Japanese PM promises new law to support chip firms
July 26, 2024
Japan's Prime Minister Fumio Kishida has pledged to boost domestic mass production of advanced semiconductors and related R&D with new legislation.
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TSMC is still the undisputed foundry leader
February 27, 2024
TrendForce’s latest report reveals that in 2023, global foundry revenues hit USD 117.47 billion, with TSMC capturing a dominant 60% share.
Japanese earthquake halts wafer, MLCC, and semiconductor fabs
January 02, 2024
TrendForce’s investigation into the impact of the recent strong earthquake in the Noto region of Ishikawa Prefecture, Japan, reveals that several key semiconductor-related facilities are located within the affected area.
TSMC considering third fab in Japan, running 3nm tech
November 28, 2023
The world's biggest semiconductor manufacturer is reportedly mulling a third fab in Japan, and according to people with insight the fab would make 3nm chips.
Japanese government allocates $13bn to domestic chip sector
November 10, 2023
Japan's Economy Ministry is preparing a range of subsidies as it attempts to re-establish Japan as a global electronics leader.
Japan is looking to revitalise its semiconductor industry
October 31, 2023
Japan flexes its advantages in semiconductor upstream equipment and raw materials, and unveils strategic progress of key players in Kyushu, Tohoku, and Hokkaido, says TrendForce
Strong earthquake hits northeastern Japan
March 17, 2022
A powerful magnitude 7.3 earthquake occurred off the coast of Fukushima, Japan on the evening of March 16. Most of northeastern Japan is a production center for global upstream semiconductor raw materials.
Sumco invests in capacity expansion
August 09, 2017
Japan-based manufacturer Sumco plans to expand production capacity for 300mm silicon wafers by 110,000 units per month.
Silicon wafer shipments reach record levels in 2014
February 12, 2015
Worldwide silicon wafer area shipments increased 11% in 2014 when compared to 2013 area shipments according to the SEMI Silicon Manufacturers Group. However, worldwide revenues increased by just 1% in 2014 compared to 2013.
Japan’s NAND industry rides strong demand
March 15, 2012
Japan’s NAND industry rides strong demand to recover from earthquake.
Sumco restructures
February 06, 2012
Japan-based Sumco Corp. has decided to exit the solar wafer business. With it, the company has decided to dissolve Sumco Solar Corp. and Minamata Denshi Corp.
2HDec. DDR3 contract price stays flat
December 27, 2011
2HDec. DDR3 contract price stays flat, 2GB module price at USD 9 mark
2HMay DRAM contract price remains flat
May 26, 2011
According to DRAMeXchange, 2H’May contract prices will remain flat from the previous period. DDR3 2GB’s average contract price is USD 18.75 (1GbUSD $1.02) and 4GB is USD 36.5 (2Gb USD 2.12).
2HMay DRAM contract price remains flat
May 26, 2011
According to DRAMeXchange, 2H’May contract prices will remain flat from the previous period. DDR3 2GB’s average contract price is USD 18.75 (1GbUSD $1.02) and 4GB is USD 36.5 (2Gb USD 2.12).
1H’Apr. DDR3 4GB contract price is up 6%
April 11, 2011
According to DRAMeXchange,1H’Apr. contract price continues its upward trend that DDR3 2GB “Average” contract price is up 5.88% to USD18 (USD 2.03/2Gb) while DDR3 4GB “Average” increases 6.1% to USD 35 (USD 2.03/2Gb).
1H’Apr. DDR3 4GB contract price is up 6%
April 11, 2011
According to DRAMeXchange,1H’Apr. contract price continues its upward trend that DDR3 2GB “Average” contract price is up 5.88% to USD18 (USD 2.03/2Gb) while DDR3 4GB “Average” increases 6.1% to USD 35 (USD 2.03/2Gb).
ASP of mainstream NAND Flash increased 5-15% in March
March 31, 2011
According to DRAMeXchange, after the strike of the 9.0 earthquake in Japan Tohoku area on March 11th, at first, there was a rapid spot price increase in the NAND Flash market, in response to the uncertain concern of an upcoming short supply.
2H/March DDR3 contract prices increased by over 3% on average
March 23, 2011
According to DRAMeXchange, northeast Japan earthquake has led to a shortage in raw material commonly used in the semiconductor industry.
Effects on global DRAM capacity
March 16, 2011
What effects did the earthquake, the radiation leak at Fukushima No.1 and the subsequent power cuts in the northeast of Japan have on the silicon wafer supply and global DRAM capacity.
Further analysis of Japan's DRAM / NAND industry
March 14, 2011
Further analysis and statements regarding the state of Japan's electronics industry are coming out of the country.
Silicon wafer shipments increase in Q1
May 21, 2010
Worldwide silicon wafer area shipments increased during the first quarter 2010 when compared to fourth quarter 2009 area shipments according to SEMI .
MEMS Business is boosting thick-SOI demand
June 23, 2008
The term thick-SOI refers to a semiconductor substrate with an active, single-crystal silicon layer and its thickness exceeds 1µm. It lies on a buried oxide which is set on top of a silicon Wafer carrier. This structure is widely used in MEMS and in Power Device electronics, reports electronics.ca publication in their latest report.
Intel presents its annual PQS award
March 28, 2007
44 companies have received Intel Corporation's Preferred Quality Supplier (PQS) award for outstanding commitment to quality and performance excellence.
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