Semiconductor supply chain on the edge? September 24, 2026 The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.
Geely unveils new charging system that replenishes battery in 4.5 minutes September 24, 2026 Chinese passenger car manufacturer Geely has unveiled an ultra-fast charging system for electric vehicles that can increase a battery's state of charge from 10% to 70% in 4.5 minutes, according to Reuters. The company also introduced a new generation of traction batteries and an updated Galaxy E5 SUV, responding to intensifying competition from BYD in China's electric vehicle market.
Nexstrom raises $12M to commercialize wafer-scale 2D chip platform September 24, 2026 The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.
Mach raises $600 million to scale defense manufacturing September 22, 2026 Mach Industries operates a 115,000-square-foot headquarters and manufacturing facility in Huntington Beach, California, with additional propulsion, energetics and production infrastructure across the state.
DRAM module revenue surged 59% in 2025 as AI crowds out mainstream supply September 22, 2026 The global DRAM module market generated USD 21.2 billion in revenue in 2025, up 59% YoY, according to TrendForce — a sharp acceleration from the 7% growth recorded in 2024.
Ventec expands production capacity in China to capture AI market growth September 22, 2026 Ventec Electronics (Suzhou), a subsidiary of Taiwanese laminate specialist Ventec International Group, is leasing an additional 20,000 square meters of factory space in Kunshan, Jiangsu Province, according to a stock exchange filing.
Rohm’s SiC chips support BMW’s electric powertrain architecture September 21, 2026 The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions.
Toppan inaugurates BOPP film manufacturing line in Italy September 21, 2026 Through the operation of this line, together with existing capabilities, the plant will be able to establish an overall supply infrastructure of up to 30,000 tonnes per year for high-performance biaxially oriented polypropylene (BOPP) films.
Babcock, Ark Robotics sign MoU to bring UGVs to UK forces September 17, 2026 Uncrewed ground vehicles (UGVs) are taking on a growing share of frontline tasks, re-supplying teams with ammunition, weapons and equipment. Babcock will partner with Ark Robotics to develop and deliver UGV solutions and autonomous systems.
Fortaegis raises $50M to accelerate deployment of secure compute September 15, 2026 The investment will enable the Dutch company to scale production and commercial deployment of its FPGA products across the United States, Europe, Singapore and Japan and to advance the ASIC roadmap, while growing its engineering and commercial capacity.
Infineon extends collaboration with SolarEdge Technologies September 14, 2026 The collaboration builds directly on SolarEdge's SST platform with Infineon SiC components, first announced in November 2025. The SST is designed to enable direct medium-voltage (13.8-34.5 kV) to 800-1500 VDC conversion at over 99 percent efficiency.
SiMa.ai, Ark Electronics partner to advance autonomous drones September 14, 2026 By pairing SiMa.ai’s platform with ARK Electronics’ technology drones and robotics expertise, the partnership aims to deliver a uniquely complete Physical AI foundation, priced for mass-market commercial, industrial, agriculture, and defense deployment at scale.
Sweden risks falling behind on circular electronics September 11, 2026 There is a gap between ambition and action on circularity in the Swedish electronics industry, according to Elisabet Österlund, Secretary General of Svensk Elektronik. For circularity to become more than a sustainability talking point, stronger incentives are needed from both industry and government.
Scanfil expands Myslowice plant to become its largest factory in Europe September 10, 2026 Scanfil is expanding its Myslowice plant in Poland by 6,000 square metres, bringing the total facility area to approximately 36,000 square metres. The expansion, driven by new customer wins, is expected to be operational in Q1 2028 and will make Myslowice Scanfil's largest factory in Europe by floor area.
WB and Kongsberg to jointly develop autonomous maritime systems September 09, 2026 WB Electronics, part of Poland's WB Group, and Norway's Kongsberg have signed a cooperation agreement to develop unmanned maritime systems. The companies aim to jointly create autonomous platforms equipped with reconnaissance systems, communications, command-and-control solutions, and weapon systems.
PCB material shortages intensify as AI infrastructure absorbs laminate capacity September 08, 2026 While the semiconductor supply chain has dominated industry attention in recent years, a parallel bottleneck has been building in PCB base materials. AI data centre expansion is absorbing large quantities of high-grade laminates, leaving less capacity available for traditional industrial and automotive applications, according to a joint market analysis by STARTEAM GLOBAL and Würth Elektronik.
