SUSS to invest €45M in advanced packaging innovation center
The center in Germany will accelerate the development of next-generation process solutions, deepen collaboration with leading semiconductor manufacturers, and further strengthen SUSS’s position in the fast-growing Advanced Packaging market.
SUSS, a German manufacturer of equipment and process solutions for the semiconductor industry, plans to invest approximately EUR 45 million in a new application and development center in Karlsruhe (Baden-Württemberg, Germany).
The new application center is expected to boost customer-driven innovation for the integration of multiple chips into highly complex semiconductor systems. Bringing together leading academic research and industrial expertise, the center will accelerate the development of next-generation process solutions, deepen collaboration with leading semiconductor manufacturers, and further strengthen SUSS’s position in the fast-growing Advanced Packaging market, SUSS said in a press release.
According to a Letter of Intent (LOI) signed by the State of Baden-Württemberg, the Karlsruhe Institute of Technology (KIT) and SUSS, a new professorship for Advanced Packaging and Heterogeneous Integration will be established at KIT. The professorship will be funded by the State of Baden-Württemberg with up to EUR 5 million.
“With the planned application and development center, we are creating a collaborative platform that will foster even closer interaction between our customers, research partners, and development teams,” said Burkhardt Frick, CEO of SUSS MicroTec SE. “This enables us to accelerate the commercialization of new technologies, support our customers in developing the next generation of AI and high-performance applications, and further strengthen our competitive position in Advanced Packaging.”
The new facility is expected to employ approximately 300 to 350 employees over the long term. The expansion could create up to 100 additional highly skilled jobs, the press release said.
