Evertiq - First In Electronics News & Expo

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signing-the-contract_2

October 06, 2026
Altera Corporation and Rutronik have signed a strategic distribution agreement to expand access to Altera’s FPGA portfolio across the European market, the companies announced in a press release.

pexels-handshake

October 05, 2026
Investment firm Carlyle has agreed to acquire Nidec Components, a Japanese manufacturer of sensors, switches and encoders, from its parent company Nidec Corporation. The divestment is part of Nidec's planned portfolio rationalisation.

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October 05, 2026
The collaboration will combine Sony’s sensing and AI technologies with Aramco’s industrial data, operational experience, established infrastructure and portfolio of real-world industrial use cases.

pcb

October 01, 2026
North American PCB shipments rose 23.5% YoY in August, extending this year's growth. New bookings, however, fell sharply after a strong July.

PCB-India_3

October 01, 2026
Under this partnership, Sojitz Corporation and NRS CORPORATION will explore and validate a supply chain management framework in support of the development of a robust semiconductor materials ecosystem for Tata Electronics’ Fab in Dholera, Gujarat.

AST-JV-facility

September 30, 2026
Advanced Substrate Technologies (AST), a joint venture between TOPPAN and Broadcom, has opened Singapore's first facility for high-end FC-BGA substrates. The plant comes online as substrate capacity remains a bottleneck for AI and networking chips.

Discussion-Krakow-2026

September 29, 2026
In modern electronics, reliability is no longer solely a characteristic of an individual component. In defense systems, automation, robotics and transportation, the success of a project depends on an entire chain of interdependencies: from accurately defining operating conditions, through the selection of materials and technologies, to component availability, manufacturing capabilities and product lifecycle management.

fab_Singapore

September 28, 2026
VisionPower Semiconductor Manufacturing Company (VSMC) is a joint venture established by Vanguard International Semiconductor Corporation and NXP Semiconductors. Following 22 months of construction, the fab successfully processed its first sample lot.

CSBC_agreement

September 28, 2026
US-based Havoc and CSBC will work toward pairing CSBC’s shipbuilding and production capabilities with Havoc’s collaborative autonomy technology, integrating Havoc’s autonomy software onto CSBC-built platforms produced and sustained in Taiwan.

fuel_cell

September 28, 2026
Through this collaboration, Hitachi will accelerate the deployment of on-site power solutions for data centers and industrial facilities by combining its control and system integration capabilities with Bloom Energy's fuel cell technology.

IC_Leadership_Team

September 28, 2026
In combination with mainstream CMOS semiconductor technology, the TUSK IC solution brings scalable, affordable connectivity to the next generation of LEO and MEO (Low & Medium Earth Orbit) satellite constellations.

Bittium-Headquarters-Oulu-Finland

September 25, 2026
Bittium is a supplier of resilient tactical communications systems, secure mobile communications and software-defined radio technology. The companies will explore how their capabilities can be combined to meet the communications needs of the French armed forces.

quantum-technologies-1

September 23, 2026
The federal funding deployed through the CHIPS and Science Act supports R&D and US quantum semiconductor manufacturing capabilities needed to deploy large-scale, fault-tolerant trapped-ion quantum computers.

products

September 22, 2026
The global DRAM module market generated USD 21.2 billion in revenue in 2025, up 59% YoY, according to TrendForce — a sharp acceleration from the 7% growth recorded in 2024.

Space_rocket

September 21, 2026
The financing advances the development of Stoke’s core reuse technologies, alongside manufacturing, test, launch and recovery infrastructure to support high-cadence operations. Stoke’s Nova Pathfinder vehicle is approaching its first flight.

TOP100

September 18, 2026
When Mareike Haass took to the stage at Evertiq Expo in Gothenburg on September 17, she presented what in4ma describes as the first complete ranking of Europe's 100 largest EMS companies, built on data sourced directly from national company registers and the companies themselves. The full list is now available.

Materials_research

September 18, 2026
The investment will be deployed towards deepening R&D in India, expanding the domestic semiconductor supply chain and developing future talent. The US company also plans to establish a 140-acre advanced semiconductor research park in India.

Minnesota-facility

September 18, 2026
Under the agreement, Qolab will serve as a lead customer on SkyWater’s newly launched SC250 superconducting platform to advance its Quantum System-in-Package (QSiP). QSiP architecture is designed to address cost, complexity and form-factor challenges in scaling quantum systems.

UHV_transformer

September 18, 2026
The ultra-high-voltage (UHV) transformers will be deployed at newly built AI data centers in the northern and southern regions of the US. They consist of 765kV UHV transformers worth USD 163 million and 345kV UHV transformers worth USD 124 million.

MHI_MOU

September 17, 2026
The two Japanese companies will contribute to the strengthening and transformation of defense capabilities by providing high-value-added and highly reliable products and services for the development of new command and control systems.

office

September 16, 2026
Aimtron is increasingly focusing on opportunities where electronics manufacturing is accompanied by deeper engineering involvement, higher product complexity and stringent quality requirements.

September 16, 2026
Through this investment, Mitsubishi Electric expects to gain early insights into the company’s optical quantum computer hardware development technologies, related components, customers and market trends.

Indie

September 15, 2026
The Bengaluru office will serve as a local hub for customer engagement, applications support, training, and strategic partnerships, and will strengthen Teradyne’s ability to support India’s expanding base of chipmakers and electronics manufacturers.

modern-factory-with-robots_1

September 15, 2026
By incorporating Power Motion’s product offering, systems integration capabilities, and technical experience, Tavoron further enhances its ability to serve OEMs, manufacturers, and industrial facilities seeking modernized, efficient production systems.

Flagship-Building-Yokohama-Technology-Campus

September 15, 2026
The Tokyo-based memory-storage maker has been speaking with lenders such as Bank of America, Goldman Sachs Group and JPMorgan Chase on an offering that could take place in 2027, Bloomberg reports.

ELECTRIC_Utah

September 15, 2026
Under this contract, the South Korean company will supply a full set of key distribution systems for the power infrastructure construction project of a hyperscale data center being developed in Wyoming by Bloom Energy for a local energy infrastructure firm.

building_logo

September 11, 2026
The partnership brings together Sure-Seal Connections’ proven sealed connector technology with Wesgarde’s market expertise and established customer relationships.

shipbuilding

September 07, 2026
The signed agreements are designed to accelerate the development and deployment of advanced physical AI automation across US Navy shipbuilding programs, including aircraft carriers, submarines, destroyers, amphibious ships, future frigates and unmanned surface vessels.

headquarters

September 07, 2026
Manz Asia contributes inkjet capabilities, manufacturing engineering expertise and a strong position in the panel-level packaging ecosystem. German manufacturer SUSS brings semiconductor process expertise and global customer reach.

Indiana

August 31, 2026
The investment — the largest the company has made in the United States — modernized advanced manufacturing across the Indianapolis campus and added full engine-test capability, including new ground test facilities, and an altitude test facility in West Lafayette.

Qcells

August 31, 2026
Rather than simply adding electricity demand to the grid, the proposed approach would develop new generation and flexible energy resources alongside Microsoft’s expanding data center footprint, helping support grid reliability while enabling future AI growth.

Indiana_groundbreaking

August 28, 2026
The Indiana fab is scheduled to open its cleanroom by October 2028 and initiate mass production of next-generation HBM in the second half of 2029. SK hynix also signed an MOU with Purdue University for research and development collaboration in advanced packaging.

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