Evertiq - First In Electronics News & Expo

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power_modules

March 30, 2026
The UCC34141-Q1 and UCC33420 isolated power modules leverage Texas Instruments’s IsoShield technology, a multichip packaging solution that achieves up to three times higher power density than discrete solutions in isolated power designs.

AMD_MOU

March 30, 2026
The companies will collaborate on HBM4 supply for AMD Instinct MI455X GPUs and next-generation DDR5 solutions for AMD EPYC processors and the AMD Helios platform.

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Micron-factory

March 27, 2026
Taiwan’s semiconductor industry is often discussed in terms of scale, complexity, and technological leadership. Less often, we get a closer look at how these facilities actually operate from the inside.

PCB-India_3

March 27, 2026
Kaynes Semicon aims to create state-of-the-art semiconductor backend manufacturing capabilities and enable the next phase of innovation from India.

Expo-TMP26-02

March 27, 2026
Evertiq Expo returned to Tampere on March 26, 2026, bringing together the electronics industry at Tampere Hall in Finland’s third-largest city. This year’s event attracted 297 visitors from 202 companies, alongside 79 exhibiting companies — setting a new attendance record and highlighting continued engagement across the regional electronics ecosystem.

Liquide_semiconductors

March 27, 2026
In December, Claus Aasholm, an analyst at Semiconductor Business Intelligence, raised an uncomfortable question in Evertiq: does the traditional semiconductor cycle still exist? His argument was straightforward — AI-driven growth is pulling the market into parallel trajectories that are increasingly difficult to reconcile within a single top-line number.

Herzogenrath-2

March 27, 2026
The German company plans to manufacture some of its 100/150/200 mm products in the new plant in the Penang region, mostly to address customers in Asia. The facility will include assembly and test, engineering support and local purchasing capabilities.

Kawasaki-main-office

March 27, 2026
By combining ver. 3 of the STAR architecture with a molecular model optimization technique, researchers have reduced computational resource requirements.

axonite_chip

March 27, 2026
The US-based company builds AI for the semiconductor industry and is developing a new class of computing hardware, using its software to design its own hardware IP.

RRP_MOU

March 26, 2026
The MoU brings together BEL’s experience in developing advanced electronics and mission-critical systems for defence applications, RRP Electronics’s semiconductor manufacturing expertise, and RRP Defense’s capabilities in EO systems & UAV platforms.

Liquide_plant_Taiwan

March 26, 2026
The French company’s new advanced materials manufacturing facility in Taichung City, Taiwan, will produce highly-engineered molecules designed for nano-scale processes, such as Atomic Layer Deposition (ALD).

building

March 26, 2026
Israeli foundry Tower Semiconductor and Nuvoton Technology Corporation Japan will enter into mutual long-term supply agreements, ensuring continued support for existing customers of both companies.

March 25, 2026
The South Korean tech giant is ramping up investment 22% in 2026 to retake the lead in AI semiconductors from SK Hynix, which has become the main provider of high-bandwidth memory to Nvidia.

building-title

March 25, 2026
VIGO Photonics has completed the acquisition of assets from US-based InfraRed Associates. The USD 8.4 million transaction is expected to strengthen the Polish company’s position in the infrared detector market and accelerate its international expansion, particularly in the United States.

STM32_microcontroller

March 25, 2026
Through a collaboration with domestic ⁠producer Huahong, STMicroelectronics has a dual supply chain, with fully processed and manufactured 40nm MCU products in China that are exact same design and technology as those made outside China.

Akiem_locomotive

March 25, 2026
The locomotives can operate both under overhead line power and on non-electrified sections using traction batteries. Siemens Mobility will deliver the first locomotives from 2029/2030.

building_logo

March 25, 2026
The agreement with NSIG subsidiaries Simgui and Simwings extends the existing licensing framework underpinning their longstanding partnership, with no new technology transfer and a joint commitment to strengthen Soitec’s SOI intellectual property rights in China.

Expo-TMP-2025-003

March 24, 2026
Evertiq Expo Tampere returns on 26 March 2026, bringing together Finland’s electronics community for a day focused on semiconductor reliability, advanced manufacturing, automation strategies, and the evolving business landscape of the European EMS industry.

Headquarters-MRS-Electronic-in-Rottweil

March 24, 2026
Würth Elektronik ICS has signed an agreement to acquire 100% of the shares in MRS Holding GmbH, the parent company of MRS Electronic, in a move aimed at strengthening its position in vehicle electronics.

sign-on-building

March 24, 2026
Under the partnership, Infineon will provide its advanced wide-bandgap (WBG) power semiconductors, including silicon carbide (SiC) technology, along with application engineering support for system-level integration.

Alif_partnership

March 23, 2026
Brilliant Labs’ Halo Glasses will be powered by Alif Semiconductor’s Balletto B1 MCU, an ultra-low-power microcontroller with a dedicated Neural Processing Unit (NPU) that enables on-device AI processing.

Fuse_EDA

March 23, 2026
Supporting NVIDIA Agent Toolkit, advanced Nemotron models and NVIDIA AI infrastructure, the Fuse EDA AI Agent manages workflows across Siemens’ comprehensive EDA portfolio.

building_logo

March 20, 2026
Under the agreement, Soitec will provide POI wafers for Skyworks’ Sky5 platform to address RF requirements of today’s 5G smartphones. Soitec POI provides the performance necessary for seamless advanced coexistence in dense signal environments.

Houston-production

March 20, 2026
With advanced semiconductor manufacturing still heavily concentrated in Taiwan, geopolitical tensions are forcing companies like Apple to reassess their supply chain strategies. The question is no longer if diversification is needed, but how quickly it can be achieved.

Electronics_Jason_Yuan

March 20, 2026
The key leadership appointments across Southeast Asia and Oceania include Jason Yuan, President, SEA & ANZ; David Leal, Vice-President of Solution Business (Infrastructure), SEA & ANZ; and Lili Mow, Vice-President of Solution Business (Automation), SEA & ANZ.

Chamber_MOU

March 20, 2026
The MoU provides a collaborative framework aimed at fostering economic ties, enabling business growth, supporting joint initiatives, and reinforcing existing connections that contribute to the competitiveness and sustainability of the semiconductor ecosystem.

new-thailand-facility-2026

March 19, 2026
US semiconductor company Analog Devices has opened a new manufacturing facility in Thailand aimed at expanding its production and test capacity and strengthening supply chain resilience.

25-years-012

March 19, 2026
On May 21, 2026, Evertiq Expo makes its long-awaited return to Lund, reconnecting with the city where it all began. Now in its 15th year, Evertiq Expo will be held at Sparbanken Skåne Arena, bringing together companies, researchers, and professionals from Sweden’s electronics and technology sectors.

Old-dustry-electronics

March 18, 2026
When engineers talk about component obsolescence, the conversation usually starts with the same event: the end-of-life notice.

March 18, 2026
Unionised workers at Samsung Electronics in South Korea have voted to authorise a strike, escalating a dispute over bonuses and raising concerns about potential disruption to global semiconductor supply, according to Reuters.

groundbreaking-Dresden-expansion-2026

March 18, 2026
GlobalFoundries has started construction of its planned semiconductor fab expansion in Dresden, Germany, marking the next phase of its EUR 1.1 billion investment under Project SPRINT, according to a company update on LinkedIn.

March 18, 2026
The plant was formerly developed for a joint venture between LG and General Motors before the automaker sold its stake to LG. The facility is expected to be launched in 2027.

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