Evertiq - First In Electronics News & Expo

Ad

Ad

Ad

Ad

Ad

partnership_Franz26

April 20, 2026
Seal Dynamics’ presence in Asia and Brazil will connect aerospace OEMs with Greene Tweed’s high-performance solutions, including advanced sealing systems and Xycomp DLF thermoplastic composites, that address their specific challenges.

Liquide_Japan

April 20, 2026
Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.

Ad

CircleK_partnership

April 20, 2026
The collaboration is centered around a strategic ambition to expand to more than 350 sites featuring Rechargeries @ Circle K, combining Ionna’s charging technology and driver-first experience with Circle K’s nationwide footprint.

battery_tech

April 20, 2026
The resources secured through the entry of Axon Partners Group and the support of CDTI-Innvierte will enable Spanish company Basquevolt to advance its industrial roadmap, including the scale-up of electrolyte production.

April 20, 2026
The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.

Autery_Gander_Robotics

April 17, 2026
Current rescue protocols depend on human reaction time, visual searches and manual deployment of rescue swimmers, a process measured in minutes or hours when every second counts. Gander Robotics’ Autonomous Rescue Swimmer (ARS) is designed to change that equation.

center_NY_Creates

April 17, 2026
Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.

quantum-technologies-1

April 17, 2026
This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.

top-image-generic

April 16, 2026
The European Commission has unveiled a new EUR 115 million funding instrument aimed at accelerating the development and deployment of disruptive defence technologies, with a strong focus on SMEs, start-ups and scale-ups across the EU.

groundbreaking-10-04-2026

April 16, 2026
Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.

Sowa-interview-2025-krk

April 16, 2026
Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.

Vietnam-plant

April 16, 2026
Japanese PCB manufacturer Meiko Electronics has decided to establish a new wholly owned subsidiary in Vietnam, aimed at expanding its PCB manufacturing capacity in the ASEAN region.

handshake

April 16, 2026
Eurofins Scientific SE has signed an agreement to sell its Electrical & Electronic Testing business, MET Labs, to UL Solutions Inc. for an enterprise value of EUR 575 million on a cash- and debt-free basis.

Rail_Clever

April 16, 2026
Clever Devices’ portfolio of onboard and centralized data solutions will complement Hitachi Rail’s HMAX Mobility suite. HMAX Mobility is Hitachi Rail’s digital asset management platform that optimizes the performance of railways around the world.

motherboard-Switzerland

April 15, 2026
On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.

Claude-Loeffen

April 15, 2026
Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?

AB-Electronic

April 15, 2026
Assmy & Böttger Electronic GmbH has completed a comprehensive modernisation of its SMD production, adding a second placement line from Fuji Europe Corporation GmbH to increase capacity and introduce redundancy.

MoU_Indra

April 15, 2026
The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.

April 15, 2026
The transaction will be executed through a company split whereby the business will be transferred to the successor company, followed by the transfer of all issued shares of the successor company to the acquirer.

AIRob-presentation-TMP26

April 14, 2026
Electronics manufacturers operating in high-mix, low-volume (HMLV) environments need more flexible automation to remain competitive, according to Piotr Owczarek of Fideltronik, Fitech and AIRob. Speaking at the Evertiq Expo Tampere 2026, he outlined how modular robotics and AI-driven systems can address the limitations of traditional automation.

Opens-Analysis-Center-and-Rapidus-Chiplet-Solutions

April 14, 2026
Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.

Ukraine-Kvertus

April 14, 2026
For years, defence electronics followed a relatively stable logic. Systems were designed against defined threat models, tested in controlled environments, certified, and then deployed with the expectation that they would remain valid over time.

3D-Nand

April 14, 2026
Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.

boundry-switzerland

April 14, 2026
Swiss EMS provider Cicor reported solid order intake in the first quarter of 2026, supported by continued strength in the Aerospace & Defence (A&D) segment and new customer wins.

M12

April 14, 2026
M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.

PCB-Japan_1

April 13, 2026
Established in 2022, Rapidus has secured funding from both the public and private sectors. It is aiming to mass-produce cutting-edge chips using 2-nanometer technology by 2027.

Robots_thyssenkrupp

April 13, 2026
thyssenkrupp Automation Engineering will continue as Krause Automation as part of Agile Robots. The acquisition combines Agile’s AI-powered automation solutions with the engineering and implementation expertise of Krause Automation.

Basquevolt

April 13, 2026
The Joint Development Agreement (JDA) aims to fast-track lithium metal-based battery technology for Pre-A Sample EV requirements.

April 13, 2026
The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.

data_centers

April 13, 2026
This financing will enable the California-based semiconductor company to accelerate the development of its next generation data center solutions and expand its global engineering teams to meet the needs of agentic AI workloads.

UgoWork_batteries

April 13, 2026
This approval allows Linde customers to integrate UgoWork’s UL-listed energy solutions alongside KION’s existing battery offering, giving its customers flexibility in choosing the forklift power system.

Sponsored content by TME Transfer Multisort Elektronik

700x300-4

XT series connectors with Push-X technology from Phoenix Contact set a new standard for quick and convenient wiring in industrial installations. The solution available at TME significantly reduces assembly time, increases the reliability of connections, and simplifies work during both installation and subsequent service.

Load more news

© 2026 Evertiq AB

Ad