Sponsored content by Arrow Electronics Arrow Electronics brings AI, robotics and edge applications to electronica 2026 Arrow Electronics will bring several application-led technology demonstrations to electronica 2026, showing how AI, robotics, edge computing and electronic components are being applied across different vertical market segments.
FORT Robotics secures $20 million in additional funding October 23, 2026 The additional investment is expected to help the US company further accelerate its growth by expanding its team and operating capacity to meet growing customer demand and pursue opportunities across the rapidly developing physical AI market.
Volvo Cars expands Nvidia partnership for automated driving October 19, 2026 Volvo Cars is extending its partnership with Nvidia to develop automated driving for its future cars. The aim is for the cars to handle everything from highways and city traffic to parking, and to gradually introduce eyes-off and mind-off driving.
E&R opens Malaysia plant to expand packaging materials production October 19, 2026 This expansion will further strengthen Taiwanese firm E&R Engineering Corp’s supply capabilities in Southeast Asia, delivering real-time technical support and supply chain flexibility to semiconductor and OSAT customers.
Ubitium raises $14M to build universal processor for Physical AI October 16, 2026 Autonomous machines need three kinds of computing to work together so they can perceive, think and act in the real world. German startup Ubitium is building one universal processor to replace the stack of specialised chips.
Cohere to acquire AISLE to advance cyber-resilient sovereign AI October 16, 2026 Founded in 2024, Prague-based AISLE has developed AI systems capable of discovering, validating and helping remediate previously unknown vulnerabilities in complex production software.
Qilimanjaro announces €20 million first close of its Series A October 16, 2026 The fresh funding will enable the Spanish company to scale and industrialize its quantum computers, advance the development of new generations of chips, and increase its manufacturing and deployment capacity.
Kontron moves VPX board production to Huntsville October 14, 2026 Kontron has started US production of its rugged VX307H computing board at subsidiary Nextek in Huntsville, Alabama. At the same time, the product moves from build-to-order to build-to-stock, to shorten delivery times for US defence customers.
From inspiration to transformation: How Apator is building the factory of the future October 13, 2026 There is a certain paradox in electronics manufacturing. The more processes become automated, the more important those that still rely on human expertise seem to be. These are often the very stages where the quality of the finished product is determined – at workstations where correct assembly still depends on the operator's experience, concentration and attention to detail.
Cellula partners with FERRI to advance autonomous marine handling October 08, 2026 FERRI’s bespoke marine and naval handling systems are used by international navies. Cellula Robotics brings 25 years of subsea engineering and in-water performance.
Sony partners with Aramco to advance AI-powered industrial solutions October 05, 2026 The collaboration will combine Sony’s sensing and AI technologies with Aramco’s industrial data, operational experience, established infrastructure and portfolio of real-world industrial use cases.
Schneider Electric to acquire US company PTC for $22.6 billion October 05, 2026 The acquisition creates a leading, scaled, open and interoperable industrial software and AI franchise, driving business outcomes for customers from any system of design, control, data and intelligence.
SiMa.ai raises $150 million in Series C to scale Physical AI October 05, 2026 The new funding brings the total capital raised by the US startup to USD 500 million, valuing it at USD 1.45 billion. The fresh capital will accelerate the scaling of Palette Neat, an agentic software environment for Physical AI.
LG Innotek targets $647 million profit from substrates by 2031 September 30, 2026 LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.
Samsung to invest $1 billion in AI infrastructure company Helix September 30, 2026 Samsung Electronics to invest USD 500 million; five other Samsung affiliates investing the remainder. Samsung commits to Helix’s global AI infrastructure build-out alongside KKR, Kuwait Investment Authority, NVIDIA and Vistra.
Havoc, CSBC to field autonomous surface vessels in Taiwan September 28, 2026 US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.
Semiconductor supply chain on the edge? September 24, 2026 The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.
Geely unveils new charging system that replenishes battery in 4.5 minutes September 24, 2026 Chinese passenger car manufacturer Geely has unveiled an ultra-fast charging system for electric vehicles that can increase a battery's state of charge from 10% to 70% in 4.5 minutes, according to Reuters. The company also introduced a new generation of traction batteries and an updated Galaxy E5 SUV, responding to intensifying competition from BYD in China's electric vehicle market.
