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geralt_AI

August 07, 2026
The transaction marks TaoWeave’s first operating investment in AI and expands TaoWeave’s strategy beyond digital asset treasury activities into enterprise AI deployment, commercialization and recurring operating revenue.

EDA

August 07, 2026
Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.

Indie

August 07, 2026
Rashi will transfer its semiconductor business division into a wholly owned subsidiary headquartered in Bengaluru and step-down subsidiary headquartered in Singapore. Restar Corporation will subsequently acquire a 26% equity stake in the subsidiary.

Infineon-1

August 06, 2026
MediaTek has now qualified the Infineon 512 Mb Quad SPI NOR Flash, an automotive-grade NOR Flash memory solution, for use in its Dimensity Auto Cockpit platform C-X1.

August 06, 2026
Under the agreements, Samsung will receive access to US firm Netlist’s complete patent portfolio, including its server DIMM and High Bandwidth Memory technologies. Samsung will supply Netlist DRAM and NAND products, and the parties agree to settle and mutually release all pending legal actions.

pexels-handshake

August 06, 2026
Headquartered in New Jersey, Astrodyne is recognized for its engineering expertise and close collaboration with customers developing next-gen technologies across semiconductor manufacturing equipment, medical, defense and industrial applications.

NXTR

August 06, 2026
The company can handle large, heavy components measuring 200 x 200 mm and weighing 2.0 kg with the standard configurations of both its NXTR and AIMEXR pick and place machines.

Esri_MOU

August 05, 2026
The two companies seek to leverage opportunities in the defence sector by combining BEL’s domain expertise in defence electronics and systems integration with Esri’s geographic information system (GIS), location intelligence and GeoAI capabilities.

Gen3_MRDIMM

August 05, 2026
Renesas’ Gen 3 MRDIMM solutions deliver 25 percent higher memory bandwidth than its second-generation solutions, while continuing to use existing DDR5 infrastructure. As a result, server platforms can extract more performance without disruptive architectural changes.

Kawasaki-main-office

August 04, 2026
Through this MOU, Chunghwa Telecom, Fujitsu and 1Finity will further advance their existing All-Photonics Network (APN) initiatives and accelerate their collaboration to expand next-generation communication infrastructure in Taiwan.

Albuquerque-facility-2022

August 04, 2026
US Department of War signs framework agreements with Northrop Grumman to ramp production of PAC-3, THAAD components.

PCB-India_2

August 04, 2026
The 30-acre facility in Andhra Pradesh will have an annual production capacity of 96 million chips and serve high-growth sectors such as AI, high-performance computing, data centres and high-speed communications.

CATL_partnership

August 04, 2026
This initiative enables Alfen to diversify its battery material portfolio, optimise the cost structure of its energy storage products and strengthen resilience against lithium price volatility.

Aerospace_spaceplane

August 03, 2026
This Series B funding will directly finance New Zealand-Dutch company Dawn Aerospace’s global rollout, scaling commercial and operational teams in the US and Europe to support its expanding international customer base.

sign

August 03, 2026
The planned USD 500 billion comprehensive partnership aims to accelerate large-scale AI infrastructure development, including sovereign, physical, agentic and enterprise AI services and jointly address the increasing AI demand across Asia-Pacific.

Dallas_Center

August 03, 2026
The Texas Demo Center will showcase MIRTEC’s advanced inspection portfolio, including 3D AOI and 3D SPI systems designed to help manufacturers improve quality, increase throughput, and enhance process control.

glass_substrate

August 03, 2026
Intel and Lens will leverage their respective strengths in advanced semiconductor packaging, precision manufacturing, glass substrate R&D, and process innovation to support the growing demands of AI, data center, and specialized computing applications.

July 31, 2026
The expanded footprint is expected to strengthen the US company’s global innovation network, supporting the design and development of advanced semiconductor solutions for AI, cloud and data infrastructure applications

li-battery_1

July 31, 2026
Under the MOU, US-based company Factorial Energy and South Korea’s SK On will jointly evaluate the technical feasibility and manufacturing considerations for Factorial’s FEST solid-state battery technologies.

Indie

July 30, 2026
The collaboration brings together Eros Innovation’s expertise in sovereign AI, multimodal foundation models, cultural intelligence, healthcare AI and digital platforms with Thakers’ expertise in chip design, embedded systems, aerospace and space technologies.

tes_logo

July 30, 2026
The initiative brings together SK tes, the Singapore Economic Development Board (EDB), and local automation specialist Aubotic Technology Pte Ltd to co‑develop advanced robotic solutions for e‑waste processing.

new-technologies_2

July 29, 2026
The unprecedented wave of investment in artificial intelligence infrastructure is transforming the global electronics supply chain, with growing consequences for PCB manufacturers, material suppliers and OEMs worldwide. According to new research from in4ma and EMSNOW, demand generated by hyperscale data centre operators is driving up PCB prices, stretching lead times and redirecting manufacturing capacity towards AI applications.

Henna-Virkkunen

July 29, 2026
The meeting reviewed progress under the Trade and Technology Council’s (TTC’s) three work strands: digital connectivity and strategic technologies; clean and green technologies; and trade, investment and resilient value chains.

sign

July 29, 2026
Together, Silvaco’s physics-based simulation portfolio and Nvidia accelerated computing and AI will help customers design, simulate and optimize increasingly complex semiconductor technologies.

signing-the-contract_2

July 29, 2026
The two companies will establish a joint venture that will help integrate Sony’s image sensors and edge AI technologies with Mitsubishi Electric’s expertise in FA control systems.

building_logo

July 28, 2026
On the memory front, Samsung and Broadcom plan to pursue a strategic collaboration for the supply of industry-leading memory solutions, including HBM, supporting Broadcom’s next-generation AI accelerators.

Playground_Global_MOU

July 28, 2026
The collaboration aims to strengthen the pathway from laboratory innovation to global commercial impact by combining Playground’s expertise in building and scaling frontier technology companies with the CEA’s scientific research and technology-transfer capabilities.

sign-on-building

July 24, 2026
Nvidia and Amkor Technology will align their long-term roadmaps to advance technologies including high-density interconnects and next-generation heterogeneous integration.

of_Arizona

July 24, 2026
The University of Arizona and the Eindhoven University of Technology in the Netherlands have signed a five-year MOU to align education and research activities with the needs of a rapidly growing semiconductor sector.

link_planner

July 24, 2026
The platform allows users to plan deployments of Taara Lightbridge, the company’s wireless optical communications technology, which uses narrow, invisible beams of light to deliver high-capacity connectivity through the air between two fixed and easily deployable terminals.

SES_Line

July 23, 2026
Supplied by Equip Tech and manufactured by Universal Circuit Board Equipment (UCE), the SES line incorporates automated chemical management, conveyorized material handling, and integrated process controls throughout the strip, etch and strip (SES) cycle.

Phil-Stoten-2

July 22, 2026
In late June I spent a full day in Brussels, moderating a room full of speakers, panelists, policymakers and manufacturers, all there to talk about the future of European electronics. By the end of it, one thing was obvious. Everyone in that room agreed the industry matters. Almost nobody disagreed about the stakes. And yet agreement is not the same as alignment, and the gap between "we support you" and "here is what we will actually do" is exactly where good intentions tend to disappear.

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