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Aerospace

May 28, 2026
The Indian startup's fully battery-powered Gen #2 prototype aircraft can carry an active payload target of above 200 kg, operates under a 500 kg maximum take-off weight, and uses a lift plus cruise configuration.

May 27, 2026
Quectel Wireless Solutions has entered into an expanded distribution partnership with Future Electronics to bring its full portfolio of products and services to customers across the EMEA region.

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Sponsored content by TME Transfer Multisort Elektronik

Panasonic offers a wide range of components designed for industrial automation applications. Among them, miniature photoelectric sensors are particularly popular, valued for their compact dimensions, high precision of operation, and reliability in demanding applications. Let’s check what functions these solutions offer and what distinguishes them in terms of technical parameters.

PCB-India_3

May 22, 2026
The Indian mobile phone company will manufacture key smartphone components such as display modules, camera modules, multilayer PCBs and enclosures in the country as part of its localisation strategy.

cosmos-1

May 22, 2026
The California-based company is developing a constellation of Low Earth Orbit satellites that harness solar energy, a purpose-built launch vehicle to deliver them and compute payloads designed specifically for the space environment.

Mesko-signing

May 22, 2026
During the Defence24 Days conference in Warsaw, Norwegian Kongsberg and Polish Mesko announced a strategic partnership focused on integrating the Piorun missile system with the Protector RS6 and RS4 remote weapon stations. The information was later published on Kongsberg’s website.

Innotek_communication_module

May 22, 2026
LG Innotek’s Automotive Wi-Fi 7 Communication Module will be integrated into Audio, Video, and Navigation(AVN) systems, which will then be delivered to the European automotive parts company.

building_logo

May 21, 2026
The investment strengthens the company’s ability to deliver critical medium-voltage switchgear and grid automation technologies. It includes a new USD 100 million facility in Dalmine, Italy, to support growing demand for air-insulated and SF₆-free switchgear and breakers.

Aireon

May 20, 2026
The acquisition unites Aireon’s surveillance and data services, including GPS jamming and spoofing detection, with Iridium’s global satcom network and PNT services that help keep GPS-dependent systems working in contested environments.

building_logo

May 18, 2026
During the lab test, the application of PC1 technology achieved up to 10 times higher uplink throughput at the cell-edge compared to PC1.5 standard. For users, this means smoother video calls and faster file upload in areas where signals are weak.

KAI_MOU

May 15, 2026
The two parties will leverage Hyundai Motor Group’s expertise in electrified aviation powertrain development and Korea Aerospace Industries’s aircraft airframe development capabilities to jointly develop and mass produce competitive future air mobility aircraft.

founders

May 11, 2026
Sereact builds AI for robots that work in the physical world. The Series B round funds two priorities: scaling Cortex 2.0, the next generation of Sereact’s robotic brain, and entering the United States.

PCB-India_2

May 07, 2026
Crystal Matrix will establish an integrated facility for compound semiconductor fabrication and ATMP while Suchi Semicon will set up an OSAT facility for manufacturing discrete semiconductors, in Gujarat.

Rheinmetall

May 04, 2026
Boeing’s MQ-28 Ghost Bat, a proven autonomous collaborative combat aircraft (CCA), has completed more than 150 flights and has been designed, developed and manufactured in Australia for the Royal Australian Air Force and other allied nations.

UMC

May 04, 2026
Building on HyperLight’s collaboration with Wavetek, which brought TFLN photonics from laboratory innovation to a HVM line within a 6-inch CMOS foundry, Taiwan’s UMC is bringing to the partnership its 8-inch production capability and expertise.

Products_headquarters

May 01, 2026
Under the agreement, the US company will build, own and operate multiple state-of-the-art production facilities and a bulk specialty gas supply system to supply nitrogen, oxygen, argon and hydrogen for Samsung’s new semiconductor fab.

Aerospace_Skyhammer

April 29, 2026
UK startup Cambridge Aerospace develops advanced air defence systems designed to deliver high performance at lower cost. Its first product, Skyhammer, has a range of over 30 km and top speed of 700 km/h.

PCB-India_1

April 27, 2026
Under the partnership, IndieSemiC will be responsible for the module lifecycle — including RF design, antenna engineering, hardware development, firmware support, testing, validation, certification, and manufacturing — while Nordic Semiconductor will provide the core chipset technology.

Sponsored content by Shanghai Yongming Electronic Co.,Ltd

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YMIN's SLR hybrid supercapacitors enable reliable energy storage at -40°C, with stable capacitance, low ESR, and long service life. Ideal for IoT, smart meters, and outdoor use in extreme climates.

BMIT_MoU

April 24, 2026
This strategic partnership aims to strengthen efforts towards fostering indigenous design and production capabilities in advanced technology domains critical to national defence.

KOG_signing

April 24, 2026
This is the second series of submarines to be equipped by Indra with its latest generation fully digital electronic warfare systems and state-of-the-art navigation radar, bringing the total number of platforms fitted with these capabilities to 12.

Energy_Australia

April 24, 2026
This grant forms part of PowerPlus Energy’s USD 6.7 million project to semi-automate the local manufacture of battery modules for current and future products and to provide toll manufacturing capacity for local battery businesses.

Newen

April 23, 2026
The agreement encompasses partnership in joint engineering efforts to create next-generation SiC-based power modules optimised for renewable applications, leveraging both companies’ technical expertise and innovation capabilities.

DRS_logo

April 23, 2026
These Missile Defense Agency (MDA) Scalable Homeland Innovative Enterprise Layered Defense (SHIELD) indefinite-delivery/indefinite-quantity (IDIQ) contracts encompass a broad range of work areas that allow for rapid delivery of innovative capabilities.

Aerospace_F404

April 21, 2026
The depot facility for F404 -IN20 engines will be owned, operated and maintained by Indian Air Force (IAF) with GE Aerospace providing technical inputs, training, support staff and supply of necessary spares and specialized equipment.

chip_packaging_Odisha

April 20, 2026
The US company is investing about USD 21 million in the Odisha project. The facility is expected to produce 70,000 glass panels annually, along with 50 million assembled units and 13,000 advanced 3DHI modules.

Liquide_Japan

April 20, 2026
Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.

Earth_orbit_GustavoAckles

April 14, 2026
The funding will be deployed to advance SatLeo's flagship thermal satellite mission and the development of its AI-powered platform for thermal intelligence applications.

Russia_Tunguska_Missile

April 13, 2026
The USD 47 million contract for the procurement of Tunguska Air Defence Missile Systems for the Indian Army was signed with JSC Rosoboronexport, Russia’s state intermediary agency for the export/import of defense and dual-use products, technologies and services.

Gigafacotry

April 09, 2026
Norwegian battery manufacturer Morrow Batteries has initiated deliveries of lithium iron phosphate (LFP) battery cells to Finnish technology company Proventia, marking a step forward in the company’s industrialisation efforts at its Arendal facility.

Germany_Dresden

April 03, 2026
The state of Saxony, where Dresden is located, is known as one of Europe’s leading hubs for the semiconductor and other advanced technology industries, and it has attracted numerous global companies from these sectors.

power_modules

March 30, 2026
The UCC34141-Q1 and UCC33420 isolated power modules leverage Texas Instruments’s IsoShield technology, a multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs.

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