Evertiq - First In Electronics News & Expo

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Rhea1

April 28, 2026
European processor developer SiPearl has appointed Guillaume Etorre as Chief Operating Officer, strengthening its executive team as the company prepares to bring its first-generation Rhea1 CPU to market in the coming weeks.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

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Sponsored content by Shanghai Yongming Electronic Co.,Ltd

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YMIN's SLR hybrid supercapacitors enable reliable energy storage at -40°C, with stable capacitance, low ESR, and long service life. Ideal for IoT, smart meters, and outdoor use in extreme climates.

Newen

April 23, 2026
The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

Microsystems

April 23, 2026
This strategic investment will accelerate Spark’s expansion and commercialization momentum for LE-UWB technology as customer demand surges for wireless solutions capable of meeting the performance and power requirements of intelligent edge devices.

AI-Robot-Edward-2

April 22, 2026
Visitors to Evertiq Expo in Kraków on May 7 will have the opportunity to meet the AI-powered robot Edward Warchocki.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

Robots_thyssenkrupp

April 13, 2026
thyssenkrupp Automation Engineering will continue as Krause Automation as part of Agile Robots. The acquisition combines Agile’s AI-powered automation solutions with the engineering and implementation expertise of Krause Automation.

Sevnce_Robotics

April 08, 2026
The two companies will explore potential applications of Sevnce’s robotic and intelligent inspection solutions at BASF sites, and advance materials innovation for key robotic components.

Alif_partnership

March 23, 2026
Brilliant Labs’ Halo Glasses will be powered by Alif Semiconductor’s Balletto B1 MCU, an ultra-low-power microcontroller with a dedicated Neural Processing Unit (NPU) that enables on-device AI processing.

Electronics_Jason_Yuan

March 20, 2026
The key leadership appointments across Southeast Asia and Oceania include Jason Yuan, President, SEA & ANZ; David Leal, Vice-President of Solution Business (Infrastructure), SEA & ANZ; and Lili Mow, Vice-President of Solution Business (Automation), SEA & ANZ.

Synergy

March 17, 2026
The joint venture will combine Axonex’s operational resources and international business capabilities with Synergy Technology Group’s digital twins and drone flight control systems technology.

Sponsored content by KOH YOUNG

Koh Young, the industry leader in True 3D measurement-based inspection solutions, will serve as the Premier Sponsor of IPC APEX EXPO 2026, March 16 to 19 at the Anaheim Convention Center. At Booth 1824, Koh Young will demonstrate how AI-powered inspection and software solutions help electronics manufacturers improve stability and productivity amid tighter tolerances, higher mix production, and rising quality expectations.

SENTRON_ECPD

March 09, 2026
Siemens’ SENTRON ECPD offers 10+ configurable functionalities in a single device, reducing space in the distribution board by 80 percent and allowing for flexible, software-based parameterization.

PCB-India_1

March 06, 2026
C2i Semiconductors is redesigning how electricity flows inside a server from the incoming power source to the processor chip using a grid-to-core approach.

Amberg-expansion-render

March 05, 2026
Siemens plans to invest more than EUR 200 million to build a new digitalised and automated factory at its manufacturing and development site in Amberg, Germany. The facility is intended to support the company’s Smart Infrastructure business and is scheduled to be completed by 2030.

new-technologies_1

March 05, 2026
A significant portion of the investment will focus on new businesses based on these technologies, contributing to the development of South Korea’s future industrial competitiveness.

PCB-India_3

March 04, 2026
The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.

February 23, 2026
Japanese electronics manufacturer Sony and TCL Electronics Holdings Limited have signed a memorandum of understanding (MoU) to explore the establishment of a joint venture in the home entertainment segment.

2024

February 18, 2026
Back in December 2025, the City of Taylor, Texas, and the Taylor Economic Development Corporation (TEDC) announced an economic development agreement with Compal Electronics Inc. to establish a new advanced manufacturing facility in Taylor.

Dresden-location

February 16, 2026
Infineon Technologies supplies microcontrollers, Ethernet connectivity solutions, power management ICs, and smart power switches for BMW Group’s Neue Klasse platform. The architecture separates software from hardware, enabling over-the-air updates without physical modifications.

new-technologies_8

February 03, 2026
In a recent analysis, Evertiq explored which countries dominate global R&D spending. Viewed through the lens of absolute investment volumes, the picture is largely shaped by the United States and China, followed by established industrial powerhouses such as Germany, Japan and France. Shifting that lens away from global heavyweights and toward a smaller, highly R&D-intensive economy reveals a different dynamic — one where the relationship between research investment and industrial capability becomes more clearly defined. Finland provides a useful case for understanding how research investment translates into industrial capability.

charger

January 29, 2026
Under the agreement, Wallbox will supply its commercial AC charger, eM4 Twin, as the primary hardware solution for initial Dutch deployments through Eneco eMobility’s installation network.

smart-brick

January 22, 2026
Denmark's Lego Group has unveiled LEGO SMART Play, a new interactive play platform based on electronically enabled bricks that respond to physical interaction. The platform was presented at CES 2026 in Las Vegas earlier this month.

opens-new-site-in-Malaysia

January 20, 2026
US-based AI semiconductor company Syntiant has opened a new manufacturing and research facility in Penang, Malaysia.

January 15, 2026
This endeavor fast-tracks the deployment of intelligent motion sensing into smart home devices, opening the door for powerful new services across home automation, security and energy management.

January 13, 2026
Farnell has entered into a new global distribution partnership with Fulham, expanding access to advanced LED drivers, emergency lighting and intelligent control solutions for customers across EMEA.

Ewelina-Bednarz_Column-2

December 29, 2025
Throughout 2025, Evertiq held a series of conversations with industry leaders and analysts who helped illuminate how the electronics market is evolving. Global supply chains are transitioning into a new phase, influenced by AI, reshoring, labour scarcity, national security, sustainability and a redefinition of the semiconductor cycle.

ZF_acquisition

December 26, 2025
By integrating ZF’s Advanced Driver Assistance Systems (ADAS) capabilities with Harman’s flagship Digital Cockpit offerings within a centralized compute design, the acquisition bolsters Harman’s roadmap for next-generation vehicle architectures.

Electronics_logo

December 23, 2025
Among the product offerings are Telit Cinterion’s LE910Q1 and LE910R1 LTE Cat 1bis modules, developed specifically to support IoT applications, including a wide range of value-oriented applications that require reliable data speed and global coverage.

new-technologies_5

December 19, 2025
IBM and Confluent will enable end-to-end integration of applications, analytics, data systems and AI agents to drive intelligence and resilience in hybrid cloud environments.

Chip

December 18, 2025
Avnet Silica has entered into a new franchise agreement with DeepX, a South Korea-based hardware and software manufacturer specialising in highly efficient, powerful AI semiconductor technology.

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