Evertiq - First In Electronics News & Expo

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turbocharger

April 17, 2026
BorgWarner’s VTG turbocharger technology enables precise control of engine operation, optimizing performance across a broad range of engine speeds and integrating advanced combustion strategies to boost efficiency, enhance fuel economy and lower emissions.

Kawasaki-main-office

April 17, 2026
Under this agreement, Fujitsu will leverage Chugoku’s intellectual property to launch an advanced power grid operation and maintenance support service for power transmission and distribution companies.

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center_NY_Creates

April 17, 2026
Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

quantum-technologies-1

April 17, 2026
This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.

top-image-generic

April 16, 2026
The European Commission has unveiled a new EUR 115 million funding instrument aimed at accelerating the development and deployment of disruptive defence technologies, with a strong focus on SMEs, start-ups and scale-ups across the EU.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

April 16, 2026
Molex has entered into an agreement to acquire Israel-based Teramount, a developer of fiber-to-chip connectivity solutions, in a move aimed at accelerating the adoption of scalable Co-Packaged Optics (CPO).

Sowa-interview-2025-krk

April 16, 2026
Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.

Rail_Clever

April 16, 2026
Clever Devices’ portfolio of onboard and centralized data solutions will complement Hitachi Rail’s HMAX Mobility suite. HMAX Mobility is Hitachi Rail’s digital asset management platform that optimizes the performance of railways around the world.

motherboard-Switzerland

April 15, 2026
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.

AB-Electronic

April 15, 2026
Assmy & Böttger Electronic GmbH has completed a comprehensive modernisation of its SMD production, adding a second placement line from Fuji Europe Corporation GmbH to increase capacity and introduce redundancy.

MoU_Indra

April 15, 2026
The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.

April 15, 2026
The transaction will be executed through a company split whereby the business will be transferred to the successor company, followed by the transfer of all issued shares of the successor company to the acquirer.

Opens-Analysis-Center-and-Rapidus-Chiplet-Solutions

April 14, 2026
Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.

April 14, 2026
Nanya Technology Corporation has received strategic participation in its private placement from Kioxia, SK hynix subsidiary Solidigm and SanDisk, as the company accelerates investment in advanced DRAM capacity for AI-driven demand.

Ukraine-Kvertus

April 14, 2026
For years, defence electronics followed a relatively stable logic. Systems were designed against defined threat models, tested in controlled environments, certified, and then deployed with the expectation that they would remain valid over time.

3D-Nand

April 14, 2026
Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

M12

April 14, 2026
M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.

quantum-computer_geralt

April 13, 2026
The funding will accelerate production of the US company’s Quantum Light Engines, photonic control systems for quantum computing, sensing and networking, while supporting scale-up, supply chain expansion and global partnerships.

Russia_Tunguska_Missile

April 13, 2026
The USD 47 million contract for the procurement of Tunguska Air Defence Missile Systems for the Indian Army was signed with JSC Rosoboronexport, Russia’s state intermediary agency for the export/import of defense and dual-use products, technologies and services.

April 13, 2026
The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

video-still

April 10, 2026
How often do we really think about the scale of the technologies we use? How small are the elements that make up a single device — and how far does that scale extend beyond what we can see?

quantum_computer_Poland

April 10, 2026
The system, which will be installed at Galaxy Systemy Informatyczne’s headquarters in Zielona Góra later this year, will enable Galaxy to execute quantum algorithms across various application areas.

PCB-India_1

April 10, 2026
Cyient Semiconductors’ global reach enables Kinetic Technologies to tap into India’s semiconductor ecosystem, gaining access to engineering talent, OSAT and manufacturing partners, and stronger design capabilities.

Decker_headquarters

April 10, 2026
Stanley Black & Decker expects to utilize the net proceeds from the sale of its Consolidated Aerospace Manufacturing (CAM) business Howmet Aerospace to reduce debt.

ESA_partnership

April 10, 2026
Siemens will provide industrial-grade, comprehensive digital twin capabilities and a fully digital engineering and simulation backbone for the European space industry along with access to mentors and experts in the field.

EUV-system

April 09, 2026
Worldwide sales of semiconductor manufacturing equipment increased 15% to USD 135.1 billion in 2025 from USD 117.1 billion in 2024, driven by continued investment in advanced logic, memory, and AI-related capacity expansion, according to SEMI.

Ukraine-Kvertus-2

April 09, 2026
Cities and critical infrastructure are no longer exposed only to direct, conventional threats. Increasingly, they are tested through disruptions to energy systems, communications, logistics, and command layers – often without a clearly defined frontline.

Fabrica

April 08, 2026
Nano Dimension Ltd. has agreed to sell its additively manufactured electronics (AME) product line and its previously discontinued Fabrica product line to Inspira Technologies as part of an ongoing strategic review.

corporate-building

April 08, 2026
ZEISS has opened a new Quality Excellence Center in Huntersville, North Carolina, expanding its metrology and quality assurance footprint in the US.

April 08, 2026
OKI has introduced a new electronics manufacturing services (EMS) offering targeting AI server equipment.

Lip-Bu-Tan-elon-musk

April 07, 2026
Intel has announced it will join the Terafab project, spearheaded by Elon Musk, alongside SpaceX, Tesla and xAI.

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