Greene Tweed, Seal Dynamics boost aerospace OEM market April 20, 2026 Seal Dynamics’ presence in Asia and Brazil will connect aerospace OEMs with Greene Tweed’s high-performance solutions, including advanced sealing systems and Xycomp DLF thermoplastic composites, that address their specific challenges.
Air Liquide invests €200M in Japan to support chip manufacturer April 20, 2026 Set to begin operations by the end of 2028, Air Liquide’s production units will deliver large volumes of ultra-pure nitrogen, oxygen and argon to support the production of advanced chips.
Ionna partners with Circle K to expand EV charging in US April 20, 2026 The collaboration is centered around a strategic ambition to expand to more than 350 sites featuring Rechargeries @ Circle K, combining Ionna’s charging technology and driver-first experience with Circle K’s nationwide footprint.
Battery tech firm Basquevolt brings Axon on board as investor April 20, 2026 The resources secured through the entry of Axon Partners Group and the support of CDTI-Innvierte will enable Spanish company Basquevolt to advance its industrial roadmap, including the scale-up of electrolyte production.
Renesas expands auto MCU portfolio with 28nm RH850/U2C April 20, 2026 The MCU targets a range of automotive applications, including chassis and safety systems for passenger cars and motorcycles, battery management systems (BMS) and body control functions such as lighting and motor control, and other general-purpose ASIL D applications.
Gander raises $1.1 million to build search and rescue robots April 17, 2026 Current rescue protocols depend on human reaction time, visual searches and manual deployment of rescue swimmers, a process measured in minutes or hours when every second counts. Gander Robotics’ Autonomous Rescue Swimmer (ARS) is designed to change that equation.
SCREEN’s semiconductor R&D hub opens in New York April 17, 2026 Through this initiative, NY Creates and SCREEN Advanced Technology Center of America (ATCA) intend to connect high-tech organizations in the US and Japan to leverage their networks and drive innovation in SCREEN’s semiconductor R&D focus areas.
German startup Peak Quantum raises €2.2 million April 17, 2026 This brings the company’s total funding to more than EUR 5 million. The funds will be used to further develop the technology and to establish a European pilot production facility for superconducting quantum processors.
EU outlines plan to speed up defence innovation April 16, 2026 The European Commission has unveiled a new EUR 115 million funding instrument aimed at accelerating the development and deployment of disruptive defence technologies, with a strong focus on SMEs, start-ups and scale-ups across the EU.
ASE breaks ground on new Renwu facility to expand testing cluster in Kaohsiung April 16, 2026 Taiwan-based Advanced Semiconductor Engineering (ASE) has held a groundbreaking ceremony for a new facility in Renwu Industrial Park in Kaohsiung, Taiwan, aimed at establishing a semiconductor testing services cluster.
From selective soldering to inspection: how THT processes are evolving April 16, 2026 Through-hole technology (THT) has never disappeared from electronics manufacturing. But the way it is handled continues to shift — shaped less by the process itself and more by the conditions around it.
Meiko Electronics to set up PCB plant in Vietnam April 16, 2026 Japanese PCB manufacturer Meiko Electronics has decided to establish a new wholly owned subsidiary in Vietnam, aimed at expanding its PCB manufacturing capacity in the ASEAN region.
Eurofins to divest electronics testing unit for €575 million April 16, 2026 Eurofins Scientific SE has signed an agreement to sell its Electrical & Electronic Testing business, MET Labs, to UL Solutions Inc. for an enterprise value of EUR 575 million on a cash- and debt-free basis.
Hitachi Rail announces agreement to acquire Clever Devices April 16, 2026 Clever Devices’ portfolio of onboard and centralized data solutions will complement Hitachi Rail’s HMAX Mobility suite. HMAX Mobility is Hitachi Rail’s digital asset management platform that optimizes the performance of railways around the world.
First Evertiq Expo Zurich just around the corner – industry experts to take the stage April 15, 2026 On April 23, Zurich will host the inaugural edition of Evertiq Expo Zurich, bringing together industry professionals for a day that moves between technology, manufacturing and market realities — often without clear boundaries between them.
