Renesas sets up physical AI & robotics lab in Beijing August 27, 2026 Japanese electronics company Renesas has opened a new Physical AI & Robotics Lab in Beijing, China, aimed at supporting the development, demonstration and validation of next-generation robotic systems.
Beyond the headlines: a live semiconductor market conversation in Gothenburg August 26, 2026 The semiconductor market is moving fast – but the headlines and numbers only tell part of the story. Prices are increasing, lead times are stretching, and geopolitics is reshaping how companies think about sourcing. What's harder to see from the outside is how all of this is playing out in practice: in customer behaviour, in order flows, in the conversations that happen daily between distributors, manufacturers and buyers.
LGES announces start of production at new Lansing battery plant August 26, 2026 With the opening of its Lansing facility, LG Energy Solution now operates two facilities in Michigan, located in Holland and Lansing. The South Korean company has invested more than USD 5 billion total in the state of Michigan since 2010.
Micron launches $250 million AI investment fund August 24, 2026 Micron Technology has launched the Micron Ventures Paradigm Fund, a USD 250 million investment vehicle targeting startups across the AI technology stack. It is Micron Ventures' third and largest fund to date, bringing the unit's total capital commitment to USD 550 million.
Rheinmetall establishes autonomous systems centre of excellence August 21, 2026 Advanced Land Autonomy Centre of Excellence (ALACOE UK) will serve the local market, bringing world-leading ground autonomy directly to the UK market. The network of centres will also amplify Canada’s leading role in autonomous ground autonomous systems across Europe.
Ambi, Pickle deliver integrated physical AI solution for logistics August 17, 2026 The deployment combines Pickle Robot’s trailer-unloading robots with Ambi Robotics' AmbiStack multi-purpose stacking solution, enabling a continuous and autonomous flow of packages from inbound trailers through receiving operations.
US firm ChipAgents expands Series A funding to $134 million August 17, 2026 The funding will support ChipAgents' next phase of expansion as the company scales customer deployments, grows its engineering and go-to-market teams, and accelerates development of its AI-native semiconductor design platform.
BAE Systems, TUALCOM to collaborate on autonomous technologies August 14, 2026 The agreement between BAE Systems and TUALCOM establishes a strategic framework for both organisations to investigate opportunities to integrate advanced communications, resilient navigation and electronic warfare technologies into future autonomous platforms.
BorgWarner secures extension of inverter programs with European OEM August 11, 2026 For plug-in hybrid applications, BorgWarner will supply an updated high-voltage inverter design featuring the company’s proprietary Application-Specific Integrated Circuit (ASIC) technology, which is fully compatible with the customer’s new vehicle operating system.
SpaceX, Tesla to initially spend $16.8 billion on Texas chip plant August 07, 2026 Terafab, a vertically integrated semiconductor fabrication plant in Grimes County, Texas, with over 100 million square feet of manufacturing space, will employ at least 3,000 people.
Infineon, MediaTek to advance AI-driven in-cabin solutions August 06, 2026 MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.
Fuji enables SMT placement of large, heavy components for AI servers August 06, 2026 The company can handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines.
ASIP breaks ground on $260 million OSAT facility in India August 04, 2026 The 30-acre facility in Andhra Pradesh will have an annual production capacity of 96 million chips and serve high-growth sectors such as AI, high-performance computing, data centres and high-speed communications.
Siemens, Nvidia advance self-verifying agentic AI workflows July 31, 2026 The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.
Baya Systems partners with Openchip on next-gen intelligent compute July 30, 2026 Spanish company Openchip will use US-based chiplet startup Baya Systems’ WeaveIP unified fabric to develop specialized intelligent compute systems for next-generation AI workloads.
AI infrastructure boom reshapes electronics supply chain, says in4ma July 29, 2026 The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.
Mitsubishi Electric, Sony to advance vision sensor solutions July 29, 2026 The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.
Samsung, Broadcom expand collaboration across memory, foundry tech July 28, 2026 On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.
