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Toppan boosts FC-BGA substrate production for AI chips

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.


Ewelina-Bednarz_Column-1

Seven defense technologies driving electronics demand in 2025

December 17, 2025
During this year’s Evertiq Expo in Kraków, the topic of defense electronics filled the conference room to capacity. The top list of defense companies I presented turned out to be only a starting point for conversations that continued long after the session had ended. Behind each of these manufacturers stand dozens of electronics suppliers: semiconductor producers, PCB and RF module manufacturers, and specialized EMS companies. So I asked myself a simple question: which defense technologies drove electronics demand most strongly in 2025? Let’s look at them from the industry’s point of view rather than from a catalogue of weapon systems.


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Thomas-ZImmermann

TQ: Future-proof electronics manufacturing Made in Germany

November 25, 2025
With more than three decades of experience, the TQ Group has become important player in Germany’s electronics manufacturing landscape. Since its founding in 1994, this family-owned company has evolved into a broad-based technology provider, combining embedded modules, drive systems, robotics solutions and advanced electronics manufacturing. Despite growth and diversification, one principle has remained unchanged: treating development, manufacturing and technology integration as a unified whole.












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© 2025 Evertiq AB December 11 2025 2:54 pm V25.8.6-1
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