Indian space tech startup InspeCity raises $11 million September 08, 2026 Over the next 12-18 months, the company plans to execute four in-orbit missions across the RIG-X, VEDA-X and SAMA-X mission roadmap, progressively validating its propulsion, sensing, autonomous operations, robotics, docking and refuelling capabilities in space.
HII to award up to $900M to Path Robotics, GrayMatter Robotics September 07, 2026 The signed agreements are designed to accelerate the development and deployment of advanced physical AI automation across US Navy shipbuilding programs, including aircraft carriers, submarines, destroyers, amphibious ships, future frigates and unmanned surface vessels.
Indian firm Kepler raises $8 million to build swarm satellites September 03, 2026 Indian space tech company Kepler Aerospace is focused on enabling reliable, secure and scalable space missions across strategic, defence and commercial applications, with a focus on persistent, low-latency intelligence from space.
Infineon and Skeleton Technologies to develop power solutions for AI data centres September 02, 2026 Infineon Technologies and Estonian energy storage company Skeleton Technologies have signed a memorandum of understanding to collaborate on solid-state transformers and sidecar power systems for AI data centre infrastructure. The partnership combines Infineon's power semiconductors with Skeleton's supercapacitor technology and power conversion expertise.
LGES secures multi-year supply of US-produced lithium carbonate September 02, 2026 Under the contract, Smackover Lithium, a partnership between Standard Lithium Ltd. and Equinor, an international energy company, will supply LG Energy Solution with 8,000 metric tonnes of lithium carbonate annually over a 10-year period.
Sweden must turn semiconductor expertise into industry September 01, 2026 Semiconductors form the backbone of our digitalised society and are business-critical for everything from AI and defence to next-generation energy systems. Yet despite Sweden being among the global leaders in academic fundamental research, we face a critical challenge: we must strengthen our own manufacturing capacity.
Neura acquires Adlatus, bringing Physical AI to professional cleaning August 31, 2026 The goal is to equip Adlatus systems with additional sensor and AI capabilities going forward and to gradually connect them to the Neuraverse.
Renesas sets up physical AI & robotics lab in Beijing August 27, 2026 Japanese electronics company Renesas has opened a new Physical AI & Robotics Lab in Beijing, China, aimed at supporting the development, demonstration and validation of next-generation robotic systems.
Beyond the headlines: a live semiconductor market conversation in Gothenburg August 26, 2026 The semiconductor market is moving fast – but the headlines and numbers only tell part of the story. Prices are increasing, lead times are stretching, and geopolitics is reshaping how companies think about sourcing. What's harder to see from the outside is how all of this is playing out in practice: in customer behaviour, in order flows, in the conversations that happen daily between distributors, manufacturers and buyers.
LGES announces start of production at new Lansing battery plant August 26, 2026 With the opening of its Lansing facility, LG Energy Solution now operates two facilities in Michigan, located in Holland and Lansing. The South Korean company has invested more than USD 5 billion total in the state of Michigan since 2010.
Micron launches $250 million AI investment fund August 24, 2026 Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.
Rheinmetall establishes autonomous systems centre of excellence August 21, 2026 Advanced Land Autonomy Centre of Excellence (ALACOE UK) will serve the local market, bringing world-leading ground autonomy directly to the UK market. The network of centres will also amplify Canada’s leading role in autonomous ground autonomous systems across Europe.
Ambi, Pickle deliver integrated physical AI solution for logistics August 17, 2026 The deployment combines Pickle Robot’s trailer-unloading robots with Ambi Robotics' AmbiStack multi-purpose stacking solution, enabling a continuous and autonomous flow of packages from inbound trailers through receiving operations.
US firm ChipAgents expands Series A funding to $134 million August 17, 2026 The funding will support ChipAgents' next phase of expansion as the company scales customer deployments, grows its engineering and go-to-market teams, and accelerates development of its AI-native semiconductor design platform.
BAE Systems, TUALCOM to collaborate on autonomous technologies August 14, 2026 The agreement between BAE Systems and TUALCOM establishes a strategic framework for both organisations to investigate opportunities to integrate advanced communications, resilient navigation and electronic warfare technologies into future autonomous platforms.
BorgWarner secures extension of inverter programs with European OEM August 11, 2026 For plug-in hybrid applications, BorgWarner will supply an updated high-voltage inverter design featuring the company’s proprietary Application-Specific Integrated Circuit (ASIC) technology, which is fully compatible with the customer’s new vehicle operating system.