Evertiq - First In Electronics News & Expo

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Dresden-location

February 16, 2026
Infineon Technologies supplies microcontrollers, Ethernet connectivity solutions, power management ICs, and smart power switches for BMW Group’s Neue Klasse platform. The architecture separates software from hardware, enabling over-the-air updates without physical modifications.

new-technologies_8

February 03, 2026
In a recent analysis, Evertiq explored which countries dominate global R&D spending. Viewed through the lens of absolute investment volumes, the picture is largely shaped by the United States and China, followed by established industrial powerhouses such as Germany, Japan and France. Shifting that lens away from global heavyweights and toward a smaller, highly R&D-intensive economy reveals a different dynamic — one where the relationship between research investment and industrial capability becomes more clearly defined. Finland provides a useful case for understanding how research investment translates into industrial capability.

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charger

January 29, 2026
Under the agreement, Wallbox will supply its commercial AC charger, eM4 Twin, as the primary hardware solution for initial Dutch deployments through Eneco eMobility’s installation network.

smart-brick

January 22, 2026
Denmark's Lego Group has unveiled LEGO SMART Play, a new interactive play platform based on electronically enabled bricks that respond to physical interaction. The platform was presented at CES 2026 in Las Vegas earlier this month.

opens-new-site-in-Malaysia

January 20, 2026
US-based AI semiconductor company Syntiant has opened a new manufacturing and research facility in Penang, Malaysia.

January 15, 2026
This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.

January 13, 2026
Farnell has entered into a new global distribution partnership with Fulham, expanding access to advanced LED drivers, emergency lighting and intelligent control solutions for customers across EMEA.

Ewelina-Bednarz_Column-2

December 29, 2025
Throughout 2025, Evertiq held a series of conversations with industry leaders and analysts who helped illuminate how the electronics market is evolving. Global supply chains are transitioning into a new phase, influenced by AI, reshoring, labour scarcity, national security, sustainability and a redefinition of the semiconductor cycle.

ZF_acquisition

December 26, 2025
By integrating ZF’s Advanced Driver Assistance Systems (ADAS) capabilities with Harman’s flagship Digital Cockpit offerings within a centralized compute design, the acquisition bolsters Harman’s roadmap for next-generation vehicle architectures.

Electronics_logo

December 23, 2025
Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.

new-technologies_5

December 19, 2025
IBM and Confluent will enable end-to-end integration of applications, analytics, data systems and AI agents to drive intelligence and resilience in hybrid cloud environments.

Chip

December 18, 2025
Avnet Silica has entered into a new franchise agreement with DeepX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful AI semiconductor technology.

December 17, 2025
Betronic Group, a Dutch provider of electronics solutions and components, has acquired Irish EMS provider Smart Electronics, the companies announced in a press release

December 17, 2025
Tokyo-based Toppan Inc., a subsidiary of Toppan Holdings Inc., has completed construction of a new manufacturing line for advanced flip-chip ball-grid array (FC-BGA) substrates at its Niigata Plant in Japan, targeting mass production by the end of the current fiscal year. This move is part of the company’s strategic response to rising demand for high-density semiconductor packaging driven by data center, edge computing and AI workloads, according to a company press release issued on 17 December 2025.

building

December 03, 2025
The company also plans to increase its phone manufacturing capacity by 30 million units to a total of 140 million units annually, and produce charging devices for smart rings.

Materials_campus

November 28, 2025
The new investment by venture studio Ferment and existing investor LIOF, alongside prior investment from Fibrant BV, will accelerate commercial scale-up of Dutch materials company Pegasus’s products for the electronics, data center and aerospace industries.

employee-with-chip

November 27, 2025
ASIC specialist Presto Engineering Group has acquired Garfield Microelectronics Ltd. (GFMicro), a UK-based design house established in 1993 – a move that will create Europe’s most comprehensive “design-to-production” one-stop shop for ASIC.

BEL_agreement

November 26, 2025
The Joint Venture Cooperation (JVC) will localise the manufacturing, supply and maintenance of the Highly Agile Modular Munition Extended Range (HAMMER) weapon to meet the operational needs of India’s Air Force and Navy.

November 20, 2025
Nokia and the European AI lab NestAI have launched a strategic partnership to develop AI-based defence solutions. In connection with the collaboration, Nokia and the Finnish state fund Tesi are investing a total of EUR 100 million in NestAI.

Dave-Doherty_2

November 19, 2025
The global components market is entering a new phase — one that is neither the pandemic-driven scramble for inventory nor the more recent period of oversupply. In a conversation with Evertiq, DigiKey CEO Dave Doherty describes an industry standing at a fragile point of transition, shaped by both uncertainty and accelerating structural change.

Cyient_chip

November 19, 2025
Developed collaboratively by Azimuth AI and Cyient Semiconductors, ARKA GKT-1 integrates multi core custom computing, advanced analog sensing, memory and intelligent power management into a single, highly energy-efficient SoC.

Ajeet_Drone

November 18, 2025
The collaboration aims to develop next-generation AI-based teaming algorithms for swarm drones, along with real-time, context-based object recognition and identification capabilities across Zuppa’s existing UAV offerings.

box-of-PCBs

November 14, 2025
NCAB has signed an agreement to acquire 100% of the shares in Multi-Teknik Mönsterkort AB with offices in Gothenburg, Lithuania and China.

PCB-Germany_1

November 13, 2025
Wireless Mobility Automotive has become a wholly owned subsidiary of Wireless Mobility Holding GmbH, making the company a 100% German-owned enterprise.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

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Linelayout1

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Sponsored content by Brady Corporation

PCB-labelled-700x300

Complete traceability solution from BRADY can connect every circuit board in production to your Smart Factory set up. A fully automated printed circuit board labelling solution can enable traceability and manufacturing data analysis without human interference.

man-with-chip

November 07, 2025
The semiconductor industry is back in the mainstream spotlight. Unfortunately, that usually happens during times of volatility, shortage, and turmoil.

November 07, 2025
Through this agreement, the two companies will jointly develop a robot teaching automation solution that combines the “NEC Robot Task Planning” digital twin service with Siemens’s “Process Simulate” software for 3D robot simulations.

Bornheim-Germany-site

November 03, 2025
French EMS provider Asteelflash announced plans to close its factory in Bornheim, near Bonn, following a review of strategic and economic conditions.

Sponsored content by Koh Young

Visit

Seoul, Korea – Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.

Sponsored content by Brady Corporation

PCB-labelled-700x300

Complete traceability solution from BRADY can connect every circuit board in production to your Smart Factory set up. A fully automated printed circuit board labelling solution can enable traceability and manufacturing data analysis without human interference.

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