LG Innotek targets $647 million profit from substrates by 2031 September 30, 2026 LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.
NX Group, ISM to advance chip logistics infrastructure in India September 30, 2026 Under the MOU, Japan’s Nippon Express (NX) Holdings and India Semiconductor Mission (ISM) will work closely to address logistics-related challenges and help in developing infrastructure to strengthen India’s semiconductor ecosystem.
Samsung to invest $1 billion in AI infrastructure company Helix September 30, 2026 Samsung Electronics to invest USD 500 million; five other Samsung affiliates investing the remainder. Samsung commits to Helix’s global AI infrastructure build-out alongside KKR, Kuwait Investment Authority, NVIDIA and Vistra.
Panasonic consolidates SMT support and training in Budapest September 29, 2026 Panasonic Factory Solutions has opened a significantly expanded Technical Centre in Budapest, centralising customer support, engineering, service and development activities for Central and Eastern Europe. The facility replaces the company's previous training site in Munich.
Electronics Reliability for Demanding Applications September 29, 2026 In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.
AI demand squeezes consumer MLCCs – opening doors for Chinese suppliers September 29, 2026 Japanese and Korean MLCC makers are cutting supply to the consumer market to prioritise capacity for AI applications. The shift is opening doors for Chinese suppliers, several of which are now undergoing qualification with global brands such as Dell, HP, ASUS and Acer, according to market research firm TrendForce.
Samsung Electro-Mechanics to invest $5 billion to meet FCBGA demand September 29, 2026 About USD 3.1 billion will be invested to expand FCBGA (Flip Chip-Ball Grid Array) production capacity at the Sejong site in South Korea and USD 1.9 billion will be invested in facilities to expand the FCBGA plant at the Vietnam subsidiary.
Tata Electronics partners with Besi to strengthen packaging capabilities September 29, 2026 Leveraging Besi’s portfolio of advanced packaging solutions and global expertise, the collaboration will support the technology readiness of Tata Electronics’ semiconductor packaging facility in Assam and advance its journey toward next-gen packaging capabilities.
VSMC opens its first 12-inch fab in Tampines, Singapore September 28, 2026 VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.
Hitachi, Bloom Energy to deliver on-site power solutions in Japan September 28, 2026 Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.
TUSK IC raises €15M to move its satellite chips into mass production September 28, 2026 In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.
Firefly completes new cleanroom to accelerate spacecraft production September 28, 2026 The new cleanroom is four times the size of Firefly Aerospace’s existing cleanroom and part of the company’s 144,000-square-foot campus in Cedar Park, Texas.
OCP, Envision power up first phase of BESS at Morocco mining site September 28, 2026 OCP Green Energy, a subsidiary of Morocco’s OCP Group, signed a contract in 2025 with Chinese technology supplier Envision Energy to supply and commission a storage system based on LFP (lithium iron phosphate) technology.
Bittium partners with Safran on advanced tactical communications September 25, 2026 Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.
Tata Electronics, Kelington to advance development of Dholera Fab September 25, 2026 Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.
TransPak brings semiconductor packaging expertise to Thailand September 25, 2026 Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter facility offers packaging, final assembly, pack-on-site services and in-lane logistics for customers in Thailand and throughout Southeast Asia.
Semiconductor supply chain on the edge? September 24, 2026 The Q2-2026 semiconductor earnings rush is long gone, and even the laggards have now reported in their first Q3-2026 earnings calls. It is time to get a grip on what is going on in the semiconductor industry and its supply chain.
Tata Electronics, Enomoto sign MoU to boost chip packaging in India September 24, 2026 As part of the collaboration, Japanese precision semiconductor component manufacturer Enomoto will leverage its R&D capabilities, technical know-how and next-gen solutions to accelerate semiconductor packaging readiness for the Jagiroad facility.
Geely unveils new charging system that replenishes battery in 4.5 minutes September 24, 2026 Chinese passenger car manufacturer Geely has unveiled an ultra-fast charging system for electric vehicles that can increase a battery's state of charge from 10% to 70% in 4.5 minutes, according to Reuters. The company also introduced a new generation of traction batteries and an updated Galaxy E5 SUV, responding to intensifying competition from BYD in China's electric vehicle market.
Evertiq Expo Gothenburg 2026 – through the lens September 24, 2026 Early autumn is here again, which means Evertiq has once again taken over Svenska Mässan for Evertiq Expo Gothenburg. For those who couldn't make it, here's a recap of the day in pictures.
Nexstrom raises $12M to commercialize wafer-scale 2D chip platform September 24, 2026 The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.
Will there be no tech under the Christmas tree this year? September 23, 2026 It is only September, yet Christmas has already arrived in the supermarkets. Gingerbread and holiday decorations are filling shelves, while retailers are preparing for the most important shopping season of the year.
MOL Group inaugurates 37.4 MWp solar park, BESS in Hungary September 23, 2026 The solar park was constructed by ALTEO Plc., which may also provide aggregation services following the completion of the project. MOL and its partners hold a 73.8% stake in ALTEO Plc., which operates approximately 115 MW of renewable energy generation capacity.
Nexperia partners with Tata Electronics on semiconductor manufacturing in India September 23, 2026 Nexperia has announced a strategic partnership with Tata Electronics covering wafer fabrication, assembly and test, and technology development across two sites in India.
LS Electric establishes VSC-HVDC joint venture with GE Vernova September 23, 2026 Through the establishment of the JV, the two companies plan to pursue cooperation in the VSC-HVDC market in Korea and develop joint offerings and strategies covering supply of key equipment and joint execution of HVDC projects in Korea.
US firm Quantinuum finalizes $100 million CHIPS R&D award September 23, 2026 The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.
Tata Electronics, Sumitomo Chemical to boost India’s chip supply chain September 23, 2026 Under the MoU, both companies have agreed to explore a collaboration whereby Sumitomo will supply semiconductor materials, including photoresists, functional chemicals, and high-purity chemicals to Tata Electronics’ upcoming Fab in Dholera, Gujarat.
Kontron Electronics and beflex electronic complete merger September 22, 2026 beflex complements Kontron Electronics’ service portfolio in early-stage and near-series project phases, from the implementation of initial functional samples to near-series prototypes.
DRAM module revenue surged 59% in 2025 as AI crowds out mainstream supply September 22, 2026 The global DRAM module market generated USD 21.2 billion in revenue in 2025, up 59% YoY, according to TrendForce — a sharp acceleration from the 7% growth recorded in 2024.
Ventec expands production capacity in China to capture AI market growth September 22, 2026 Ventec Electronics (Suzhou), a subsidiary of Taiwanese laminate specialist Ventec International Group, is leasing an additional 20,000 square meters of factory space in Kunshan, Jiangsu Province, according to a stock exchange filing.
Navitas takes $5 million stake in Magnachip to deepen SiC partnership September 22, 2026 Navitas Semiconductor is making a USD 5 million strategic equity investment in Magnachip Semiconductor, deepening a partnership the two companies announced in July 2026.
China’s CXMT says 5th-gen DRAM platform enters mass production September 21, 2026 The new platform is designed to make more powerful memory chips at lower cost and using less power, Reuters reports. The potential breakthrough could make China compete for the memory market share with the likes of Samsung and SK hynix.