithography and advanced semiconductor manufacturing technologies. Samsung plans to introduce ASML’s High NA EUV lithography into future DRAM high-volume manufacturing by 2028.

Kongsberg-2026

September 09, 2026
WB Electronics, part of Poland's WB Group, and Norway's Kongsberg have signed a cooperation agreement to develop unmanned maritime systems. The companies aim to jointly create autonomous platforms equipped with reconnaissance systems, communications, command-and-control solutions, and weapon systems.

Taichung-Taiwan

September 09, 2026
Labour unions representing nearly two-thirds of Micron Technology's Taiwan workforce are threatening to strike unless the US memory chip maker changes how it distributes profits to employees, Reuters reports. More than 80% of union members who took part in an internal survey in August backed strike action.

Arizona-render

September 09, 2026
Amkor Technology has announced a Phase 2 expansion of its Arizona advanced packaging and test campus, increasing the total planned investment to approximately USD 12 billion. The expansion adds 60,000 square metres of cleanroom space, bringing the campus to approximately 93,000 square metres in total.

headquarters

September 09, 2026
The Advanced Semiconductor Lab in Bengaluru provides a unified platform for electrical validation, automated testing, qualification and failure analysis, streamlining the journey from design specifications to finished semiconductor parts.

opening-Austin-innovation-center

September 08, 2026
Silicon Labs has opened a new research and development laboratory at its headquarters in Austin, Texas, expanding its capabilities for advanced chip design, testing and validation.

Copenhagen-Quantum-fab

September 08, 2026
Quantum Foundry Copenhagen and the Novo Nordisk Foundation have announced plans to establish a 5,300 square metre quantum chip fabrication facility in Copenhagen, Denmark. The facility is expected to open in 2027 and will develop and scale manufacturing capabilities for next-generation quantum chips.

September 08, 2026
Intel Foundry and ASML have reported continued progress in High NA EUV lithography production, including more than one million wafers processed to date across early tool certification and testing, research and development, and volume production on select layers of Intel's Panther Lake processors — part of the Core Ultra Series 3 family.

PCBs

September 08, 2026
While the semiconductor supply chain has dominated industry attention in recent years, a parallel bottleneck has been building in PCB base materials. AI data centre expansion is absorbing large quantities of high-grade laminates, leaving less capacity available for traditional industrial and automotive applications, according to a joint market analysis by STARTEAM GLOBAL and Würth Elektronik.

cobots

September 07, 2026
Teradyne Robotics, the parent company of Universal Robots, has filed a patent infringement case at the Unified Patent Court in Copenhagen against the German subsidiary of Chinese collaborative robot manufacturer JAKA. The case covers both hardware and software patents and could have effect across 17 EU member states.

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