Evertiq - First In Electronics News & Expo

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Bloomington-Minnesota-manufacturing-facility

December 04, 2025
United Microelectronics Corporation (UMC) and Polar Semiconductor have signed a Memorandum of Understanding to explore a partnership aimed at expanding US-based production of 8-inch semiconductor wafers, the companies announced today.

acquires-Lacon-Group

December 04, 2025
Finish EMS provider Incap Corporation has agreed to acquire Lacon Group, a German EMS and ODM company, in a transaction valued at a minimum of EUR 50 million.

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Cosmos

December 04, 2025
The Chennai-based company will use the funding to scale production units of aerospace and rocket components and boost its stage-recovery programme. Some of the funds will be used to develop Agnikul’s upcoming integrated space campus in Tamil Nadu.

Earth_orbit_GustavoAckles

December 04, 2025
The contract, valued at USD 1.5 million, will fund the design and development of these advanced antenna systems, powered by Sivers’ upcoming broad-market Ka-band SATCOM beamforming integrated circuits (BFICs).

Wave_product

December 04, 2025
Led by government and public sector business executive Jack Sears Jr., the newly formed unit will support D-Wave’s enterprise-wide US government-related initiatives.

Daimler_agreement

December 03, 2025
Daimler Truck and Torc Robotics plan to integrate Innoviz’s LiDAR technology into the autonomous Freightliner Cascadia in combination with Torc’s virtual driver as one of several key components enabling Level 4 autonomous trucking.

Aero

December 03, 2025
The Amprius SiCore SA08 cell is available in volume now, allowing Empirical Systems Aerospace (ESAero) to accelerate the development and integration of Amprius’ cells into its UAVs.

CEO-Jensen-Huang-2022

December 02, 2025
Nvidia and Synopsys announced Monday an expanded strategic partnership aimed at integrating accelerated computing and AI into engineering workflows across multiple industries.

hungary

December 02, 2025
Harman has closed the sale of its Digital Transformation Solutions (DTS) business unit to Wipro Limited, following all required regulatory approvals.

factory-Leipzig

December 02, 2025
Skeleton Technologies has officially opened its €220 million "SuperFactory" in Markranstädt, near Leipzig. The facility is already delivering to Siemens, General Electric, and Hitachi Energy for European electrical grids, and to major US hyperscalers for AI infrastructure.

Manufacturing-Mexico

December 01, 2025
Evolv Technologies has entered into a strategic manufacturing partnership with EMS provider Plexus Corp. as the security technology company seeks to scale production and expand its global supply chain capabilities.

Earth_orbit_satellite

December 01, 2025
This innovative technology is designed for low-Earth orbit Synthetic Aperture Radar (SAR) satellites, which illuminate the Earth’s surface with microwaves and receive reflected waves to create two-dimensional images.

Lab_Inauguration

December 01, 2025
This collaboration between academic research and business aims to push back the technical limits of laser-cooled atom manipulation. The goal is to considerably increase the performance of quantum processors based on this technology.

Versal

December 01, 2025
This new packaging for the Versal AI Core XQRVC1902 adaptive SoC will support missions for up to 15 years, offering a robust foundation for geosynchronous satellites, lunar exploration, and deep-space probes.

PCB-India_3

December 01, 2025
Under the agreement, the Indian automotive supplier will deliver comprehensive High Voltage Electronics for a range of high-performance e-powertrain components, including power electronics unit, inverters, onboard chargers, BMS, and DC-DC converters.

Sponsored content by PEI-GENESIS

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RF interconnects sit at the heart of every high-frequency system, enabling reliable performance across industries from telecom and defense to medical and industrial applications. As technologies evolve — driven by 5G expansion, IoT, AI, and even emerging fields like quantum computing — engineers face new challenges: tighter frequency requirements, miniaturization, extreme environmental demands, and the pressure to accelerate development cycles while managing supply chain risks.

Anseong_campus

November 28, 2025
Hyundai Motor Group’s Future Mobility Battery Campus in Anseong, South Korea, spans 197,000 m² with a total floor area of 111,000 m². Completion is targeted for the end of 2026.

PCB-India_3

November 28, 2025
The Bengaluru-based firm will use the fresh funds to accelerate its transition from prototype silicon to full-scale development and global OEM engagement.

manufacturing_site

November 28, 2025
Raytheon, an RTX business, will help Avio establish a state-of-the-art solid rocket motor (SRM) facility in the United States, serving Raytheon and other customers.

Robotics

November 28, 2025
The proceeds from this round will primarily be used to accelerate commercialisation and drive continued technological innovation by Cornerstone Robotics

PV_Power

November 27, 2025
The Indian solar panel manufacturer has made a formal entry into the Independent Power Producer (IPP) market. Until now, Cosmic PV largely catered to mid-sized EPC players and select OEMs, but this order signals a strategic shift into larger utility-scale opportunities.

November 26, 2025
Nokia has begun construction on a new innovation campus in Ottawa, reinforcing Canada’s position in next-generation connectivity and advanced communications technologies.

factory

November 26, 2025
Hon Hai Technology Group (Foxconn) will expand its Wisconsin operations with a new four-year, USD 569 million investment aimed at boosting US AI and data-server manufacturing capacity, the company and the Wisconsin Economic Development Corporation (WEDC) announced.

Stefan-Theil_WAW-2025-1

November 25, 2025
Stephan Theil, CEO of the German company Factronix, presented technologies and processes at Evertiq Expo Warsaw 2025 that can drastically reduce electronics manufacturing costs, carbon footprint and dependence on unstable supply chains.

November 25, 2025
The European Commission has approved a EUR 450 million Czech state aid package to support US chipmaker Onsemi in building an integrated semiconductor manufacturing facility in Rožnov pod Radhoštěm.

Varkaus-SuperBattery-factory-finland

November 25, 2025
Earlier in November Skeleton Technologies inaugurated its new SuperBattery manufacturing facility in Varkaus, marking a EUR 50 million investment and the launch of Europe’s first production site dedicated to high-power batteries for AI data centres.

Thomas-ZImmermann

November 25, 2025
With more than three decades of experience, the TQ Group has become important player in Germany’s electronics manufacturing landscape. Since its founding in 1994, this family-owned company has evolved into a broad-based technology provider, combining embedded modules, drive systems, robotics solutions and advanced electronics manufacturing. Despite growth and diversification, one principle has remained unchanged: treating development, manufacturing and technology integration as a unified whole.

Tohuku-Produktion-center

November 25, 2025
Tokyo Electron Ltd. (TEL) has completed construction of the Tohoku Production and Logistics Centre at its subsidiary, Tokyo Electron Technology Solutions, the company announced.

Taiwan_partnership

November 24, 2025
The companies have entered into a collaboration to advance the hybrid integration and packaging of photonic integrated circuits (PICs) for next-generation optical transceiver development.

quantum-computer_geralt

November 24, 2025
The investment by the French company is part of a major strategic expansion in South Korea, marked by a series of partnerships and support from the Seoul Metropolitan Government and the Korean government.

November 24, 2025
GlobalFoundries and Navitas Semiconductor will manufacture next-gen GaN technology at GF’s Burlington, Vermont facility, leveraging the site’s expertise in high-voltage GaN-on-Silicon technology and Navitas Semiconductor’s GaN tech and device expertise.

Dayton_research

November 21, 2025
To support the collaboration, IBM will contribute state-of-the-art semiconductor equipment to the University of Dayton for a new semiconductor nanofabrication facility on the university’s campus.

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