Scanfil automates electronics testing at German plant August 27, 2026 Finnish EMS provider Scanfil has implemented a fully automated test cell at its Wutha production site in Germany. The solution combines robotics and process control to automate the testing and sorting of electronic assemblies.
Renesas sets up physical AI & robotics lab in Beijing August 27, 2026 Japanese electronics company Renesas has opened a new Physical AI & Robotics Lab in Beijing, China, aimed at supporting the development, demonstration and validation of next-generation robotic systems.
Navitas Semiconductor to acquire Claros for $233 million August 27, 2026 Navitas’ potential acquisition of Claros would extend the company’s AI infrastructure portfolio from the grid all the way to the xPU by bringing industry-leading VPD and IVR capabilities that can directly power the high-current, high-speed processors at the heart of modern AI systems.
Donut Lab acquires nanotechnology company Nordic Nano Group August 25, 2026 Finnish technology company Donut Lab has acquired nanomaterials company Nordic Nano Group, with the entire team transferring to Donut Lab. The acquisition brings together both companies' intellectual property, technology and staff under one roof.
LG begins mass production of 5G smart telematics solution August 25, 2026 The smart telematics solution integrates the communications module and multiple antennas into a single unit. LG Electronics has already commenced deliveries to a European automaker, marking the solution’s first deployment in a production vehicle in Europe.
Infineon acquires Bangalore-based C2i Semiconductors August 24, 2026 Infineon Technologies has announced the acquisition of C2i Semiconductors, a Bangalore-based company specialising in software-defined multiphase controllers and smart power stages for AI data centre applications. The transaction is expected to close in Q3 2026.
Safran, Aura Aero expand partnership to develop turbogenerators August 24, 2026 The ERA’s (Electric Regional Aircraft) propulsion architecture will consist of eight electric propulsion units powered by two TG600 turbogenerators, each capable of supplying 600 kW of electricity.
Fujifilm completes new production facility in Oita August 24, 2026 This investment will significantly expand production capacity for post-CMP cleaners used in the manufacturing of advanced semiconductors, including those for AI applications, for which demand is growing rapidly.
BEL collaborates with Ananth on advanced electronic systems August 21, 2026 The partnership will focus on indigenous design and development, system engineering, electronics manufacturing, integration, testing and production for current and future programmes of strategic importance.
LG Electronics accelerates robotics collaboration with Nvidia August 21, 2026 Data collected across various environments such as LG’s Data Factory and LG CNS’s logistics automation solutions will be linked with Nvidia’s robotics stack, where it is augmented and synthesized into high-quality data for robot learning.
CACI opens defence electronics manufacturing facility in Rochester, New York August 19, 2026 CACI International has opened a 61,000-square-foot Manufacturing Centre of Excellence for Defence Electronics in the Greater Rochester area in New York, in the United States. The facility increases CACI's manufacturing space by more than 300% and will serve as the primary production hub for the company's electronic warfare technologies.
Airbus Helicopters and Terma deepen partnership on Danish defence August 19, 2026 Danish defence technology company Terma and Airbus Helicopters have signed a memorandum of understanding to expand their industrial partnership. The agreement covers advanced manufacturing, electronic warfare system integration, research and development, and maintenance, repair and overhaul services.
TTM Technologies acquires Epiq Solutions for $1.1 billion August 18, 2026 TTM Technologies has entered into a definitive agreement to acquire Epiq Design Solutions, a provider of software-defined radios, high-performance RF products and space compute solutions for defence and signals intelligence applications. The all-cash purchase price is USD 1.1 billion.
Mitsubishi Electric to wholly acquire Poland-based Medcom August 17, 2026 Medcom designs, manufactures, sells and maintains electrical equipment for railcars and electric urban transportation, including auxiliary power supply systems, propulsion control systems and industrial power electronics equipment. Its primary business is in Europe.
BAE Systems, TUALCOM to collaborate on autonomous technologies August 14, 2026 The agreement between BAE Systems and TUALCOM establishes a strategic framework for both organisations to investigate opportunities to integrate advanced communications, resilient navigation and electronic warfare technologies into future autonomous platforms.
Infineon partners with LS Electric to advance DC power solutions August 13, 2026 The collaboration will focus on key DC infrastructure areas, including power conversion systems for energy storage systems, solid-state transformers (SSTs) and solid-state circuit breakers (SSCBs).
