Global shortage of glass fiber cloth continues March 04, 2026 The global shortage of glass fiber cloth is continuing to drive significant constraints in PCB laminate availability.
Nvidia to invest $2 billion in Lumentum under new optics partnership March 04, 2026 Nvidia has entered a multiyear strategic partnership with Lumentum to accelerate the development of advanced optics technologies for next-generation AI infrastructure.
Flex and AMD expand US manufacturing of AI platforms March 04, 2026 EMS provider Flex has expanded its strategic collaboration with Advanced Micro Devices (AMD) to manufacture AMD Instinct GPU platforms in the United States, as demand for AI infrastructure continues to accelerate, according to a press release.
Vervesemi Microelectronics raises $10 million in Series A March 04, 2026 The Indian company will accelerate commercialisation of its machine learning-enhanced analog signal chain chip portfolio, including advanced data converters and intelligent power and sensing solutions for industrial, smart energy, motor control and avionics applications.
NEC, Nokia to expand Eletronet’s optical fiber network in Brazil March 04, 2026 The project adds 8,000 km of new fiber routes. This expansion is expected to reach a total of 26,000 km across 23 Brazilian states by the end of 2026. Eletronet is investing USD 30.4 million in this initiative.
Nvidia to invest $2 billion in Coherent March 03, 2026 Nvidia has entered a multiyear strategic agreement with Coherent to develop advanced optics technologies for next-generation AI infrastructure. The agreement includes a USD 2 billion investment by Nvidia in Coherent, alongside a multibillion-dollar purchase commitment for optical networking and laser products.
OMR Italia to cease PCB production, 27 jobs affected March 03, 2026 OMR Italia SpA, a PCB manufacturer based in Concorezzo, Italy, has signed an agreement on a collective redundancy procedure affecting 27 employees following its decision to permanently cease production.
ams OSRAM completes EUR 114m lamps business sale March 03, 2026 Sensor and photonics company ams OSRAM has completed the sale of its Entertainment and Industry Lamps business to Japan-based Ushio Inc. for EUR 114 million. The transaction was closed on 2 March 2026.
AT&S invests EUR 30 million in Fehring plant March 03, 2026 Austrian IC substrates and PCB manufacturer AT&S will invest more than EUR 30 million in its Fehring plant by March 2027. The programme covers new production technologies, sustainability measures and the creation of around 50 jobs.
Keenfinity EMS secures ISO 13485 certification in Portugal March 03, 2026 Keenfinity EMS has obtained ISO 13485:2016 certification for its electronics manufacturing plant in Ovar, Portugal. The certification, announced on 2 March 2026, covers the design and manufacture of electronic systems for medical devices, including control units, power supply units and human–machine interfaces.
BMW to deploy humanoid robots in production in Germany March 03, 2026 In collaboration with Hexagon, a long‑standing, established partner of the BMW Group in the field of sensor technology and software, the first pilot project in Europe is now underway.
Mitsubishi Heavy Industries Compressor acquires Swiss firm AST March 02, 2026 AST is engaged in maintenance, inspection and field services for rotating equipment such as compressors and steam turbines that drive compressors, used in resource and energy development sites, including in the oil and gas sectors.
GA-ASI develops long-range weapons capabilities for MQ-9B March 02, 2026 So far, GA-ASI has performed all the performance analytics and is confident in MQ-9 B’s ability to carry long-range weapons over long distances, while providing a measure of persistence and endurance.
Samsung, AMD to advance AI-powered network innovations March 02, 2026 Following last year’s validation milestone, both companies will introduce the successful results of multi-cell testing conducted at Samsung’s R&D Lab, enabling scalable deployments and greater processor flexibility within software-based network environments.
GE Aerospace, Kratos win US Air Force award to design engine March 02, 2026 The GEK1500 is a 1,500-lb thrust jet engine that could potentially power unmanned aerial systems (UAS), collaborative combat aircraft (CCAs) and missiles.
DNP invests in Rapidus to advance mass production of 2nm chips March 02, 2026 Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors.
Ralf Hasler joins Incap's management team March 02, 2026 Having officially closed its acquisition of Lacon Group, EMS provider Incap Group has appointed Dr Ralf Hasler as the Director of Operations, Germany and Romania, and member of Incap Group’s Management Team.
