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New-Manufacturing-Facility-Malaysia

May 22, 2025
Dutch EMS provider Neways Electronics has inaugurated a new manufacturing facility in Selangor, Malaysia, marking the company’s first production site in Southeast Asia.

EPIC-center

April 15, 2025
Applied Materials has purchased 9% of the outstanding shares of the common stock of BE Semiconductor Industries N.V. (Besi), a Netherlands-based manufacturer of semiconductor assembly equipment.

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pexels-van-long-bui-1496562-5932468

July 22, 2024
Netherlands-headquartered BE Semiconductor Industries has confirmed it will plough more funds into its microchip packaging and testing plant in Saigon High-Tech Park.

facility-production-lines

October 20, 2022
The Silicon Valley-based provider of advanced design, packaging and microelectronics assembly services, has completed the first phase of its plan to expand its die bonding services.

datacon-2000-evo

February 18, 2022
The manufacturer of assembly equipment for the semiconductor industry saw it 2021 revenue, orders and net income increase 72.8%, 98.9% and 113.5%, respectively.

businessmen-handshaking

October 23, 2020
Applied Materials and BE Semiconductor Industries (Besi) says they aim to develop the industry’s first complete and proven equipment solution for die-based hybrid bonding, an emerging chip-to-chip interconnect technology that enables heterogeneous chip and subsystem designs for applications including high-performance computing, AI and 5G.

piggy-bank

May 04, 2020
BE Semiconductor (Besi), managed to maintain profitability during these uncertain times, thanks to the company’s flexible Asian supply chain and assembly capacity, Besi were able to shift production and final assembly sufficiently between its Malaysian, Chinese and Singapore facilities.

talent-acquisition-recruitment-concept

February 28, 2017
Scanditron has appointed Viljar Kovaljov as Sales Manager for the Baltic region.

components-on-board-l

January 29, 2014
Nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

November 02, 2011
Netherlands based Besi has announced plans to reduce its personnel costs over the next 12 months by € 8.5 million on an annual basis -by reducing approximately 12% of their worldwide workforce of 1,775.

scott-rushia

March 08, 2010
Martin, a Finetech company, has appointed Scott Rushia as Sales Manager for the U.S., Canada and Mexico. In his new role, Mr Rushia is responsible for sales and service for Martin’s rework and dispensing products.

FR-production

January 26, 2009
In parallel with the sale to BESI, ongoing reorganization measures at Oerlikon Esec will be continued and extended.

FR-wafer-processin

January 26, 2009
Oerlikon signed an agreement to sell the Esec Business Unit to the Dutch company BE Semiconductor Industries NV. In a separate transaction, Oerlikon expects to agree a management buyout of the Etch business from Oerlikon Systems.

December 18, 2007
BE Semiconductor Industries N.V. (Besi) has appointed Michael Auer as Vice President of its new “BESI Sales and Customer Support” division created as part of the company’s reorganization.

besi-line

April 20, 2006
BE Semiconductor Industries N.V reports net sales for the first quarter of 2006 were € 44.5 million, representing an increase of 21.6% as compared to net sales of € 36.6 million in the first quarter of 2005 and a decrease of 6.5% as compared to net sales of € 47.6 million in the fourth quarter of 2005.

November 15, 2004
BE Semiconductor Industries announces acquisition of Datacon AG. BE Semiconductor says acquisition of Flip Chip and Multichip Die Bonding equipment company major step in advancing Besi’s assembly equipment strategy.

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