BorgWarner secures extension of inverter programs with European OEM August 11, 2026 For plug-in hybrid applications, BorgWarner will supply an updated high-voltage inverter design featuring the company’s proprietary Application-Specific Integrated Circuit (ASIC) technology, which is fully compatible with the customer’s new vehicle operating system.
Omega Holdings acquires automotive aftermarket business of Wells August 10, 2026 The acquisition expands Omega Holdings’ capabilities in the vehicle electronics category. Following the transaction, the acquired aftermarket business will continue to operate as a standalone business under the Omega Holdings group.
Siemens to acquire EDA software firm Precision Innovations August 07, 2026 Acquisition expands Siemens’ electronic design automation (EDA) portfolio with AI-powered, shift-left chip planning capabilities to support faster design exploration for advanced system-on-a-chip (SoC) architectures.
BEL, Esri sign MoU to advance GIS, location intelligence in India August 05, 2026 The two companies seek to leverage opportunities in the defence sector by combining BEL’s domain expertise in defence electronics and systems integration with Esri’s geographic information system (GIS), location intelligence and GeoAI capabilities.
Linde wins semiconductor supply deal, to invest $1 billion in US August 04, 2026 Under the agreement, Linde will build, own and operate two new SPECTRA air separation units (ASUs) and associated infrastructure in Phoenix, Arizona.
Understanding semiconductor datecodes in long-lifecycle electronics August 04, 2026 The electronics industry has spent years learning to fear shortages, counterfeit components and end-of-life notices. But according to Ronny Nietzsche, Regional Sales Manager Nordic-Baltic Region at Rochester Electronics, another issue may be quietly shaping purchasing decisions — an outdated understanding of semiconductor date codes.
ESCATEC expands advanced SMT capabilities in UK August 03, 2026 The investment will enhance production efficiency and flexibility while strengthening ESCATEC’s ability to support medical manufacturing programmes in the UK.
MIRTEC opens new Dallas Sales and Demo Center August 03, 2026 The Texas Demo Center will showcase MIRTEC’s advanced inspection portfolio, including 3D AOI and 3D SPI systems designed to help manufacturers improve quality, increase throughput, and enhance process control.
Waldom appoints Jim Kaplan to Advisory Board July 31, 2026 Kaplan, former President and CEO of Cornell Dubilier Electronics, brings nearly four decades of leadership experience in the electronic components industry.
AccelerComm powers Eclipse’s 5G physical layer for next-gen spacecraft July 31, 2026 Across the two successive engagements, UK-based AccelerComm supported Eclipse in defining the physical-layer architecture for its next-generation spacecraft, spanning both its direct-to-device and broadband payload families.
Worldwide silicon wafer shipments increase 7.4% in Q2 2026 July 30, 2026 SEMI Silicon Manufacturers Group (SMG) has reported that worldwide silicon wafer shipments increased 7.4% year-on-year to 3,573 million square inches (MSI) from the 3,327 MSI recorded during the same quarter of 2025.
Confidee's answer to shortages: full transparency and the freedom to cancel orders July 30, 2026 As material shortages push lead times for advanced printed circuit boards towards 2028, four-year-old PCB supplier Confidee has built its strategy around the opposite of locking customers into rigid commitments: complete transparency and a clear policy allowing customers to cancel or rebalance production without damaging the relationship. That is according to board member Didrik Bech.
DigiKey adds Over 27,000 new parts to in-stock product lineup July 30, 2026 New supplier additions in Q2 include Neutrik Group, a global manufacturer of professional interconnect solutions; LumenRadio, which specializes in wireless control technology; and AMobile, which delivers industrial mobile computers.
Microchip Technology signs definitive agreement to acquire Hailo July 29, 2026 The acquisition is expected to expand Microchip’s processing portfolio for intelligent edge systems and strengthen its ability to deliver accelerated, power-efficient edge AI solutions for robotics, advanced vision processing and intelligent edge applications.
FR 4 base materials: shortages, price increasing and allocations July 29, 2026 Why PCB procurement strategies should be reviewed?
Anglia sounds alarm bell on CEM/broker ‘cartel’ July 29, 2026 The issue centres on how blurred lines between manufacturing, distribution and open-market sourcing affect company governance. Anglia said it believes in forging strong, three-way supply chain partnerships between component manufacturer, the customer and the distributor.