Micron opens semiconductor assembly and test facility in India March 01, 2026 US memory manufacturer Micron Technology has officially opened its semiconductor assembly and test facility in Sanand, Gujarat, India.
Strengthen PCB procurement in Europe – risks of Asian dependency February 27, 2026 Unilateral dependence on Asia for PCBs is a strategic risk. For six years, global geopolitics has been showing us more and more clearly that supply chains are fragile. The pandemic caused massive disruptions, semiconductor shortages led to allocations, the war in Ukraine exacerbated raw material uncertainties, and protectionist measures by the US and the deliberate isolation of Asian markets have made free global trade an illusion.
Hitachi Energy integrates Pakal’s IGTO into ≥3.3 kV power modules February 27, 2026 Hitachi Energy and Pakal Technologies have announced a collaboration to develop next-generation high-voltage silicon power semiconductor modules rated at ≥3.3 kV.
Intervala invests over $6 million in manufacturing expansion February 27, 2026 Intervala has invested more than USD 6 million in new manufacturing technology, automation and facility expansion to strengthen its high-reliability electronics manufacturing capabilities.
SK hynix and Sandisk looks to standardise next-gen HBF memory February 26, 2026 SK hynix and Sandisk have announced the start of a global standardisation initiative for next-generation memory solution, High Bandwidth Flash (HBF) aimed at the AI inference era.
European PCB revenues rise 2.4% as industry shrinks February 25, 2026 European PCB manufacturing increased by 2.4% in 2025, while the global PCB market expanded by more than 11%, according to Data4PCB. At the same time, 11 manufacturers exited the market, reducing the European PCB base to 168 companies operating 182 facilities.
TSMC board approves $45 billion for capacity expansion February 25, 2026 The world’s largest semiconductor foundry, TSMC, has approved a capital injection of USD 44.96 billion to expand production capacity. The decision was made during a board meeting on 10 February 2026 in Hsinchu, Taiwan.
SEALSQ and WISeKey to relocate Geneva HQ, launch quantum hub February 24, 2026 SEALSQ Corp and its parent WISeKey International Holding, are planning to move their Geneva headquarters to the Pont-Rouge district in August 2026. The relocation coincides with the launch of the Geneva Quantum Centre of Excellence, intended to consolidate the group’s research and industrial deployment of quantum computing, post-quantum cybersecurity, and secure semiconductor technologies.
Cadence completes acquisition of Hexagon’s D&E business February 24, 2026 US-based Cadence Design Systems has completed its acquisition of the Design and Engineering (D&E) business from Swedish technology group Hexagon AB, in a deal valued at approximately EUR 2.7 billion.
Motherson opens new automotive lighting plant in Sanand, India February 24, 2026 Motherson has inaugurated a manufacturing facility in Sanand, Gujarat, India, established as a strategic joint venture with Marelli. The plant is dedicated exclusively to producing exterior automotive lighting systems and expands the group’s capabilities in automotive component manufacturing.
DATA MODUL expands EMS with full assembly and supply chain services February 23, 2026 DATA MODUL is expanding its industrial product assembly services, offering end-to-end manufacturing solutions designed to increase flexibility, quality, and planning reliability, the company states in a press release.
SoftBank’s SAIMEMORY and Intel collaborate on next-gen Z‑Angle memory February 23, 2026 SoftBank's subsidiary SAIMEMORY has signed a collaboration agreement with Intel Corporation to advance the development and commercialisation of Z‑Angle Memory (ZAM), a next-generation memory technology designed for high capacity, high bandwidth and low power consumption.
Sony and TCL plan joint venture in home entertainment February 23, 2026 Japanese electronics manufacturer Sony and TCL Electronics Holdings Limited have signed a memorandum of understanding (MoU) to explore the establishment of a joint venture in the home entertainment segment.
Incap completes its acquisition of Lacon Group February 20, 2026 In early December last year, Finnish EMS provider Incap Corporation signed an agreement to acquire 100% ownership of Lacon Group, an EMS company with facilities in Germany and Romania.
Qualcomm to invest up to $150 million in AI startups in India February 20, 2026 US semiconductor company Qualcomm says it plans to invest up to USD 150 million in India’s technology and AI startup ecosystem through a new strategic venture fund.