How chips competence centres could change semiconductor hiring in Europe April 15, 2026 Europe is investing heavily in semiconductors. New fabs are being planned, public funding is flowing, Chips Act 2.0 is on its way and long-term initiatives are taking shape. But there’s a more basic question that doesn’t seem to get asked enough: Even if all of this gets built, who is going to run it?
A+B Electronic expands SMD capacity with second Fuji line April 15, 2026 Assmy & Böttger Electronic GmbH has completed a comprehensive modernisation of its SMD production, adding a second placement line from Fuji Europe Corporation GmbH to increase capacity and introduce redundancy.
Hanwha partners with Indra to boost defence cooperation April 15, 2026 The two companies will promote a combined solution for Chile’s armoured vehicle program. Hanwha Aerospace will supply armoured vehicle platforms while Indra Group will provide Mission System Equipment and serve as regional coordination lead.
Panasonic Electric Works transfers power tools business to Makita April 15, 2026 The transaction will be executed through a company split whereby the business will be transferred to the successor company, followed by the transfer of all issued shares of the successor company to the acquirer.
From rigidity to agility: modular robotics gains ground in EMS manufacturing April 14, 2026 Electronics manufacturers operating in high-mix, low-volume (HMLV) environments need more flexible automation to remain competitive, according to Piotr Owczarek of Fideltronik, Fitech and AIRob. Speaking at the Evertiq Expo Tampere 2026, he outlined how modular robotics and AI-driven systems can address the limitations of traditional automation.
Rapidus opens new Analysis Centre and Rapidus Chiplet Solutions April 14, 2026 Japanese semiconductor manufacturer Rapidus has opened a new Analysis Centre and launched its Rapidus Chiplet Solutions (RCS), expanding its development infrastructure ahead of planned advanced semiconductor production in fiscal 2027.
Electronics under pressure: how real-world conflict is reshaping design assumptions April 14, 2026 For years, defence electronics followed a relatively stable logic. Systems were designed against defined threat models, tested in controlled environments, certified, and then deployed with the expectation that they would remain valid over time.
YMTC plans new fabs to boost capacity amid rising US-China tensions April 14, 2026 Chinese memory chipmaker Yangtze Memory Technologies (YMTC) is planning to build two additional plants alongside a facility nearing completion, in a move that would more than double its production capacity, according to a Reuters report citing sources familiar with the matter.
Cicor sees strong Aerospace & Defence demand, expects organic recovery in 2026 April 14, 2026 Swiss EMS provider Cicor reported solid order intake in the first quarter of 2026, supported by continued strength in the Aerospace & Defence (A&D) segment and new customer wins.
Toshiba begins sampling of 30-34 TB SMR nearline HDDs April 14, 2026 M12 Series HDDs leverage Toshiba’s proprietary design and analysis technologies cultivated through the development of slimmer and more compact components. The new M12 is the first glass substrate nearline HDD for Toshiba.
Japan approves extra $4 billion for chipmaker Rapidus April 13, 2026 Established in 2022, Rapidus has secured funding from both the public and private sectors. It is aiming to mass-produce cutting-edge chips using 2-nanometer technology by 2027.
Agile closes acquisition of thyssenkrupp Automation Engineering April 13, 2026 thyssenkrupp Automation Engineering will continue as Krause Automation as part of Agile Robots. The acquisition combines Agile’s AI-powered automation solutions with the engineering and implementation expertise of Krause Automation.
Ampere partners with Basquevolt to advance battery technology April 13, 2026 The Joint Development Agreement (JDA) aims to fast-track lithium metal-based battery technology for Pre-A Sample EV requirements.
TDK, Nippon Chemical Industrial establish joint venture April 13, 2026 The joint venture will focus on the development of ceramic materials primarily for MLCCs, other electronic component materials, and their manufacturing processes.
SiFive raises $400M to accelerate RISC-V data center solutions April 13, 2026 This financing will enable the California-based semiconductor company to accelerate the development of its next generation data center solutions and expand its global engineering teams to meet the needs of agentic AI workloads.
UgoWork’s batteries to be integrated with KION equipment April 13, 2026 This approval allows Linde customers to integrate UgoWork’s UL-listed energy solutions alongside KION’s existing battery offering, giving its customers flexibility in choosing the forklift power system.
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