Amkor expands Arizona campus to $12 billion investment
Amkor Technology has announced a Phase 2 expansion of its Arizona advanced packaging and test campus, increasing the total planned investment to approximately USD 12 billion. The expansion adds 60,000 square metres of cleanroom space, bringing the campus to approximately 93,000 square metres in total.
The Phase 2 expansion is driven by customer commitments that have surpassed the 33,000 square metres of cleanroom capacity planned for Phase 1. Together, the two phases are expected to support a workforce of more than 3,500 Arizona-based employees, according to a press release from Amkor.
Construction of Phase 2 is anticipated to begin in late 2027, with completion expected by the end of 2029. The Arizona campus, which includes wafer bump, probe, assembly and test capabilities, is described as the first OSAT production site in the United States for advanced packaging in high volume.
"As chip architectures become more complex, customers need a trusted partner that can deliver at scale with the quality, technology leadership and operational discipline required for their most advanced products, and it is critical to have that capacity in the U.S.," said Kevin Engel, President and CEO of Amkor Technology.
