Valens to collaborate with onsemi on cost-optimized integrated sensor
Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies.
Valens Semiconductor, an Israeli provider of high-performance connectivity chipsets, has announced a collaboration with US-based semiconductor company onsemi on a cost-optimized integrated sensor for high-volume 3-megapixel automotive camera applications. Through this collaboration the parties intend to give OEMs and Tier 1s a faster path to A-PHY.
Under the agreement, Valens will work with onsemi on the cost-optimized A-PHY offering that can be integrated into onsemi’s image sensors. The collaboration strengthens the A-PHY ecosystem by bringing together complementary expertise in connectivity and automotive imaging technologies, according to a press release.
“This is a major milestone for Valens, MIPI A-PHY and for the automotive ecosystem as a whole,” said Yoram Salinger, CEO at Valens Semiconductor. “The integrated, cost-optimized 3MP offering complements Valens' existing solutions, bringing A-PHY to a much broader range of use cases. Just as importantly, by collaborating with onsemi, another major supplier of A-PHY silicon, we are strengthening the ecosystem and giving automakers the supplier choice they expect from an industry standard.”
“The level of interest we’re seeing from OEM customers and partners makes clear that MIPI A-PHY represents a significant business opportunity,” said Ahmed Salem, Vice President & General Manager of the Intelligent Sensing Group at onsemi. “Through our collaboration with Valens, we’re helping enable a more streamlined camera architecture that reduces component count, supports industry standards, and ultimately makes advanced vision systems easier to deploy.”



