TSMC is still the undisputed foundry leader
February 27, 2024
TrendForce’s latest report reveals that in 2023, global foundry revenues hit USD 117.47 billion, with TSMC capturing a dominant 60% share.
Japanese earthquake halts wafer, MLCC, and semiconductor fabs
January 02, 2024
TrendForce’s investigation into the impact of the recent strong earthquake in the Noto region of Ishikawa Prefecture, Japan, reveals that several key semiconductor-related facilities are located within the affected area.
Ad
TSMC considering third fab in Japan, running 3nm tech
November 28, 2023
The world's biggest semiconductor manufacturer is reportedly mulling a third fab in Japan, and according to people with insight the fab would make 3nm chips.
Japanese government allocates $13bn to domestic chip sector
November 10, 2023
Japan's Economy Ministry is preparing a range of subsidies as it attempts to re-establish Japan as a global electronics leader.
Japan is looking to revitalise its semiconductor industry
October 31, 2023
Japan flexes its advantages in semiconductor upstream equipment and raw materials, and unveils strategic progress of key players in Kyushu, Tohoku, and Hokkaido, says TrendForce
Strong earthquake hits northeastern Japan
March 17, 2022
A powerful magnitude 7.3 earthquake occurred off the coast of Fukushima, Japan on the evening of March 16. Most of northeastern Japan is a production center for global upstream semiconductor raw materials.
Sumco invests in capacity expansion
August 09, 2017
Japan-based manufacturer Sumco plans to expand production capacity for 300mm silicon wafers by 110,000 units per month.
Silicon wafer shipments reach record levels in 2014
February 12, 2015
Worldwide silicon wafer area shipments increased 11% in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group. However, worldwide revenues increased by just 1% in 2014 compared to 2013.
Silicon wafer shipments increase in Q1
May 21, 2010
Worldwide silicon wafer area shipments increased during the first quarter 2010 when compared to fourth quarter 2009 area shipments according to SEMI .
MEMS Business is boosting thick-SOI demand
June 23, 2008
The term thick-SOI refers to a semiconductor substrate with an active, single-crystal silicon layer and its thickness exceeds 1µm. It lies on a buried oxide which is set on top of a silicon Wafer carrier. This structure is widely used in MEMS and in Power Device electronics, reports electronics.ca publication in their latest report.
Intel presents its annual PQS award
March 28, 2007
44 companies have received Intel Corporation's Preferred Quality Supplier (PQS) award for outstanding commitment to quality and performance excellence.
Load more news