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AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

opening-singapore-2026

September 30, 2026
Palo Alto-based robotics company Tacta Systems has opened an office and production facility in Woodlands, Singapore. The site will initially produce the Tacta Glove, which captures the movements of skilled workers to teach robotic hands new tasks, ahead of the company's first customer deployments in early 2027.

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EPIC-center

September 30, 2026
Flash memory maker KIOXIA will join Applied Materials' EPIC Center in Silicon Valley as an innovation partner. It is the latest in a series of chipmakers to sign up.

Gotion

September 30, 2026
German automaker Volkswagen and Chinese battery manufacturer Gotion High-Tech are expanding their cooperation in electric vehicle battery production. Gotion will invest €1.1 billion (around $1.25 billion) in the PowerCo plant in Valencia, Reuters reported. Following the transaction, the Chinese company will hold a 49% stake in the factory, while Volkswagen will retain a majority stake.

Romania-cable-assembly

September 30, 2026
Incap Electronics Romania has invested in a new semi-automatic cable processing system to support a recently awarded multi-year electric bus project. The project has an estimated annual value of EUR 5 million.

Substrates

September 30, 2026
LG Innotek aims for its package solution business, which produces semiconductor substrates, to generate USD 647 million in operating profit by 2031. That is nearly eight times the level reached in 2025, as the company pushes into substrates for AI memory and CPUs.

Group_ISM_MOU

September 30, 2026
Under the MOU, Japan’s Nippon Express (NX) Holdings and India Semiconductor Mission (ISM) will work closely to address logistics-related challenges and help in developing infrastructure to strengthen India’s semiconductor ecosystem.

Discussion-Krakow-2026

September 29, 2026
In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.

Groundbreaking-Ovik-factory-2026

September 29, 2026
Kitron has broken ground on its new production site in Gålnäs, Örnsköldsvik, Sweden. Construction is starting earlier than planned. In the spring, the company expected construction to begin in early 2027.

production-2020

September 29, 2026
Swiss EMS provider Variosystems is expanding its conformal coating, gluing and specialised manufacturing capabilities at its site in Steinach. The investments target customers in highly regulated industries such as Aerospace & Defence and Medtech & Life Science.

vacuum-lamination-press-2026

September 29, 2026
UK PCB manufacturer Merlin Flex has installed a new oil-heated vacuum lamination press with a bonding area of 1,800 by 750 millimetres, extending the company's ability to produce flexible circuits in continuous lengths of up to 1.8 metres.

Dallara_car

September 28, 2026
The work combines Dallara’s expertise in high-performance vehicle engineering with IBM’s expertise in AI for physics and quantum computing to investigate how to accelerate aerodynamic design and open a path to even more advanced simulation workflows.

fuel_cell

September 28, 2026
Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.

Lockheed_Martin

September 28, 2026
Tata Advanced Systems Limited and Javelin Joint Venture (JJV), a partnership between Raytheon and Lockheed Martin, will explore the establishment of a final assembly and integration facility for the Javelin AUR and component production capabilities in India.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

Cleanroom_Texas

September 28, 2026
The new cleanroom is four times the size of Firefly Aerospace’s existing cleanroom and part of the company’s 144,000-square-foot campus in Cedar Park, Texas.

Envision_BESS_Morocco

September 28, 2026
OCP Green Energy, a subsidiary of Morocco’s OCP Group, signed a contract in 2025 with Chinese technology supplier Envision Energy to supply and commission a storage system based on LFP (lithium iron phosphate) technology.

Honda-5

September 25, 2026
Honda plans to invest about USD 1.90 billion to USD 2.53 billion in the new facility, which is slated to start production in 2030, ‌Nikkei reports.

headquarters

September 25, 2026
Through AI-powered EDA flows, multiphysics-aware signoff methodologies, multi-die design flows, and silicon-proven Interface and Foundation IP, Synopsys and TSMC are helping customers address growing design complexity.

cloud

September 25, 2026
The funding allows the Helsinki-based company to accelerate product development across all layers of its AI cloud, from compute capacity to platform services for frontier AI teams in the agentic era.

Electronics_Kelington

September 25, 2026
Kelington will support the delivery of critical infrastructure and systems required for semiconductor manufacturing. The partnership will enable Tata Electronics to accelerate the facility’s operational readiness for silicon wafer production.

building

September 25, 2026
Located in the Namyong Terminal Free Zone in the Bueng Subdistrict of Si Racha District, the 2,318-square-meter facility offers packaging, final assembly, pack-on-site services and in-lane logistics for customers in Thailand and throughout Southeast Asia.

Software_AI

September 25, 2026
The new built-in Model Context Protocol (MCP) support complements Simio’s existing AI capabilities by enabling organizations to connect preferred, compatible generative AI applications powered by large language models (LLMs) to Simio.

TSMC_design

September 24, 2026
As part of this collaboration, Siemens and TSMC have enabled an AI-powered agent for automated design rule check (DRC) fixing across digital and custom integrated circuit (IC) design flows.

September 24, 2026
The acquisition is intended to foster an open robotics ecosystem, providing developers with the tools, software and frameworks needed to move more efficiently from research and experimentation to prototyping, deployment and production at scale.

Delta_Capacity_BESS

September 24, 2026
Construction of the project, AKKU One, in Lapinlahti, Finland is now under way, with commissioning targeted for Q4 2027. AKKU One was acquired as a ready-to-build (RTB) asset from Helios Nordic Energy.

Aerospace_NY_research_center

September 24, 2026
The State of New York has also committed USD 8.4 million in tax credits through Empire State Development (ESD) to the project, with Schenectady County Metroplex Development Authority contributing additional local incentives valued at USD 5.3 million.

electric-car-4

September 24, 2026
Chinese passenger car manufacturer Geely has unveiled an ultra-fast charging system for electric vehicles that can increase a battery's state of charge from 10% to 70% in 4.5 minutes, according to Reuters. The company also introduced a new generation of traction batteries and an updated Galaxy E5 SUV, responding to intensifying competition from BYD in China's electric vehicle market.

Kulim-site-2026

September 24, 2026
Austrian IC substrate and PCB manufacturer AT&S has signed an expanded long-term agreement with semiconductor company Marvell Technology to supply advanced IC substrates for next-generation AI and cloud infrastructure.

Nexstrom

September 24, 2026
The funding will support ongoing platform development, collaborations with semiconductor foundries and expansion of Nexstrom’s engineering and leadership teams as the company advances high-performance, low-power chips for AI, data centers and computing applications.

Marco-Mezger-2026

September 23, 2026
It is only September, yet Christmas has already arrived in the supermarkets. Gingerbread and holiday decorations are filling shelves, while retailers are preparing for the most important shopping season of the year.

September 23, 2026
Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies.

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