Rohm’s SiC chips support BMW’s electric powertrain architecture
The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions.
Rohm Semiconductor has announced that its innovative power semiconductor solutions are being utilized in electric vehicle platforms from a leading automotive manufacturer. In BMW’s “Neue Klasse,” Rohm’s SiC (Silicon Carbide) chips support the efficiency, performance and reliability of the vehicle's electric powertrain systems.
The high-performance components integrated into the vehicle support key power electronics functions and are designed to deliver high energy efficiency as well as reliable operation under demanding automotive conditions. As such, they make an important contribution to optimizing driving range, charging performance, and the overall energy efficiency of electric vehicles, Rohm said.
“The integration of our SiC MOSFETs into BMW’s Gen 6 of electric vehicles — better known as Neue Klasse — highlights ROHM’s technological expertise in automotive power electronics,” said Wolfram Harnack, President of Rohm Semiconductor GmbH: “We are proud to contribute to the advancement of next-generation electric mobility together with BMW Group through our SiC technology.”
Rohm has extensive experience in the development and manufacture of power semiconductors for automotive applications and works closely with vehicle manufacturers and Tier 1 suppliers around the world to actively advance the electrification and decarbonization of mobility, Rohm said.