Nexstrom raises $12M to commercialize wafer-scale 2D chip platform September 24, 2026 The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.
Mach raises $600 million to scale defense manufacturing September 22, 2026 Mach Industries operates a 115,000-square-foot headquarters and manufacturing facility in Huntington Beach, California, with additional propulsion, energetics and production infrastructure across the state.
DRAM module revenue surged 59% in 2025 as AI crowds out mainstream supply September 22, 2026 The global DRAM module market generated USD 21.2 billion in revenue in 2025, up 59% YoY, according to TrendForce — a sharp acceleration from the 7% growth recorded in 2024.
Ventec expands production capacity in China to capture AI market growth September 22, 2026 Ventec Electronics (Suzhou), a subsidiary of Taiwanese laminate specialist Ventec International Group, is leasing an additional 20,000 square meters of factory space in Kunshan, Jiangsu Province, according to a stock exchange filing.
Rohm’s SiC chips support BMW’s electric powertrain architecture September 21, 2026 The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions.
Toppan inaugurates BOPP film manufacturing line in Italy September 21, 2026 Through the operation of this line, together with existing capabilities, the plant will be able to establish an overall supply infrastructure of up to 30,000 tonnes per year for high-performance biaxially oriented polypropylene (BOPP) films.
Babcock, Ark Robotics sign MoU to bring UGVs to UK forces September 17, 2026 Uncrewed ground vehicles (UGVs) are taking on a growing share of frontline tasks, re-supplying teams with ammunition, weapons and equipment. Babcock will partner with Ark Robotics to develop and deliver UGV solutions and autonomous systems.
Fortaegis raises $50M to accelerate deployment of secure compute September 15, 2026 The investment will enable the Dutch company to scale production and commercial deployment of its FPGA products across the United States, Europe, Singapore and Japan and to advance the ASIC roadmap, while growing its engineering and commercial capacity.
Infineon extends collaboration with SolarEdge Technologies September 14, 2026 The collaboration builds directly on SolarEdge's SST platform with Infineon SiC components, first announced in November 2025. The SST is designed to enable direct medium-voltage (13.8-34.5 kV) to 800-1500 VDC conversion at over 99 percent efficiency.
SiMa.ai, Ark Electronics partner to advance autonomous drones September 14, 2026 By pairing SiMa.ai’s platform with ARK Electronics’ technology drones and robotics expertise, the partnership aims to deliver a uniquely complete Physical AI foundation, priced for mass-market commercial, industrial, agriculture, and defense deployment at scale.
Sweden risks falling behind on circular electronics September 11, 2026 There is a gap between ambition and action on circularity in the Swedish electronics industry, according to Elisabet Österlund, Secretary General of Svensk Elektronik. For circularity to become more than a sustainability talking point, stronger incentives are needed from both industry and government.
Scanfil expands Myslowice plant to become its largest factory in Europe September 10, 2026 Scanfil is expanding its Myslowice plant in Poland by 6,000 square metres, bringing the total facility area to approximately 36,000 square metres. The expansion, driven by new customer wins, is expected to be operational in Q1 2028 and will make Myslowice Scanfil's largest factory in Europe by floor area.
WB and Kongsberg to jointly develop autonomous maritime systems September 09, 2026 WB Electronics, part of Poland's WB Group, and Norway's Kongsberg have signed a cooperation agreement to develop unmanned maritime systems. The companies aim to jointly create autonomous platforms equipped with reconnaissance systems, communications, command-and-control solutions, and weapon systems.
PCB material shortages intensify as AI infrastructure absorbs laminate capacity September 08, 2026 While the semiconductor supply chain has dominated industry attention in recent years, a parallel bottleneck has been building in PCB base materials. AI data centre expansion is absorbing large quantities of high-grade laminates, leaving less capacity available for traditional industrial and automotive applications, according to a joint market analysis by STARTEAM GLOBAL and Würth Elektronik.