Nvidia, Amkor sign $1.5 billion chip packaging agreement July 24, 2026 Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.
NIELIT, SCL collaborate to advance chip innovation in India July 24, 2026 As part of this collaboration, the 1.2 µm Process Design Kit will be made available through eChipHub, and provide students, researchers, faculty members, startups, MSMEs and industry professionals with access to an indigenous semiconductor process technology for IC design and prototyping.
India’s Raghu Vamsi Aerospace Group raises $40 million July 23, 2026 The capital will be used to expand manufacturing capacity across the group’s facilities in India, the UK and the US, accelerate development of its upcoming manufacturing campus, and strengthen its mission systems and deep-tech & autonomous systems businesses.
US Air Force awards GA-ASI production contract for FQ-42A CCA July 22, 2026 The FQ-42A is a purpose-built, uncrewed fighter developed as part of ongoing investment in next-generation semi-autonomous combat aircraft.
ChipAgents, AWS to advance AI-powered semiconductor engineering July 21, 2026 Joining the AWS Partner Network will help ChipAgents continue scaling its platform as it supports semiconductor companies looking to improve engineering productivity and accelerate development cycles.
Emesent secures $17M to boost autonomous intelligence platform July 21, 2026 Capital will be deployed to scale manufacturing at Emesent’s Queensland facility and to advance Cortex AI, the company’s onboard autonomy intelligence, and Aura, its cloud-based platform for 3D data processing, visualization and analytics.
SWISSto12 raises €73M to meet growing multi-orbit demand July 20, 2026 With this new round, the company is scaling its capacity to meet accelerating demand from commercial and sovereign government customers, spanning HummingLink — advanced, multi-orbit payload solutions — and HummingSat, SWISSto12’s GEO satellite product line.
Sabanto, Verdant Robotics integrate autonomous tractor operation July 20, 2026 Verdant Robotics’ SharpShooter, now runs behind Sabanto-equipped autonomous tractors, using Aim & Apply technology to identify individual plants and weeds and apply inputs only where needed, reducing input use.
Jabil opens next-gen intelligent logistics hub in Penang July 17, 2026 The digitalised facility is set to boost the company’s back-end operations and support customers’ growing product complexity and capacity demands using AI-enabled capabilities to streamline inventory management, enhance traceability and tracking and deploy autonomous robots.
Niche demand, MLC migration to drive SLC NAND prices up to 170% July 16, 2026 Meanwhile, demand for SLC NAND continues to grow in AI edge computing, data centers, and automotive electronics, causing the supply-demand gap to widen quickly, TrendForce notes.
Europe's PCB comeback is colliding with a supply chain that isn't ready July 13, 2026 Europe's printed circuit board industry is having a moment. Defence spending is up, AI is driving demand, and policymakers are finally talking about electronics as strategic infrastructure. But as I discovered in a recent EMS@C-Level conversation with Vytautas Ilgunas, Chief Commercial Officer at TLT PCB, and Raymond Goh, Chief Operating Officer at Confidee, the comeback is running headfirst into a supply chain that we spent the last two decades hollowing out. The demand is real. The capacity to serve it, particularly in materials, is not.
Europe is falling behind – and there is no plan July 10, 2026 During Evertiq Expo Berlin, in4ma's Dieter Weiss and Maraike Haas, alongside EMSNOW's Eric Miscoll, had just presented five years of data showing Asia lapping Europe in EMS growth. Off stage, they went further.
Kraken announces closing of $430M acquisition of Covelya Group July 09, 2026 The acquisition aligns with Canadian company Kraken Robotics’ strategy to deliver value to customers through a portfolio of dual-use technologies and a culture of innovation.
Europe holds a 2.5% share of a market it helped build July 08, 2026 New data from in4ma and EMSNOW puts the global EMS and ODM industry at USD 820 billion for 2025 – and Europe's share of that figure is shrinking in relative terms even as the continent's largest players post revenue growth.