NXP reportedly to close four 8-inch fabs in shift toward 12-inch production June 11, 2025 NXP Semiconductors is reportedly planning to shut down four of its 8-inch (200mm) wafer fabrication plants – one in the Netherlands and three in the United States — as part of a strategic transition to 12-inch (300mm) wafer production.
TSMC to launch European chip design centre in Munich May 27, 2025 Taiwanese semiconductor giant TSMC is preparing to strengthen its European presence with the opening of a new design centre in Munich, Germany.
Germany greenlights €1B in support for Infineon's massive Dresden fab May 08, 2025 Infineon Technologies has secured final approval from the German Federal Ministry for Economic Affairs for public funding to support its EUR 5 billion investment in a new semiconductor manufacturing fab in Dresden (Smart Power Fab).
NXP secures €1B EIB loan to advance semiconductor innovation January 16, 2025 NXP Semiconductors has secured a EUR 1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions.
Taiwan and Czechia plan to build EU semiconductor cluster September 02, 2024 Taiwan’s National Security Council Secretary-General Joseph Wu said as TSMC builds an advanced wafer fab in Dresden, Germany, it needs a comprehensive supply chain in Europe.
TSMC gets $1.96 billion subsidy boost from Japan and China August 26, 2024 These funds are mainly for real estate, equipment and plant purchases, and to offset building and operational costs.
ESMC officially breaks ground on Dresden fab August 20, 2024 Ground has been broken and the land preparation for ESMC's first semiconductor fab in Dresden, Germany has officially started.
EU approves €5 billion subsidy to support TSMC's German fab August 20, 2024 The European Commission has approved, under EU State aid rules, a EUR 5 billion German measure to support European Semiconductor Manufacturing Company (ESMC) in the construction and operation of a microchip manufacturing plant in Dresden.
Construction at TSMC's Dresden plant could be weeks away July 30, 2024 Work at TSMC's German facility has been delayed many times, but new reports suggest it is almost ready to break ground.
TSMC to start construction of European plant this year May 22, 2024 TSMC is reportedly planning to start construction of its first European manufacturing facility during the fourth quarter of 2024.
Christian Koitzsch to head TSMC's European operation January 05, 2024 Christian Koitzsch has left Bosch to become the president of TSMC's under-construction subsidiary in Dresden, Germany.
Germany clears Bosch, Infineon and NXP stakes in TSMC fab November 07, 2023 The German cartel office (the Bundeskartellamt) has cleared plans by Bosch, Infineon and NXP to each acquire 10% of the shares in European Semiconductor Manufacturing Company (ESMC), a company established by TSMC.
Globalfoundries could invest $8 billion in Dresden September 29, 2023 The US semiconductor manufacturer is looking to expand its operations in Dresden, Germany – if all the pieces fall into place, GlobalFoundries could double the capacity by the end of the decade.
NXP's investment plans cover four European countries September 26, 2023 Austria, Germany, the Netherlands, and Romania are all included in NXP Semiconductors’ European expansion plans.
TSMC, Bosch, Infineon, and NXP establishes European JV August 08, 2023 TSMC, Bosch, Infineon and NXP plans to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services.