AI server shipments forecast raised to 31% YoY in 2026 August 05, 2026 TrendForce estimates that the combined 2026 CapEx of Google, Amazon, Meta, Microsoft, Oracle, ByteDance, Tencent, Alibaba, and Baidu will exceed USD 886.7 billion, with the five North American hyperscalers accounting for nearly 90%.
Renesas Gen 3 MRDIMM chipset solutions advance performance August 05, 2026 Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.
Syensqo signs multi-year supply agreement with Airbus August 05, 2026 Under the contract, Syensqo will continue to supply a broad range of advanced materials from its portfolio including prepregs, RTM resins, adhesives, and primers to support Airbus programs across commercial aircraft, space & defense, and helicopter platforms.
Base Power raises $1 billion, launches home battery August 05, 2026 The Austin, Texas-based startup has raised over USD 2.5 billion capital to date. The fresh funds will go toward bringing the new battery, Base Core, to more homes, expanding nationally and hiring talent.
ChargePoint, Mercedes-Benz partner to simplify fleet electrification August 05, 2026 The partnership provides Mercedes-Benz business customers in the UK and Germany with a fully integrated charging solution, from initial site planning through to installation, operation and ongoing service.
Northrop Grumman secures $3 billion in missile defence deals August 04, 2026 US Department of War signs framework agreements with Northrop Grumman to ramp production of PAC-3, THAAD components.
Reimagine Robotics goes public with robots that ‘learn on the job’ August 04, 2026 The company is developing intelligent robots that anyone can train and use. Instead of requiring specialist programmers whenever a task or production process changes, workers can show the robot what to do, watch it attempt the task and correct it on the spot.
Linde wins semiconductor supply deal, to invest $1 billion in US August 04, 2026 Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.
Dawn raises $25M to advance reusable space transportation August 03, 2026 This Series B funding will directly finance New Zealand-Dutch company Dawn Aerospace’s global rollout, scaling commercial and operational teams in the US and Europe to support its expanding international customer base.
ESCATEC expands advanced SMT capabilities in UK August 03, 2026 The investment will enhance production efficiency and flexibility while strengthening ESCATEC’s ability to support medical manufacturing programmes in the UK.
L&T secures deal with TenneT for 2 GW offshore wind projects August 03, 2026 As part of the programme, the consortium will continue the execution of two ongoing projects — IJmuiden Ver Alpha and Nederwiek 1 — in the Netherlands. In addition, the consortium will commence two new projects, Nederwiek 3 in the Netherlands and LanWin 5 in Germany.
SK Group, Nvidia expand partnership across AI factories, memory August 03, 2026 The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.
MIRTEC opens new Dallas Sales and Demo Center August 03, 2026 The Texas Demo Center will showcase MIRTEC’s advanced inspection portfolio, including 3D AOI and 3D SPI systems designed to help manufacturers improve quality, increase throughput, and enhance process control.
Incap reports 21% increase in half-yearly revenue August 03, 2026 In the January–June 2026 period, Incap reported revenue of EUR 130.2 million, an increase of 21.1% from last year. It reported revenue of EUR 74.2 million for the April–June 2026 quarter, a year-on-year increase of 34.1%.
Intel partners with Lens to boost advanced semiconductor packaging August 03, 2026 Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.
Siemens, Nvidia advance self-verifying agentic AI workflows July 31, 2026 The new capabilities build on Siemens’ recently introduced Fuse EDA AI Agent system and add new Nvidia AI technology to help long-running, domain scoped, AI agents reason, act and continuously validate decisions against deterministic, physics-based EDA engines.
TOP500 Supercomputer List: China Returns to the Top, Europe Holds Strong Position July 31, 2026 The latest edition of the TOP500 ranking of the world's most powerful supercomputers has brought a change at the top. China's LineShine has overtaken the United States' El Capitan, while the number of exascale systems has increased to five. Europe has maintained its position among the world's leading high-performance computing regions.
Marvell to invest $250 million in India, expand Bangalore facility July 31, 2026 The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications
AccelerComm powers Eclipse’s 5G physical layer for next-gen spacecraft July 31, 2026 Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.
Factorial, SK On to explore solid-state battery manufacturing July 31, 2026 Under the MOU, US-based company Factorial Energy and South Korea’s SK On will jointly evaluate the technical feasibility and manufacturing considerations for Factorial’s FEST solid-state battery technologies.
IonQ receives approval to complete $1.8B acquisition of SkyWater July 31, 2026 Following the close of the transaction, SkyWater will continue to serve a full range of customers as a US-based semiconductor foundry, operating as a wholly owned subsidiary of IonQ under the SkyWater name.
UMC reports 17% increase in YoY second quarter revenue July 30, 2026 Second quarter consolidated revenue was NT$68.73 billion, increasing 12.6% from NT$61.04 billion in 1Q26. UMC’s Board of Directors has approved a plan to expand cleanroom capacity at its Singapore P4 facility and to construct a new fab in Taiwan.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.
Confidee's answer to shortages: full transparency and the freedom to cancel orders July 30, 2026 As material shortages push lead times for advanced printed circuit boards towards 2028, four-year-old PCB supplier Confidee has built its strategy around the opposite of locking customers into rigid commitments: complete transparency and a clear policy allowing customers to cancel or rebalance production without damaging the relationship. That is according to board member Didrik Bech.
DigiKey adds Over 27,000 new parts to in-stock product lineup July 30, 2026 New supplier additions in Q2 include Neutrik Group, a global manufacturer of professional interconnect solutions; LumenRadio, which specializes in wireless control technology; and AMobile, which delivers industrial mobile computers.
Altus expands headquarters to showcase manufacturing capability July 30, 2026 The investment will enable Altus to install a complete inline manufacturing solution at the heart of its facility, allowing customers to see first-hand how a full production environment can be configured across SMT assembly, THT assembly, backend production and component management.
AI infrastructure boom reshapes electronics supply chain, says in4ma July 29, 2026 The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.
EU, India strengthen strategic partnership with third TTC July 29, 2026 The meeting reviewed progress under the Trade and Technology Council’s (TTC’s) three work strands: digital connectivity and strategic technologies; clean and green technologies; and trade, investment and resilient value chains.
India’s Sigma Advanced Systems acquires Bromford for $16M July 29, 2026 UK-based Bromford’s capabilities complement Sigma’s expertise in manufacturing larger components for the same OEM customers, giving the combined platform a deeper full-range product offering for global aerospace and power generation customers.
FR 4 base materials: shortages, price increasing and allocations July 29, 2026 Why PCB procurement strategies should be reviewed?
Mitsubishi Electric, Sony to advance vision sensor solutions July 29, 2026 The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.
Rethinking finance amid semiconductor supply chain uncertainties July 28, 2026 Companies are reassessing where they build, how much flexibility they need, which suppliers they depend on and where financial decisions are made.